• 대한전자공학회논문지SD
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• 제45권5호
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• pp.58-64
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• 2008

CMOS $0.18{\mu}m$ 공정을 이용하여 1.8V supply voltage에서 6Gbps 이상의 처리속도를 가지는 1:2 demultiplexer(DEMUX)를 구현하였다. 높은 동작속도를 위하여 Current mode logic(CML)의 Flipflop을 사용하였으며 추가적인 동작속도 향상을 위하여 On-chip micro stacked spiral inductor($10{\times}10{\mu}m^2$)를 사용하였다. 총 12개의 인덕터를 사용하여 $1200{\mu}m^2$의 면적증가만으로 Inductive peaking의 효과를 나타낼 수 있었다. Chip의 측정은 wafer상태로 진행하였고 Micro stacked spiral inductor가 있는 1:2 demultiplexer와 그것이 없는 1:2 demultiplexer를 비교하여 측정하였다. 6Gbps에서 측정결과 Micro stacked spiral inductor를 1:2 demultiplexer가 inductor를 사용하지 않은 구조보다 Eye width가 약3%정도 증가하였고 또한 Jitter가 43%정도 감소하여 개선효과가 있음을 확인하였다. 소비전력은 76.8mW, 6Gbps에서의 Eye height는 180mV로 측정되었다.

• 마이크로전자및패키징학회지
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• 제15권1호
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.