• 대한기계학회논문집A
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• 제36권4호
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• pp.395-403
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• 2012

오늘날 접합시 열에 의한 재료 손상과 접착제(ACA, NCA) 이용으로 부품간의 정렬이 문제가 되고있다. 따라서, 본 논문은 FPCB 와 HPCB 금속(Au) PAD를 직접 접합하였다. 이때 박막인 재료에 손상을 입히는 열, 부품간의 정렬에 문제가 되는 접착제(ACA, NCA)를 사용하지 않고 상온에서 접합을 하였다. 접합시 초음파 혼을 이용하여 접합을 하였으며, 초음파혼은 40kHz이다. 공정 조건은 접합압력 0.60MPa, 접합시간 0.5, 1.0, 1.5, 2.0sec이다. 또한, 산업에서 요구하는 접합강도는 필강도 테스트 결과값으로 0.60Kgf 이상이며, 본 실험에서는 접합강도가 0.80MPa 이상이 나왔다. 이로서, 열에 의한 재료 손상과, 접 착제(ACA, NCA)에 의한 정렬 문제를 해결하였다. 그리고 산업산업에서 바로 적용하고 생산할 수 있는 FPCB, HPCB 시료 제작을 하였다.

• Design & Manufacturing
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• 제14권3호
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.