• 제목/요약/키워드: Micro thermal device

검색결과 100건 처리시간 0.029초

탄소/고분자 복합재료의 극저온-고온 싸이클링 (CRYOGENIC AND ELEVATED TEMPERATURE CYCLING OF CARBON/POLYMER COMPOSITES)

  • Yeh, Byung-Hahn;Won, Yong-Gu
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2002년도 추계학술발표대회 논문집
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    • pp.38-42
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    • 2002
  • An apparatus was developed to repetitively apply a $-196^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen ($LN_2$) 400 times. Ply-by-ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at $120^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies fellowed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5%.

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왕복선 연료탱크 적용을 위한 탄소/고분자 복합재료의 극저온-고온 싸이클링 (CRYOGENIC AND ELEVATED TEMPERATURE CYCLING OF CARBON / POLYMER COMPOSITES FOR RESUABLE LAUNCH VEHICLE CRYOGENIC TANKS)

  • 예병한;원용구
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2003년도 제20회 춘계학술대회 논문집
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    • pp.151-155
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    • 2003
  • An apparatus was developed to repetitively apply a -196 $^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen (L$N_2$) 400 times. Ply-by-Ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at 120 $^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies followed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5 %.

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고온 확산공정에 따른 산화막의 전기적 특성 (Electrical Characteristics of Oxide Layer Due to High Temperature Diffusion Process)

  • 홍능표;홍진웅
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제52권10호
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    • pp.451-457
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    • 2003
  • The silicon wafer is stable status at room temperature, but it is weak at high temperatures which is necessary for it to be fabricated into a power semiconductor device. During thermal diffusion processing, a high temperature produces a variety thermal stress to the wafer, resulting in device failure mode which can cause unwanted oxide charge or some defect. This disrupts the silicon crystal structure and permanently degrades the electrical and physical characteristics of the wafer. In this paper, the electrical characteristics of a single oxide layer due to high temperature diffusion process, wafer resistivity and thickness of polyback was researched. The oxide quality was examined through capacitance-voltage characteristics, defect density and BMD(Bulk Micro Defect) density. It will describe the capacitance-voltage characteristics of the single oxide layer by semiconductor process and device simulation.

열적발산원리를 이용한 마이크로 추진장치에 대한 연구 (Study of Micro Propulsion System Based on Thermal Transpiration)

  • 정성철;신강창;김연호;김혜환;이용우;허환일
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2007년도 제28회 춘계학술대회논문집
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    • pp.25-29
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    • 2007
  • 마이크로 인공위성의 자세제어를 위한 마이크로 추진장치에 대한 연구는 대부분 기존의 추진장치를 소형화하는 방향으로 진행되고 있다. 본 연구에서는 이러한 미소추력 발생을 위한 노즐의 소형화로 인한 점성손실, 배압에 의한 손실 등을 대기압실험, 진공환경실험, CFD 해석을 통하여 검증하였다. 또한 마이크로 노즐에서의 유동 손실을 극복하기 위한 방법으로 열적발산원리에 대해 이론적 접근을 시도하였다. 마이크로 추진장치에 적용을 위한 열적발산원리는 움직이는 부품 없이 오직 온도 구배만으로 유동을 제어할 수 있기 때문에 추진장치의 소형화로 야기되는 손실을 극복할 수 있을 것으로 기대된다.

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전기 저항법을 이용한 Micro Particle Counter Micro Fluidic Device 개발

  • 이준;윤덕원;채호철;한창수
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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    • pp.134-138
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    • 2005
  • Recently many researches related with biotechnology are processed and it is the situation that research about micro fluidic devices is active. Micro fluidic devices has been one of the most widely used devices for the analysis in biotechnology because they have many advantages, flexibility, transparency, thermal and electrical stability, nontoxic, etc. In this study, micro fluidic device with PDMS is developed for particle counter which separates a small quantity of particles, The principle of micro particle counter is electrical-impedance method, and it was also applied hydrodynamic flow focusing. It is more efficient method to analyzing particles furthermore it can be applied to cell count ins for biotechnology.

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멤스 기술을 이용한 대변형 바이모프 구동기 (Large Displacement Bimorph Actuator Using MEMS Technology)

  • 정원규;최석문;김용준
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.1286-1289
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    • 2004
  • A new thermal bimorph actuator for large out-of-plane displacement is designed, fabricated and tested. The deflecting beam is composed of polyimide, heater, and polyvinyl difluorides with tetrafluoroethylene(PVDF-TrFE). The large difference of coefficient of thermal expansion(CTE) of two polymer layers (polyimide and PVDF-TrFE) can generate a large deflection with relatively small temperature rising. Compared to the most conventional micro actuators based on MEMS(micro-electro mechanical system) technology, a large displacement, over 1 mm at 20 mW, could be achieved. The proposed actuator can find applications where a large vertical displacement is needed while keeping compact overall device size, such as a micro zooming lens.

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미립잠열슬러리의 물성에 관한 실험적 연구 (Physical Properties of Microencapsulated Phase Change Material Slurries)

  • 이효진;홍재창;이재구
    • 설비공학논문집
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    • 제12권9호
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    • pp.860-869
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    • 2000
  • The thermal conductivity and density of slurries entrained with the particles of Micro-PCM are measured with respect to its temperatures as well as concentrations. For the thermal conductivity of slurries, a device made from P.A. Hilton (Model No. H470) is adopted. There is a well-scaled 0.3 mm gap between shells into which the slurry is injected. The temperatures of the slurry are changed to $5~25^{\circ}C$ , for which it is controled by the supplied voltage and cooling water circulated around the outer shell. The concentrations of Micro-PCM slurries are varied from 5 wt% to 50 wt%. Some general equations such as Maxwell's equation, are evaluated for their applicability with Micro-PCM slurry. As a result, it happens to be some 20% discrepancy between the experiment and the applied equations. The density measurements of Micro-PCM slurry to its temperature and concentration are peformed by hydrometer. For the experiment, tetradecane encapsulated slurry (($t_m≒6^{\circ}C$) and a mixed wax ($t_m≒50^{\circ}C$) are tested. The temperature changes of tetradecane are applied for $0^{\circ}C\;to\;$20^{\circ}C$and a mixed wax for $20^{\circ}C\;to\;$60^{\circ}C$ and its concentrations are changed from 5 wt% to 30 wt%. The results are compared with a general equation and the referenced data. For the conclusion, the experimental result and a general equation are well agreed.

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마이크로 추진장치에 적용을 위한 누센수에 따른 열적발산원리의 효율분석 (Efficiency Analysis of Thermal Transpiration According to Knudsen Number for Application to Micro-propulsion System)

  • 정성철;허환일
    • 한국항공우주학회지
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    • 제36권5호
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    • pp.483-490
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    • 2008
  • 마이크로 추진장치에서 노즐의 소형화는 많은 유동손실을 유발한다. 이러한 유동손실을 극복하기 위해 본 연구에서는 열적발산원리를 이용한 마이크로 추진장치에 대한 기초연구를 진행하였다. 움직이는 부품 없이 오직 온도구배만으로 추진제를 낮은 온도에서 높은 온도로 자체 펌핑이 가능한 열적발산장치를 설계, 제작 하였으며, 진공환경에서 누센수에 따른 맴브레인 압력구배효율을 분석하였다. 실험결과 천이영역에서는 두꺼운 맴브레인의 효율이 다소 높았으며, 자유분자영역에서는 두께에 관계없이 최대 압력구배 효율이 82%까지 증가하는 것을 확인할 수 있었다.

열경화성 잉크 에폭시의 두께 변화에 따른 마이크로 퓨즈 용단의 최적 조건 (Optimum Condition of Micro Fuse Fusing as a Function Changed Thickness of Thermosetting Ink Epoxy)

  • 김도경;황능환;길태홍;이수화;서대만;김민호;김종식
    • 한국전기전자재료학회논문지
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    • 제27권10호
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    • pp.623-629
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    • 2014
  • For the semiconductor device safety from over current in the digital electronic circuit system must be surely designed that it's surface mount type micro fuse device. In this paper, We has analysed to the fusing character of micro fuse as a function changed thickness of thermosetting ink epoxy. To the change of thermosetting ink epoxy thickness with in production lot, in the electrically character (fusing test in the 2 multiple over current and 10 multiple over current, surface temperature test in the 1.25 multiple over current) of micro fuse has been tested. According to the electrically character result, changed thickness of thermosetting ink epoxy in designed micro fuse withheld direct effect in both end resistance changes. Also, because high thermal energy in the micro fuse test of over current was occurred to effect such as thermal runaway and explosion. Therefore, screen printing process in the design of micro fuse using thermosetting ink epoxy is very important for production quality improvement.