• Journal of the Korean Society of Industry Convergence
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• v.26 no.4_1
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• pp.517-527
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• 2023

Many techniques have been proposed and investigated for microlens array manufacturing in three-dimensional (3D) structures. We present fabricating a microlens array using selective laser etching and a CO₂ laser. The femtosecond laser was employed to produce multiple micro-cracks that comprise the predesigned 3D structure. Subsequently, the wet etching process with a KOH solution was used to produce the primary microlens array structures. To polish the nonoptical surface to the optical surface, we performed reflow postprocessing using a CO₂ laser. We confirmed that the micro lens array can be manufactured in three primary shapes (cone, pyramid and hemisphere). Compared to our previous study, the processing time required for laser processing was reduced from approximately 1 hour to less than 30 seconds using the proposed processing method. Therefore, micro lens arrays can be manufactured using our processing method and can be applied to mass productionon large surface areas.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.779-784
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• 2011

This study was carried out on the crack healing of three types of SiC ceramics based on a $SiO_2$ additive, taking into account the roughness of the polishing plate used for polishing the specimens. The mixtures were subsequently hot-pressed in $N_2$ gas for one hour under 35 MPa at 2053 K. In these specimens, the optimized crack-healing condition was 1373 K for one hour in air. The crack-healing material of the cracked part was the glassy phase of $SiO_2$ that was formed by the oxidation of SiC. In the optimum healing condition, the bending strength of non-polished SiC ceramics was not completely recovered. However, the bending strength of the SAY specimen was excellent, considering the economic aspects of SAY, SAYS-1, and SAYS-2. The SAY specimen is definitely superior to the others after an hour of heat treatment. There was a decrease in the number and size of defects in the specimen polished by using a $125-{\mu}m$ polishing plate; however, the micro-surface defects were not completely repaired. The specimen polished by using a 40-${\mu}m$ polishing plate showed little voids or surface defects after an hour of heat treatment. The bending strength of the specimen mirror-polished by using a 6-${\mu}m$ polishing plate was completely recovered.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.5
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• pp.149-158
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• 2002

Recently, the minimum line width shows a tendency to decrease and the multi-level increases in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. However there are several defects in CMF, such as micro-scratches, abrasive contaminations and non-uniformity of polished wafer edges. Wet etching process including spin-etching can eliminate the defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(Interlayer-Dielectric) was removed by CMP and wet etching process using DHF(Diluted HF) in order to investigate the possibility of planrization by wet etching mechanism. In the thin film wafer, the results were evaluated from the viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And the pattern step heights were also compared for the purpose of planarity characterization of the patterned wafer. Moreover, Chemical polishing process which is the wet etching process with mechanical energy was introduced and evaluated for examining the characteristics of planarization.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.93-96
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• 2003

Recently, various bulk metallic glasses (BMG's) haying good mechanical and chemical properties were developed. BMG's can easily be deformed in the supercooled liquid region, via viscous flow mechanism. In our previous work, we evaluated the deformation behavior and some other basic properties of Z $r_{41.2}$ $Ti_{13.8}$C $u_{12.5}$N $i_{10}$B $e_{22.5}$ alloy. In this study, we investigated the micro forming of Z $r_{41.2}$ $Ti_{13.8}$C $u_{12.5}$N $i_{10}$B $e_{22.5}$ alloy. The process condition was chosen based on the viscosity data from TMA, and superalloy and Si wafer with micro patterns on the surface were used as forming die. The alloy showed good replication of the patterns. However, some stripe patterns, resembling scratches, appeared on the deformed alloy surface. These scratches can be reduced or eliminated by polishing before forming.ing.ore forming.ing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.95-96
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• 2006

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.48-53
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• 1998

In this paper, the new electrochemical machining method is proposed for the micro unit fabrication by using the point electrode tools. The precision shape control capacity is improved by using the point electrode method. It was observed that an electric discharge phenomenon occurs during the electrochemical machining process by using the spraying and torrent type electrolyte supply method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.703-703
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• 2001

• Transactions of the Korean Society of Mechanical Engineers
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• v.5 no.4
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• pp.338-346
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• 1981

Honing, lapping, polishing and superfinishing are applied for a precision machining to finish the metal surface, but these precision machining are micro-cutting by hard and micro-abrasive grains. Frictional machining is the new method to finish mirrorlike surface without using those abrasive grains. The frictional machining produces high pressure and high temperature instantly by compressing a tool material against the metal surface in sliding motion. The metal surface is given plastic deformation and plastic flow by the above mentioned frictional motion, but the surface roughness of the metal surface is influenced by physical and chemical reaction in surrounding atmosphere. Therefore, the atmosphere around the metal optimum atmosphere in the frictional machining. The part 1 of the study was performed in liquid atmospheres. Diesel oil, lubricant, grease, lard oil, bean oil and cutting fluid were used as such atmospheres. Medium carbon steel SM 50 C was used as a workpiece and ceramic tip was applied as a frictional tool. The result of the experiment showed characteristic machining conditions to generate the best surface roughness in each atmospheres.

• 한국기계연구소 소보
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• s.18
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• pp.67-74
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• 1988

The force sensor is essentially required in controlling robot manipulator in such applications as precise assembly of mechanical parts, deburring and polishing and various kinds of 6-axis force sensors are developed for these application. This paper presents the algorithm of horizontal assembly of circular cross-sectional workpiece using 3-axis force sensor and procedure to develop the sensor. The sensor is calibrated and tested using AID converter and 16 bit micro computer. The result is $\pm$0.03% FS of zero stability, 0.1%FS of linearity and $\pm$0.05% FS of resolution. The sensor will be used in the research of robot application such as assembly and deburring interfaced with micro computer based robot controller which is under development at the robotics lab.