• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.5
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• pp.421-428
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• 2004

This study concerns the characteristics of boiling heat transfer in two-phase closed thermosyphons with various micro grooves. A study was carried out with the performance of the heat transfer of the thermosyphon having 60 internal micro grooves in which boiling and condensation occur. A plain thermosyphon having the same inner and outer diameter as the grooved thermosyphon is also tested for comparison. Distilled water, methanol, ethanol have been used as the working fluid. The heat flux and the boiling heat transfer coefficient at the evaporator zone are estimated from the experimental results. The experimental results have been assessed and compared with existing correlations. Imura's and Kusuda's correlation for boiling showed in good agreement with experimental results within ${\pm}20{\%}$ in plain thermosyphon.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.1-7
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• 1999

We developed Fabrication process of embedded passive components in MCM-D substrate. The proposed MCM-D substrate is based on Cu/photosensitive BCB multilayer. The substrate used is Si wafer and Ti/cu metallization is used to form the interconnect layer. Interconnect layers are formed with 1000$\AA$ Ti/3000$\AA$ Cu by sputtering method and 3$\mu\textrm{m}$ Cu by electrical plating method. In order to form the vias in photosensitive BCB layer, the process of BCB and plasma etch using $C_2F_6$ gas were evaluated. The MCM-D substrate is composed of 5 dielectric layers and 4 interconnect layers. Embedded resistors are made with NiCr and implemented on the $2^{nd}$ dielectric layer. The sheet resistance of NiCr is controlled to be about 21 $\Omega$/sq at the thickness of 600$\AA$. The multi-turn sprial inductors are designed in coplanar fashion on the $4^{th}$ interconnect layer with an underpass from the center to outside using the lower $3^{rd}$ interconnect layer. Capacitors are designed and realized between $1^{st}$ interconnect layer and $2^{nd}$ interconnect layer. An important issue in capacitor is the accurate determination of the dielectric thickness. We use the 900$\AA$ thickness of PECVD silicon nitride film as dielectric. Capacitance per unit area is about 88nF/$\textrm {cm}^2$at the thickness of 900$\AA$. The advantage of this integration process is the compatibility with the conventional semiconductor process due to low temperature PECVD silicon nitride process and thermal evaporation NiCr process.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.2
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• pp.245-265
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• 1991

The purpose of this study was to observe the changes of the elemental transmission and bond strength between the metal and porcelain according to various kinds of ion beam mixing method. ion beam mixing of $meta1/SiO_2$ (silica), $meta1/Al_2O_3$(alumina) interfaces causes reactions when the $Ar^+$ was implanted into bilayer thin films using a 100KeV accelerator which was designed and constructed for this study. A vacuum evaporator used in the $10^{-5}-10^{-6}$ Torr vacuum states for the evaporation. For this study, three kinds of porcelain metal selected, -precious, semiprecious, and non-precious. Silica and alumina were deposited to the metal by the vacuum evaporator, separately. One group was treated by two kinds of dose of the ion beam mixing $(1\times10^{16}ions/cm^2,\;5\times10^{15}ions/cm^2)$, and the other group was not mixed, and analyzed the effects of ion beam mixing. The analyses of bond strength, elemental transmissions were performed by the electron spectroscopy of chemical analysis (ESCA), light and scanning electron microscope, scratch test, and micro Vickers hardness tests. The finding led to the following conclusions. 1. In the scanning electron and light microscopic views, ion beam mixed specimens showed the ion beam mixed indentation. 2. In the micro Vickers hardness and scratch tests, ion beam mixed specimens showed higher strength than that of non mixed specimens, however, nonprecious metal showed a little change in the bond strength between mixed and non mixed specimens. 3. In the scratch test, ion beam mixed specimens showed higher shear strength than that of non treated specimens at the precious and semiprecious groups. 4. In the ESCA analysis, Au-O and Au-Si compounds were formed and transmission of the Au peak was found ion beam mixed $SiO_2/Au$ specimen, simultaneously, in the higher and lower bonded areas, and ion beam mixed $SiO_2/Ni-Cr$ specimen, oxygen, that was transmitted from $SiO_2\;to\;SiO_2/Ni-Cr$ interface combined with 12% of Ni at the interface.

• Journal of the Korean Electrochemical Society
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• v.3 no.2
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• pp.115-120
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• 2000

All solid-state thin film micro-batteries consisting of lithium metal anode, an amorphous LiPON electrolyte and cathode of vanadium oxide have been fabricated and characterized, which were fabricated with cell structure of $Li/LiPON/V_2O_5Pt$. The effect of various oxygen partial pressure on the electrochemical properties of vanadium oxide thin films formed by d.c. reactive sputtering deposition were investigated. The vanadium oxide thin film with deposition condition of $20\%\;O_2/Ar$ ratio showed good cycling behavior. In in-siか process, the LiPON electrolyte was deposited on the $V_2O_5$ films without breaking vacuum by r.f. magnetron sputtering at room temperature. After deposition of the amorphous LiPON, the Li metal films were grown by a thermal evaporator in a dry room. The charge-discharge cycle measurements as a function of current density and voltage variation revealed that the $Li/LiPON/V_2O_5$ thin film had excellent rechargeable properly when current density was $7{\mu}A/cm^2$. and cut-off voltage was between 3.6 and 2.7V In practical experiment, a stopwatch ran on this $Li/LiPON/V_2O_5$ thin film micro-battery. This result means that thin film micro-battery fabricated by in-siか process is a promising for power source for electronic devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.380-381
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• 2012

Bioinspired sea urchin-like structures were fabricated on silicon by inductively coupled plasma (ICP) etching using lens-like shape hexagonally patterned photoresist (PR) patterns and subsequent metal-assisted chemical etching (MaCE) [1]. The lens-like shape PR patterns with a diameter of 2 ${\mu}m$ were formed by conventional lithography method followed by thermal reflow process of PR patterns on a hotplate at $170^{\circ}C$ for 40 s. ICP etching process was carried out in an SF6 plasma ambient using an optimum etching conditions such as radio-frequency power of 50 W, ICP power of 25 W, SF6 flow rate of 30 sccm, process pressure of 10 mTorr, and etching time of 150 s in order to produce micron structure with tapered etch profile. 15 nm thick Ag film was evaporated on the samples using e-beam evaporator with a deposition rate of 0.05 nm/s. To form Ag nanoparticles (NPs), the samples were thermally treated (thermally dewetted) in a rapid thermal annealing system at $500^{\circ}C$ for 1 min in a nitrogen environment. The Ag thickness and thermal dewetting conditions were carefully chosen to obtain isolated Ag NPs. To fabricate needle-like nanostructures on both the micron structure (i.e., sea urchin-like structures) and flat surface of silicon, MaCE process, which is based on the strong catalytic activity of metal, was performed in a chemical etchant (HNO3: HF: H2O = 4: 1: 20) using Ag NPs at room temperature for 1 min. Finally, the residual Ag NPs were removed by immersion in a HNO3 solution. The fabricated structures after each process steps are shown in figure 1. It is well-known that the hierarchical micro- and nanostructures have efficient light harvesting properties [2-3]. Therefore, this fabrication technique for production of sea urchin-like structures is applicable to improve the performance of light harvesting devices.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.20 no.8
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• pp.517-525
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• 2008

In order to study the heat transfer and pressure drop of an internal heat exchanger for $CO_2$ heat pump under cooling condition, the experiment and numerical analysis were performed. Four kinds of internal heat exchangers with a coaxial tube type and a micro-channel tube type were used. The experimental apparatus consisted of a test section, a power supply, a heater, a chiller, a mass flow meter, a pump and a measurement system. The section-by-section method and Hardy-Cross method were used for the numerical analysis. The effects of the internal heat exchanger refrigerant flow rate, the length of the internal heat exchanger, the operating condition of the gas-cooler, the evaporator and the type of the internal heat exchangers were investigated. With increasing of the flow rate, the heat transfer rate increased about 25%. The heat transfer rate of the micro-channel tube type was higher about 100% than that of the coaxial tube type. With increasing of the length of the internal heat exchanger, the heat transfer rate increased about $20{\sim}50%$. The pressure drop of the low-side tube was larger compared with that of the high-side tube.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.11
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• pp.121-126
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• 2021

In this study, the effect of thermal contact resistance between pin-channel tubes on the heat transfer characteristics was analytically examined around the channel tubes with the pins attached to two consecutive arranged channel pipes. The numerical results showed that the heat transfer coefficient decreased geometrically as the thermal contact resistance increased, and the corresponding temperature change on the contact surface increased as the thermal contact resistance increased. The thinner the pin, the more pronounced the geometric drop in the heat transfer coefficient. It was confirmed that the higher the height of the pin, the higher was the heat transfer coefficient, however, the greater the size of the thermal contact resistance, the smaller was the heat transfer coefficient. It was found that the temperature change in the inner wall of the channel tube did not significantly affect the heat transfer characteristics owing to the thermal contact resistance. Furthermore, the velocity of air at the entrance of the channel tube was proportional to the heat transfer coefficient due to a decrease in the convective heat resistance corresponding to an increase in the flow rate.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.510-510
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• 2013

탄소나노튜브를 발광층에 첨가하여 Alternating current (AC) 방식으로 구동되는 고분자유기물 소자를 제작하였다. 고분자유기물 소자는 ITO가 코팅된 유리기판을 사용하였으며, 전극으로는 ITO와Al을 사용하고 cyanoethyl pullulan (CRS)의 유전물질과 탄소나노튜브를 함유한 poly[2-methoxy-z5-(2-ethyl-hexyloxy)-1,4-phenylene-vinylene](MEH-PPV) 고분자유기발광물질을 이용하여 4개의 층(ITO/CRS/탄소나노튜브를 함유한 MEH-PPV/Al)으로 고분자유기물 소자를 구성하였다. 소자는 ITO가 코팅된 유리 기판 위에 CRS의 유전층과 탄소나노튜브를 함유한 MEH-PPV의 발광층은 스핀코우터를 이용하여 증착하였으며, Al은 thermal evaporator을 이용하여 증착하였다. 본 연구에서는 AC 방식 고분자유기물 소자에 탄소나노튜브의 함유량을 변경하면서 전압과 전류 특성을 관찰하여 탄소나노튜브가 함유된 소자가 저 전류 구동이 가능한 것을 확인하였으며, 탄소나노튜브를 통한 micro-capacitance 효과의 확인 및 percolation과의 상관관계를 알아보았다. AC 고분자유기물 소자는 가정에서 사용되는 AC전원을 바로 사용할 수 있는 범용성을 가지고 있으며, 탄소나노튜브를 발광층에 첨가함으로 낮은 소비전력으로 고분자유기물 소자를 구동 할 수 있는 장점으로 차세대 디스플레이나 조명으로 그 쓰임새를 기대해본다.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.168.1-168.1
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• 2013

고분자유기물로 사용되는 발광층에 탄소나노튜브를 합성하여 AC로 구동되는 고분자유기물소자를 제작하였다. 고분자유기물소자는 총 4개의 층(ITO/CRS/탄소나노튜브를 함유한 MEH-PPV/Al)으로 구성하였다. ITO가 코팅된 유리기판 위에 발광층을 보호하는 역할을 하는 절연층[cyanoethyl pullulan(CRS)], 유기발광물질인 poly[2-methoxy-5-(2-ethyl-hexyloxy)-1,4-phenylene-vinylene](MEH-PPV)에 탄소나노튜브의 함량을 조절하여 발광층으로 사용하였으며, 절연층과 발광층은 스핀코우터를 이용하여 증착하다. 마지막으로 thermal evaporator을 이용하여 Al을 증착하였다. 고분자유기물소자는 발광층에 함유된 탄소나노튜브에 함량에 따른 전압, 전류 그리고 밝기 특성을 분석하였다. 탄소나노튜브가 0.015wt% 함유된 고분자유기물소자에서 최대 밝기 특성과 낮은 소비전력을 얻을 수 있었다. 고분자유기물에 탄소나노튜브를 합성된 효과를 알아보기 위하여 임피던스분석을 통하여 고분자유기물소자의 저항, 캐패시턴스, 기생저항을 알아보았다. 고분자유기물소자의 캐패시턴스의 변화는 탄소나노튜브와 고분자 유기물(polymer-CNT matrix) 에서 생성되는 블록들이 매우 얇은 유전층을 구성할 것으로 예상되며 이는 micro-capacitance로 고분자유기물소자의 구동에 영향을 미치는 것으로 예상된다. AC구동 고분자유기물소자에 탄소나노튜브를 함유하여 높은 효율을 얻을 수 있는 장점으로 차세대 디스플레이나 조명으로 탄소나노튜브의 쓰임새를 기대해 본다.