• Title/Summary/Keyword: Micro force measurement

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The Measurement Errors of Elastic Modulus and Hardness due to the Different Indentation Speed (압입속도의 변화에 따른 탄성계수와 경도의 오차 연구)

  • Lee, Kyu-Young;Lee, Chan-Bin;Kim, Soo-In;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.19 no.5
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    • pp.360-364
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    • 2010
  • Most research groups used two analysis methods (spectroscopy and nanotribology) to measure the mechanical properties of nano-materials: NMR (Nuclear Magnetic Resonance), IR (Infrared Spectroscopy), Raman Spectroscopy as the spectroscopy method and AFM (Atomic Force MicroScope), EFM (Electrostatic Force Microscope), KFM (Kelvin Force Microscope), Nanoindenter as the nanotribological one. Among these, the nano-indentation technique particularly has been recognized as a powerful method to measure the elastic modulus and the hardness. However, this technique are prone to considerable measurement errors with pressure conditions during measurement. In this paper, we measured the change of elastic modulus and hardness of an Al single crystal with the change of load, hold, and unload time, respectively. We found that elastic modulus and hardness significantly depend on load, hold, and unload time, etc. As the indent time was shortened, the elastic modulus value decreased while the hardness value increased. In addition, we found that elastic modulus value was more sensitive to indent load, hold, and unload time than the hardness value. We speculate that measurement errors of the elastic modulus and the hardness originate from the residual stress during indenting test. From our results, the elastic modulus was more susceptible to the residual stress than the hardness. Thus, we find that the residual stress should be controlled for the minimum measurement errors during the indenting test.

Measurement of mechanical properties of SU-8 thin film by tensile testing (단축 인장에 의한 SU-8박막의 기계적 물성 측정)

  • 백동천;박태상;이순복;이낙규
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.2
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    • pp.23-26
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    • 2004
  • Thin film is one of the most general structures used in micro-electro-mechanical systems (MEMS). To measure the mechanical properties of SU-8 film, tensile testing was adopted which offers not only elastic modulus but also yield strength and plastic deformation by load-displacement curve. Tensile testing system was constructed with linear guided servo motor for actuation, load cell for force measurement and dual microscope for strain measurement.

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Study on super-hydrophobic electro-spray micro thruster and measurement of micro scale thrust (초소수성 전기 분무 마이크로 추진 장치 및 마이크로 추력 측정)

  • Lee, Young-Jong;Yoo, Yong-Hoon;Tran, Si Bui Quang;Kim, Sang-Hoon;Park, Bae-Ho;Buyn, Do-Young
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.37 no.2
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    • pp.175-180
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    • 2009
  • In this article, we fabricated polytetrafluoroethylene(PTFE) nozzle treated by ion beam, in order to fabricate polymer based electrospray micro thruster with super hydrophobic nozzle. To obtain the super hydrophobic surface, PTFE surface is treated by argon and oxygen plasma treatment process. The optimal condition is investigated argon and oxygen flow rate as well as the paalied energy level for the treatment process. Fabricated nozzle was evaluated by measuring contact angle, and the surface morphology was examined by using scanning electron microscope(SEM) and atomic force microscope(AFM). We observe that jetting becomes more stable and repeatable on the treated nozzle. And to evaluate performance of fabricated nozzle, we measure micro scale thrust using a cantilever and a nozzle treated by ion beam laser displacement sensor.

Dynamic Characteristics Measurement of Micro Mirror for Image Display (화상처리용 마이크로 미러의 동특성 측정기술)

  • 이은호;김규로
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.371-376
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    • 1997
  • A 100*100.mu.m$^{2}$ aluminum micro mirror is designed and fabricated using a thick photoresist as a sacrificial layer andas a mold for nickel electroplating. The micro mirror is composed of aluminum mirror plate, two nickel support posts, two aluminum hinges, two address eletrodes, and two landing electrodes. The aluminum mirror plate,which is supported by two nickel support posts, is overhung about 10.mu.m from the silicon substrate. THe aluminum mirror plate is actuated like a seesaw by electrostatic force generated by electic potential difference applied between the mirror plate and the address electrode. This paper presents some methods to measure the optical and the dynamic characteristics of the fabricated micro mirror.

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Review of Micro/Nano Nondestructive Evaluation Technique (II): Measurement of Acoustic Properties (마이크로/나노 비파괴평가 기술(II): 음향특성계측)

  • Kim, Chung-Seok;Park, Ik-Keun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.32 no.4
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    • pp.418-430
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    • 2012
  • The present paper reviews the micro and nano nondestructive evaluation(NDE) technique that is possible to investigate the surface and measure the acoustic properties. The technical theory, features and applications of the ultrasonic atomic force microscopy(UAFM) and scanning acoustic microscopy(SAM) are illustrated. Especially, these technologies are possible to evaluate the mechanical properties in micro/nano structure and surface through the measurement of acoustic properties in addition to the observation of surface and subsurface. Consequently, it is thought that technique developments and applications of these micro/nano NDE in advanced industrial parts together with present nondestructive industry are widely possible hereafter.

Precision measurement of a laser micro-processing surface using a hybrid type of AFM/SCM (하이브리드형 AFM/SCM을 이용한 레이저 미세 가공 표면 측정)

  • Kim, Jong-Bae;Kim, Kyeong-Ho;Bae, Han-Sung;Nam, Gi-Jung;Lee, Dae-Chul;Seo, Woon-Hak
    • Proceedings of the Korean Society of Laser Processing Conference
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    • 2006.11a
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    • pp.123-127
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    • 2006
  • Hybrid type microscope with a Scanning Confocal Microscope (SCM) and a shear-force Atomic Force Microscope (AFM) is suggested and preliminarily studied. A image of $120{\times}120{\mu}m^2$ is obtained within 1 second by SCM because scan speed of a X-axis and Y-axis are 1kHz and 1Hz, respectively. Shear-force AFM is able to correctly measure the hight and width of sample with a resolution 8nm. However, the scan speed is slow and it is difficult to distinguish a surface composed of different kinds of materials. We have carried out the measurement of total image of a sample by SCM and an exact analysis of each image by shear-force AFM.

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Development of a force measurement device for curling sweeping with load cells (로드셀을 이용한 컬링 스위핑 힘 측정 장치 개발)

  • Lee, Sangcheol;Kim, Taewhan;Kil, Sekee;Choi, Sanghyup
    • Journal of the Korea Convergence Society
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    • v.8 no.11
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    • pp.49-56
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    • 2017
  • Curling sweeping is one of important motion to control the position of the curling stone, and sweeping speed and applied force to the broom pad are major research subjects. In this study, a device was developed to measure the force applied to the curling broom pad in curling sweeping motion, and two load cells were mounted between the broom pad and pad holder. Analog signals generated from the load cells were sampled about 300 times per second using a micro controller, and then converted to 10-bit digital signals. Calibration of the load cell and set up of regression equations to convert the measured electrical signals into mass (force) was done by three M1 class weights, and the developed system was designed as wearable device to minimize increasing of total weight of the broom. Same force was applied to the developed system and a force plate that was using as a reference force measurement system in field of sports, and the difference between the measured values were showed about $0.909{\pm}1.375N$(mean and standard deviation). The developed system could be applied other kinds of study which required force measurement function similar to sweeping motion.

Effect of Pressure on Edge Delamination in Chemical Mechanical Polishing of SU-8 Film on Silicon Wafer

  • Park, Sunjoon;Im, Seokyeon;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.33 no.6
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    • pp.282-287
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    • 2017
  • SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

Study of Production and Material Properties of Micro Screw Using SWCH18A and SUS XM7 Materials (SWCH18A 와 SUS XM7 을 적용한 초소형 나사제작 및 물성분석에 관한 연구)

  • Ra, Seung-Woo;Kim, In-Rak;Hwang, Sung Tack
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.9
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    • pp.1043-1048
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    • 2014
  • As micro screws feature reduced screw lengths and pitches, the resulting clamping force diminishes because of the reduced length of the actual joints. The elements of the clamping force are material, geometry, and friction. We studied the shrinking size of the screw and the methods to improve the clamping force by changing the material. We developed a micro screw using SWCH18A and SUS XM7 materials, and obtained the precision and thickness of the pitch through three-dimensional measurement. We also measured the external resistance of the micro screw by applying the Vicker's hardness test and conducted a break surface analysis using a break torque test and SEM for obtaining the break characteristics.

Characterization of ultra Precision Grinding Plate for GMR Head Manufacturing by Measuring Frictional Force (마찰력 측정을 통한 GMR 헤드 제작용 초정밀 연마판의 특성화)

  • 노병국;김기대
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.7
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    • pp.78-83
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    • 2003
  • Characterization of an ultra precision grinding plate for GMR head manufacturing is performed by measuring frictional forces between the grinding plate and the advanced ceramic Two kinds of methods of producing the precision grinding plates are presented: texturing and micro-channeling. Texturing is effective in terms of production time but micro-channeling excels in quality control. It is found that the frictional coefficient of a precision grinding plate decreases as the impregnation of diamond grain onto the precision-grinding plate progresses, and remains unchanged once the impregnation process is successfully completed, even after 100 revolutions of the precision-grinding plate against the advanced ceramic under 40 N of normal force. Therefore, the measurement of the frictional coefficient can replace costly and time-consuming process of estimating the level of impregnation of diamond grain on the precision-grinding plate, which has been performed by using scanning electron microscope, and be employed as an index to determine the level of impregnation of diamond grain.