• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.131-132
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• 2012

• Transactions of Materials Processing
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• v.17 no.8
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• pp.649-656
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• 2008

Springback is one of factors affecting precision in metal forming. Its effect is particularly prominent in bending process. In this study, bending and forging process are used in order to manufacture a micro spring with two bending region from $60{\mu}m$ diameter wire. Springback in the process lowers the precision of the micro spring. Overbending for springback compensation has wide usage in a general way. However, this method requires repeated modifications of press dies until the tolerance is allowable, which causes that production cost and time increase. In this paper, we analyzed the mechanism of springback in the forming process of the micro spring using finite element method. In addition, a simple method to control springback without modifying dies was proposed by performing numerical analysis with various parameters.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.509-510
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• 2012

• Journal of Industrial Technology
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• v.26 no.B
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• pp.35-41
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• 2006

Recently, as ultrasonic medical devices are gradually developed, many of those requires smaller and more precision coaxial cables in probe. So, the use of micro coaxial cable becomes an efficient solution for ultrasonic machine. However, there are many difficulties in stripping micro coaxial cable by traditional mechanical process. In this paper, we use the Nd-YAG laser for the efficient stripping of conduct wire of cable. We propose a new method to strip the shield wire of micro coaxial cable. Through some experiments, we found that there is a new possibility in the proposed method. Also, in order to enhance the performance, we propose a preprocess of the cable before stripping.

• Journal of Industrial Technology
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• v.24 no.A
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• pp.17-22
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• 2004

In the study, we have developed a straightening system for 304 micro wires that are normally used in the medical and semi-conductor fields. To apply heat to the micro wires, we introduced the direct wire heating method which generates the thermal energy by the electrical resistance of the wire itself. To avoid the deterioration of the wire surface by the environment, such as the oxidation or the hydration, the $N_2$ gas was filled in the glass pipe in which the straightening process was being performed. A precision tension meter was also attached to control the tension of the wire during the heating and straightening process. In order to control the straightening process, several experimental investigations with varying the tension, the feeding velocity and the temperature (current) was carried out. As a result of experiments, we obtained the optimal processing conditions satisfying the straightness requirement of the micro wires.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.715-716
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• 2007

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.250-253
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• 2001

Mechanical properties of gold bonding wire for VLSI packaging have been studied. The diameters of gold wires are about 20-30 micrometer and fracture loads are 8-20 gram force. The elastic modulus, yield strength, fracture strength and elongation properties have been evaluated by micro-tensile test method. This work discusses for an appropriate selection of micro-force testing system and grip design in mim testing. The best method to determine gauge length of wire and to measure tensile properties has been proposed. The mechanical properties such as strength and elastic modulus of current gold bonding wire are higher than pure those of gold wire.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.6 s.183
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• pp.52-56
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• 2006

Punching tools like an electrodes are made by milling or etching or EDM. These methods had time consuming, low efficiency and air pollution. So, we have developed a shearing device which counter punching method for burrless cutting of micro wire. Using the straightened SUS304 wire with $200{\mu}m$ diameter, we confirmed the tendency of the shear plane for punch tools. It was impossible to completely remove the bun in the shearing process. In order to minimize the burr size and fine shear plane, we have accomplished the various experiment conditions such as the U-groove, the effect of the counter punch, shear angle and clearance. The results of the experiments show that indentation, slip plane and bent shape were related to the shear angle and clearance.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.1003-1007
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• 2002

Micro-EDM is generally used far machining micro 3-D structure. For micro-EDM, first of all, micro-electrode fabrication is needed and WEDG system is proposed for tool electrode fabrication method. When tool electrode is fabricated using WEDG system, its characteristics are under the control of many EDM parameters. Also relations between the parameters affect electrode fabrication. In this study, experiments are carried out to analyze effects of EDM parameters on micro-electrode fabrication. Experimental method and analysis are used to experimental design method. Factors used in experiments are composed of applied voltage, capacitance, wire feed rate, spindle rotating speed, machining time. As a result of experiments, wire feed rate, machining time and capacitance is proportional to gap distance(material removal), the other parameters(applied voltage, spindle rotating speed) and relations between the parameters have little influence on machining.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.27-28
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• 2010