• Journal of Welding and Joining
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• v.26 no.3
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• pp.37-44
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• 2008

Charpy V-Notch test is commonly used to evaluate fracture toughness. However, since the region to be evaluated is limited to bulk material due to the specimen size required, individual evaluation of micro-structures on weldment is very difficult. In this study, ASP(Advanced Small Punch) test was carried out to evaluate material degradation and fracture toughness on the B.M, W.M and each micro-structures of HAZ for X20CrMoV121 and 2.25Cr1Mo steels with artificial aging time. In addition, to evaluate fracture toughness and material degradation of B.M and W.M of X20CrMoV121 steels with aging times, CVN (Charpy V-notch) test was performed. And then the correlation between ASP and CVN test on X20CrMoV121 steels was obtained. Furthermore, through this correlation, material degradation property of each micro-region of the HAZ in weldment, which was impossible to be evaluated by the CVN test, can be estimated and determined.

• Korean Journal of Food Science and Technology
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• v.20 no.4
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• pp.504-510
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• 1988

The physicochemical properties of rice flours which were obtained by dry milling(blade, hammer, test and micro mill) and wet & dry milling (roller & micro mill) were investigated. The resulting flour particle sizes were reduced in the order that of blade, hammer, test, micro and roller & micro mill. Scanning electron microscopic examination showed that the starch granules were freed from the imbedding matrix as the particles became finer. The test-milled flour had the hightest levels of starch damage, maltose value and hot-water soluble amylose content, and the blade-milled flour showed the lowest levels. Amylograph viscosity and gelatinization temperature of the flours decreased as the particles became finer, and the addition of $Hg^{+2}$ increased the peak viscosity of the dry-milled flour pastes, whereas the wet & dry-milled flour did not show any changes. The blue values and ${\lambda}$max values of the iodine complex of the cold-water extractable ${\alpha}-D-glucan$ from flours were in the range of 0.023-0.029 and 518-522nm, respectively, indicating these materials were shown to be mainly composed of amylopectin-like polymer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.2
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• pp.93-99
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• 2006

In this paper, we fabricated and evaluated polydimethylsiloxane(PDMS)-based flexible and implantable micro electrodes. The electrode patterning was carried out with the photolithography and chemical etching process after e-beam evaporation of 100 ATi and 1000 A Au. The PDMS substrate was treated by oxygen plasma using reactive ion etching(RIE) system to improve the adhesiveness of PDMS and metal layers. The minimum line width of fabricated micro electrode was 20 $\mu$m. After finished patterning, we did packaging with PDMS and then brought up the electrode's part about 40 $\mu$m with gold electroplating. The Hank's balanced salt solution(HBSS) test was carried out for 6 month for endurance of fabricated micro electrode. We carried out in-vivo test for the evaluation of biocompatibility by implanting electrodes under the ICR mouse skin for 42 days.

• Proceedings of the Korean Geotechical Society Conference
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• 1998.03a
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• pp.365-372
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• 1998

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.12
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• pp.1639-1645
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.242-247
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• 2004

Literature review on reliability test method for developing high performance optical/thermofluidic components. Since the miniaturization by the conventional mechanical process is limited to milli-structure, i.e. $10^{-3}m$, new technology for fabricating of mechanical components is needed to match cost, reliability, and integrability criteria of micro-structure. Although numbers of various researches on MEMS/MOEMS devices and components, including material characterization, design and optimization, system validation, etc., the lack of standards and specifications make the researches and developments difficult. For that reason, this paper is intended to propose the methods of reliability test for measuring the mechanical property of optical/ thermofluidic components.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Tunnel and Underground Space
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• v.27 no.3
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• pp.172-184
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• 2017

The hardness and mechanical properties of the minerals in the Daejeon granite according to depths were investigated by indentation test, load-unload test, and cycle test of dynamic ultra-micro hardness. As a result of the tests, it was possible to classify into three mineral groups (Group-1, -2, -3). The Martens hardness was not significantly different between 41 m and 223 m depths in three mode tests. Nevertheless, they showed in the order of a cycle test < load-unload test < indentation test. Considering the average Martens hardness, elastic modulus, and indentation work for each mineral group, their boundaries were relatively clear. In conclusion, A relatively accurate hardness of minerals can be obtained by three mode tests of dynamic ultra-micro hardness. In addtion, it was possible to characterize the elastic modulus and the elastic-plastic properties of the minerals from the load-unload and cycle tests.

• Journal of Power System Engineering
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• v.21 no.3
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• pp.37-44
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• 2017

In this study, failure analysis of the angular pin for molding machines to aluminum component molding was carried out. SM45C steel was used for the angular pin, it was surface hardened by the induction surface hardening heat treatment. The cross section of damaged angular pin was observed, and micro Vickers hardness value from the fractured part was measured. Brittle fracture was occurred from the fracture surface of angular pin, therefore, impact toughness value was evaluated by V-notch Charpy impact test. It was confirmed that the impact absorption energy was high when was tempered at a high temperature for a long time, and the toughness was slightly increased. Also, 2-parameter Weibull statistical analysis was investigated in order to evaluate the reliability of the measured micro Vickers hardness values and absorbed energy. The micro Vickers hardness and absorbed energy well followed a two-parameter Weibull probability distribution, respectively. The reverse design against angular pin was proposed as possible by using test results.