• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.160-163
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• 2002

Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.101-106
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• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.6
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• pp.421-425
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• 2016

Micro-EDM is one of the recent fine-machining technologies. Micro-EDM is widely used in precision processes because products manufactured via EDM are free from workpiece hardness. However, the debris produced during the process cause many problems such as reduced precision of the process. The first solution of this problem involves using the milling hole process. Micro-EDM hole process involves an electrode moving rapidly in the vertical direction via a servo system to disperse debris. However, this process can cause reduced work efficiency owing to contact between the electrode and workpiece. In this study, ultrasonic vibration is added to micro-EDM channel machining. Ultrasonic vibration removes the debris during machining and enables precision machining. Consequently, a clean work environment for the subsequent processes is maintained.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1069-1070
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• 2013

• 전기의세계
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• v.50 no.5
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• pp.16-21
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• 2001

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.149-156
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• 2017

Graphene nanoplatelet (GNP)-reinforced alumina ($Al_2O_3$) is a promising material for micro-partapplications, particularly micro-nozzle shapes, because of its excellent wearresistance. In this study, a $Al_2O_3$/GNPcomposite with 15 vol% graphene nanoplatelets (GNP) was highly densified and fabricated via spark plasma sintering for micro-electrical discharge drilling (Micro-ED drilling) and the wear resistance property of the composite is evaluated via the ball-on-disk method. In addition, the diameter and shape of the micro-electrodes machined by wire electrical discharge grinding (WEDG), block electrical discharge grinding (BEDG), and new linear block moving electrical discharge grinding (LBMEDG) methods are systematically compared and analyzed to observe the micro-hole machining in the micro-ED drilling of the $Al_2O_3$/15vol% GNP composite.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.