• 센서학회지
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• 제30권3호
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• pp.170-174
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• 2021

As the rising attention to the medical and healthcare issue, Bio-MEMS (Micro electro mechanical systems) platform such as bio sensor, cell culture system, and microfluidics device has been studied extensively. Bio-MEMS platform mostly has high resolution structure made by biocompatible material such as polydimethylsiloxane (PDMS). In addition, three dimension structure has been applied to the bio-MEMS. Lithography can be used to fabricate complex structure by multiple process, however, non-rectangular cross section can be implemented by introducing optical apparatus to lithography technic. X-ray lithography can be used even for sub-micron scale. Here in, we demonstrated lines with round shape cross section using the tilted gold absorber which was deposited on the oblique structure as the X-ray mask. This structure was used as a mold for PDMS. Molded PDMS was applied to the cell culture platform. Moreover, molded PDMS was bonded to flat PDMS to utilize to the sub-micro channel. This work has potential to the large area bio-MEMS.

• 센서학회지
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• 제32권4호
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• pp.207-212
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• 2023

H₂S is a toxic and harmful gas, even at concentrations as low as hundreds of parts per million; thus, developing an H₂S sensor with excellent performance in terms of high response, good selectivity, and fast response time is important. In this study, an H₂S sensor with a high response and fast response time, consisting of a sensing material (SnO₂), an electrode, a temperature sensor, and a micro-heater, was developed using micro-electro-mechanical system technology. The developed H₂S sensor with a micro-heater (circular type) has excellent H₂S detection performance at low H₂S concentrations (0-10 ppm), with quick response time (<16 s) and recovery time (<65 s). Therefore, we expect that the developed H₂S sensor will be considered a promising candidate for protecting workers and the general population and for responding to tightened regulations.

• 한국전기전자재료학회논문지
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• 제33권5호
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• pp.350-354
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• 2020

In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

• 한국의학물리학회지:의학물리
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• 제24권1호
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• pp.61-67
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• 2013

본 연구팀은 호흡 훈련을 통해 호흡의 안정성과 재현성을 증대시킴으로써 환자 적용 범위를 넓히고자 미세전자기계시스템(micro-electro-mechanical system, MEMs) 가속도 센서를 이용한 새로운 호흡훈련시스템을 개발하고자 한다. 본 연구는 호흡동작 모니터링의 선형연구로 MEMS 센서의 성능평가를 Respiratory Gating Platform (RGP)을 이용하여 2.5, 3.0, 3.5 s/cycle의 속도와 4.0, 3.0, 2.0 cm을 진폭으로 하는 1차원 왕복운동에 대한 MEMS 가속도 센서의 순간중력가속도에 대한 반응을 측정하였고 이를 Varian RPM (real time patient monitoring system) 시스템과 비교하였다. RGP의 운동 주기에 대한 MEMS 가속도 센서의 주기 오차는 0.6~6.0%로 측정되었으며 RPM 시스템과 MEMS 가속도 센서에 대한 진폭 감도오차는 1%와 3.6~11.5%로 측정 되었다. 본 연구를 통하여 MEMS 가속도 센서에 대한 환자 호흡 훈련용으로서의 가능성을 확인할 수 있었다.

• 한국정보통신학회논문지
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• 제23권11호
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• pp.1364-1370
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• 2019

건축물이나 교량, 터널과 같은 구조물의 붕괴를 측정하기 위하여 기울기 센서를 사용하고 있으며 최근에는 사용성이 편리하고 가격이 저렴하여 MEMS(Micro-Electro-Mechanical System) 센서를 사용한 기울기 센서를 많이 사용하고 있으나 측정 범위가 한정되어 있어 360도 전 방위에 대해 고정밀도를 가지지는 못하고 있다. 이것은 MEMS 센서가 갖는 오프셋과 스케일 오차 때문이다. 본 논문에서는 MEMS 센서가 갖는 기계적 오차를 줄이기 위하여 정밀도가 높은 각도 계산을 위한 알고리즘을 제시하였고 MEMS 센서 모듈과 전송 모듈을 제작하여 교정 전 센서 모듈의 각도 정확도와 교정 후 각도 측정 정확도를 비교하여 교정 알고리즘의 효과를 제시하였으며, 실험 결과 제안 기술을 적용하였을 때 360도 전 방위에 대해 ±0.015도의 정밀도를 가짐을 확인하였다.

• Smart Structures and Systems
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• 제5권6호
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• pp.663-679
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• 2009

The use of Micro-Electro-Mechanical Systems (MEMS) accelerometers in geotechnical instrumentation is relatively new but on the rise. This paper describes a new MEMS-based system for in situ deformation and vibration monitoring. The system has been developed in an effort to combine recent advances in the miniaturization of sensors and electronics with an established wireless infrastructure for on-line geotechnical monitoring. The concept is based on triaxial MEMS accelerometer measurements of static acceleration (angles relative to gravity) and dynamic accelerations. The dynamic acceleration sensitivity range provides signals proportional to vibration during earthquakes or construction activities. This MEMS-based in-place inclinometer system utilizes the measurements to obtain three-dimensional (3D) ground acceleration and permanent deformation profiles up to a depth of one hundred meters. Each sensor array or group of arrays can be connected to a wireless earth station to enable real-time monitoring as well as remote sensor configuration. This paper provides a technical assessment of MEMS-based in-place inclinometer systems for geotechnical instrumentation applications by reviewing the sensor characteristics and providing small- and full-scale laboratory calibration tests. A description and validation of recorded field data from an instrumented unstable slope in California is also presented.

• 한국공작기계학회논문집
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• 제14권5호
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• pp.35-40
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• 2005

An experimental Investigation of the basic characteristics of a micro-cantilever sensor was performed by inspecting the amplitude and frequency characteristics of a commercial tuning fork (TF). Application of acetone and ethanol with a volume of $1{\mu}l$ on the tine of a vibrating tuning fork causes immediate response in its amplitude and frequency characteristics. It has been shown that the tuning fork has ability to recognize a chemical agent with high sensitivity. The theoretical sensitivity of mass loading is in the range of $\~0.1Hz/ng$. Quartz tuning forks are routinely made using standard microfabrication process, thus suggesting the possibility of microfabrication of micro quart sensors.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• 전기전자학회논문지
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• 제18권1호
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• pp.119-127
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• 2014

본 논문에서는 MEMS(Micro Electro Mechanical System) 가속도센서를 위한 CMOS readout 회로를 설계하였다. 설계된 CMOS readout 회로는 MEMS 가속도 센서, 커패시턴스-전압 변환기(CVC), 그리고 2차 스위치드 커패시터 ${\Sigma}{\Delta}$ 변조기로 구성된다. 이들 회로에는 저주파 잡음과 오프셋을 감소시키기 위한 correlated-double-sampling(CDS)와 chopper-stabilization(CHS) 기법이 적용되었다. 설계 결과 CVC는 150mV/g의 민감도와 0.15%의 비선형성을 갖는다. 설계된 ${\Sigma}{\Delta}$ 변조기는 입력전압 진폭이 100mV가 증가할 때, 출력의 듀티 싸이클은 10%씩 증가하며, 0.45%의 비선형성을 갖는다. 전체 회로의 민감도는 150mV/g이며, 전력소모는 5.6mW이다. 제안된 회로는 CMOS 0.35um 공정을 이용하여 설계하였고, 공급 전압은 3.3V이며, 동작 주파수는 2MHz이다. 설계된 칩의 크기는 PAD를 포함하여 $0.96mm{\times}0.85mm$이다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.