• Title/Summary/Keyword: Micro force measurement

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An Experimental Study on the Dynamic Load Characteristics of Surface Mount Device(SMD) (칩마운트 (SMD) 장비의 동하중(動荷重) 발생특성에 관한 실험적 연구)

  • Baek, Jae-Ho;Lee, Hong-Ki;Kim, Kang-Boo
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2000.06a
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    • pp.1913-1917
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    • 2000
  • SMD Equipment convey an electronic parts at high speed, then assemble parts into a circuit board, and it develop a long time-duration dynamic force to be caused by moving mass. Vibration problem to be caused by SMD Equipment have an effect on micro-meter level's precision production process, directly, and dynamic stability of building. In the cause of quantitatively access about its vibration problem, input information(or data) of structure dynamic analysis need accuracy information of dynamic load. Determination of Dynamic load is various kinds of method using experimental and theory. In this paper, we got dynamic load using direct measurement method. We expect that an study on the dynamic load characteristic of SMD can be used to Equipment development of low level vibration and basis information of structure dynamic analysis.

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Precision Displacement Measurement Using Astigmatism (비점수차법을 이용한 초정밀변위측정법 연구)

  • Lee, Sang-Heon;Jung, Kwang-Suk
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.7
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    • pp.87-94
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    • 2008
  • The displacement sensor using optical pickup head is presented. The measuring principle of optical pickup head in focusing direction is adopted to measure displacement. The preliminary tests were carried out to verify the feasibility of the optical pickup head as a displacement sensor and optical pickup head showed about $8\;{\mu}m$ measuring range and 10nm resolution. The methodology to expand measuring range is proposed and proved its validity. The proposed displacement sensors are applied to AFM(Atomic Force Microscope) probe head to measure the deflection of micro-cantilever.

Mechanical Property Measurement in Nano Imprint Process (나노 임프린트 공정에서의 기계적 물성 측정)

  • 김재현;이학주;최병익;강재윤;오충석
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.6
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    • pp.7-14
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    • 2004
  • 나노 임프린트 기술은 기존의 광학적 리소그라피 (optical lithography) 기술보다 저렴한 비용으로 나노 구조물을 대량으로 제조할 수 있을 것으로 기대되고 있는 기술이다. 현재까지 반도체 공정기술의 주류를 이루고 있는 광학적인 리소그라피 기술은, 100nm이상의 CD(Critical Dimension)를 가지는 구조물들을 정밀하게 제조하여, 미소전자공학 (microelectronics) 소자, MEMS/MEMS, 광학소자 등의 제품들을 대량으로 생산하는 데에 널리 활용되고 있다. 반도체 소자의 고집적화 경향에 따라 100 nm 이하의 CD를 가지는 나노 구조물들을 제조할 필요성이 높아지고 있지만, 광학적인 방법으로는 광원의 파장보다 작은 구조물들을 제조하기가 어렵다. 보다 짧은 파장을 가지는 광원을 이용하는 리소그라피 장비가 계속적으로 개발되고 있으나, 그에 따른 장비 비용 및 제조 단가가 기하급수적으로 증가하고 있다.(중략)

The Inclination Characteristics of PSC BOX in FCM Bridge Construction Method (FCM 교량 가설 공법에서 주두부의 기울음 특성)

  • Hyun-Euk Kang;Wan-Shin Park;Young-Il Jang;Sun-Woo Kim;Hyun-Do Yun
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.27 no.3
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    • pp.12-20
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    • 2023
  • This study presents basic data on how to secure stability by analyzing the change in tensile force of steel rod and the inclination characteristics of PSC BOX in the "Temporary fixation system using internal prestressing tendon", which is mainly applied to construction of superstructures by FCM. To date, it has been difficult to confirm the changes in tension force of the steel rod and the inclination of the PSC BOX because the steel rod was installed vertically inside the pier and the PSC BOX. Therefore, measurement of the change in length of the steel rod and the displacement of PSC BOX were performed using a micro-measured FBG sensor. Comparisons of the calculated tensile force and the residual tensile force of the steel rod revealed that the safety factor decreased in all bridges. The cause was mainly identified to be the loss of tensile force in fixation~1segment, and countermeasures are suggested. The analysis of the inclination characteristics showed that the inclination increased with the segment progresses even in bridges with sufficient safety factor, and the difference before and after the segment was confirmed. In addition, the increase in inclination was related to the loss of tension force in the steel rod, and the stress on the opposite sides of the inclination was further reduced. It is believed that upward tensile force is generated in the steel rod on the opposite side of the inclined side due to the unbalanced moment, causing the difference in stress of the steel rod between the two sides.

A Study on the Design of a Gear Transmission Error Test Rig (기어 전달오차 측정 장비의 설계에 관한 연구)

  • Zhang, Qi;Zhang, Jing;Yan, Hou-Ling;Zhu, Qing-Wang;Xu, Zhe-zhu;Lyu, Sung-Ki
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.1
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    • pp.14-19
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    • 2016
  • Transmission error (TE) is the most important cause of gear noise and vibration because TEs affect the changes of the force and the speed of gears. TE is usually expressed as an angular deviation, or a linear deviation measured at the pitch point and calculated at successive positions of the pinion as it goes through the meshing cycle. Accurate measurement of TE for gear transmission will provide a reasonable basis for gear design, manufacturing processes and quality control. Therefore, in order to study the accuracy of the gear transmission, stability, TE, vibration and noise after gear micro-geometry modification, a gear transmission test rig is proposed in this paper, which is based on the existing technical conditions, by using reasonable testing methods, hardware and a signal processing method. All of the details and the experience can be taken into consideration in the next upgraded test rig.

Properties of the Dye Sensitized Solar Cell with Localized Surface Plasmon Resonance Inducing Au Nano Thin Films

  • Noh, Yunyoung;Kim, Kwangbae;Choi, Minkyoung;Song, Ohsung
    • Korean Journal of Materials Research
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    • v.26 no.8
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    • pp.417-421
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    • 2016
  • We improve the energy conversion efficiency (ECE) of a dye sensitized solar cell (DSSC) by preparing a working electrode (WE) with localized surface plasmon resonance (LSPR) by inducing Au thin films with thickness of 0.0 to 5.0 nm, deposited via sputtering. Field emission scanning electron microscopy and atomic force microscopy were used to characterize the microstructure of the blocking layer (BL) of the Au thin films. Micro-Raman measurement was employed to confirm the LSPR effect, and a solar simulator and potentiostat were used to evaluate the photovoltaic properties, including the impedance and the I-V of the DSSC of the Au thin films. The results of the microstructural analysis confirmed that nano-sized Au agglomerates were present at certain thicknesses. The photovoltaic results show that the ECE reached a value of 5.34% with a 1-nm thick-Au thin film compared to the value of 5.15 % without the Au thin film. This improvement was a result of the increase in the LSPR of the $TiO_2$ layer that resulted from the Au thin film coating. Our results imply that the ECE of a DSSC may be improved by coating with a proper thickness of Au thin film on the BL.

Measurement of Adhesion Strength for Ceramic Sheet (세라믹 박판의 접착 강도 측정)

  • Huh, Y.H.;Kim, D.I.;Kim, D.J.;Lee, K.;Kim, D.
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1798-1802
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    • 2007
  • Adhesion strength of single layer ceramic capacitor sheet was measured using a peel testing system developed in this study. The peel test specimens with various dimensions were prepared from the ceramic sheet cast on the PET film. In peel test, the sheet specimen was adhered on the glass jig floating on the liquid media, which was designed to minimize the friction, and the specimen was then pulled up by micro-actuator. During the separation of the sheet from the PET film, peel force was measured. To normalize the testing condition, 3 different widths of the specimen were selected: 5, 10 and 20 mm. was used Furthermore, testing speed effect was investigated in this study. From the resullts using various testing conditions, the standard method for the peel strength testing may be suggested. Based on the testing condition, effect of peel angle on the strength was experimentally examined. It was found that the adhesive strength for the ceramic sheet is nearly identical, irrespective of the specimen width ranged from 5 to 20 mm, while the adhesive strength was increased with increasing testing speed. Furthermore, the strength was shown to be dependent on the peel angle.

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Electrostatic 2-axis MEMS Stage with a Large Area Platform for Probe-based Storage Devices (대면적 플랫폼을 갖는 Probe-based Storage Device(PSD)용 정전형 2축 MEMS 스테이지)

  • Chung, Il-Jin;Jeon, Jong-Up
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.9 s.186
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    • pp.179-189
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    • 2006
  • Recently the electrostatic 2-axis MEMS stages have been fabricated f3r the purpose of an application to PSD (Probe-based Storage Device). However, all of the components (platform, comb electrodes, springs, anchors, etc.) in those stages are placed in-plane so that they have low areal efficiencies such as a few percentage, which is undesirable as data storage devices. In this paper, we present a novel structure of an electrostatic 2-axis MEMS stage that is characterized by having a large areal efficiency of about 25%. For obtaining large area efficiency, the actuator part consisting of mainly comb electrodes and springs is placed right below the platform. The structure and operational principle of the MEMS stage are described, followed by a design and analysis, the fabrication and measurement results. Experimental results show that the driving ranges of the fabricated stage along the x and y axis were 27$\mu$m, 38$\mu$m at the supplied voltages of 65V, 70V, respectively and the natural frequencies along x and y axis were 180Hz, 310Hz, respectively. The total size of the stage is about 5.9$\times$6.8mm$^2$ and the platform size is about 2.7$\times$3.6mm$^2$.

A Study on properties of Lower Electrode thin films solar cell for Mo thin film (박막태양전지 하부전극용 Mo 박막특성 연구)

  • Yang, Hyeon-Hun;Kim, Young-Jun;Jeong, Woon-Jo;Park, Gye-Choon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.321-322
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    • 2007
  • In order to increase the cost effectiveness of solar cells, module production should be treated more comprehensively. Back contact cells offer distinct advantage in the interconnection of cells to modules. Thereby Mo thin film were prepared in order to clarify optimum conditions for growth of the thin film depending upon process, and then by changing a number of deposition conditions and substrate temperature conditions variously, structural and electrical characteristics were measured. For the manufacture of the Mo were vapor-deposited in the named order. Among them, Mo were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC power was controlled so that the composition of Mo, while the surface temperature having an effect on the quality of the thin film was changed from R.T$[^{\circ}C]$ to $200[^{\circ}C]$ at intervals of $50[^{\circ}C]$. Micro-structural studies were carried out by XRD (D/MAX-1200, Rigaku Co.) and SEM (JSM-5400, Jeol Co.). Electrical properties were measured by CMT-SR3000 Measurement System.

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ELECTRO-MICROSCOPE BASED 3D PLANT CELL IMAGE PROCESSING METHOD

  • Lee, Choong-Ho;Umeda Mikio;Takesi Sugimoto
    • Proceedings of the Korean Society for Agricultural Machinery Conference
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    • 2000.11b
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    • pp.227-235
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    • 2000
  • Agricultural products are easily deformable its shape because of some external forces. However, these force behavior is difficult to measure quantitatively. Until now, many researches on the mechanical property was performed with various methods such as material testing, chemical analysis and non-destructive methods. In order to investigate force behavior on the cellular unit of agricultural products, electro-microscope based 3D image processing method will contribute to analysis of plant cells behavior. Before image measurement of plant cells, plant sample was cut off cross-sectioned area in a size of almost 300-400 ${\mu}$ m units using the micron thickness device, and some of preprocessing procedure was performed with fixing and dyeing. However, the wall structure of plant cell is closely neighbor each other, it is necessary to separate its boundary pixel. Therefore, image merging and shrinking algorithm was adopted to avoid disconnection. After then, boundary pixel was traced through thinning algorithm. Each image from the electro-microscope has a information of x,y position and its height along the z axis cross sectioned image plane. 3D image was constructed using the continuous image combination. Major feature was acquired from a fault image and measured area, thickness of cell wall, shape and unit cell volume. The shape of plant cell was consist of multiple facet shape. Through this measured information, it is possible to construct for structure shape of unit plant cell. This micro unit image processing techniques will contribute to the filed of agricultural mechanical property and will use to construct unit cell model of each agricultural products and information of boundary will use for finite element analysis on unit cell image.

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