• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.147-152
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• 2005

In recent industry, according to pursuit the miniaturization and high-precision of machine part with development of new technology as IT, BT the development of mold manufacturing technology for mass production is accompanied. In this study, the spiral type injection mold with a $200{\mu}m$ thickness shape is made for investigation of influence for injection molding process variables and the flow length is measured through an experiment. Beside, the result of each experiment Is compared with the analysis result of CAE. Taguchi method is used in this experiment and the obtained data are analyzed using ANOVA method.

• Journal of Power System Engineering
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• v.20 no.5
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• pp.5-13
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• 2016

This study is on wear damage of the material for a molding machine that be used at finally cutting of metal beam made in roll forming process of vehicle bump beam process line. SKD11 steel was used with the material for cutting mold jig. In the cutting mold jig, Ti diffusion heat treatment after vacuum heat treatment was carried out for upgrade of surface hardness and anti-wear. Also, the heat treatments by various methods were performed to compare the wear damage degree against above the existing heat treatment. Wear loss and friction coefficient were obtained from wear test. And, micro Vickers hardness values were compared with damaged parts or not of cutting mold jig. Micro Vickers hardness value appeared higher at the undamaged part by Ti diffusion heat treatment. The micro Vickers hardness well followed a two-parameter Weibull probability distribution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.247-251
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• 2004

Chemical-Mechanical Polishing(CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. And there are many elements affecting CMP performance such as slurry, pad, process parameters and pad conditioning. Among these elements the CMP pad is considered one of the most important because of its change. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. So we make CMP pad with micro structure using micro molding method. This paper introduces the basic concept and fabrication technique of CMP pad with micro-structure and the characteristic of polishing. Experimental results demonstrate the removal rate, uniformity, and time vs. removal rate.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1833-1836
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• 2008

Recently as the micro surface features become higher and diverse in their shapes, the releasing of the molded features becomes more crucial for manufacturing of the micro patterned products. The higher aspect ratio of the features or more complex shape of the features results in larger releasing force, elongation or cohesive failure of the features during the releasing. Another issue would be the uniformity of the released surface features after molding, especially for applications with large area surface. The micro patterned optical film, one of typical applications for micro surface features, consists of two layers, the thermoplastic base film and the micro formed UV resin layer. Therefore two interfaces are typically involved during the forming of this micro featured film; one is between the base film and the UV resin and another is between the resin and the pattern master. To improve the releasing of the molded surface features, the adhesive characteristic was investigated at these two interfaces. A PET film was used as a base film and two UV curable resins with different surface energy were prepared for different adhesiveness. Also the two different pattern masters were employed; one is made from brass-copper alloy and fabricated with PMMA. The adhesiveness at each interface was measured for some combinations of these base film, UV resins and the masters and the effect of this adhesiveness on the releasing was investigated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.10 s.241
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• pp.1298-1306
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• 2005

In this paper, Part II, we realized the Serpentine Laminating Micromirer (SLM) which was proposed in the accompanying paper, Part I, by means of the injection molding process in mass production. In the SLM, the higher level of chaotic mixing can be achieved by combining two general chaotic mixing mechanisms of splitting/recombination and chaotic advection by the successive arrangement of 'F'-shape mixing units in two layers. Mold inserts for the injection molding process of the SLM were fabricated by SU-8 photolithography and nickel electroplating. The SLM was realized by injection molding of COC (cyclic olefin copolymer) with the fabricated mold inserts and thermal bonding of two injection molded COC substrates. To compare the mixing performance, a T-type micromixer was also fabricated. Mixing performances of micromixers were experimentally characterized in terms of an average mixing color intensity of a pH indicator, phenolphthalein. Experimental results show that the SLM has much better mixing performance than the I-type micromixer and chaotic mixing was successfully achieved from the SLM over the wide range of Reynolds number (Re). The chaotic micromixer, SLM proposed in this study, could be easily integrated in Micro-Total-Analysis- System , Lab-on-a-Chip and so on.

• Design & Manufacturing
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• v.17 no.3
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• pp.48-54
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• 2023

In this study, an injection mold with ultra-small surface properties was manufactured using nanosecond laser processing. A superhydrophobic characteristic analysis was performed on the PET specimen manufactured through this. To this end, a hydrophobic pattern was defined using the Cassie-Baxter model. The defined features were selected with a spot diameter of 25um and pitch spacing of 30um and 35um. As a result of the basic experiment, it was confirmed that the fine pattern shape had an aspect ratio of 1:1 when the pitch interval was 35um and 20 iterations. Through the determined processing conditions, a hydrophobic pattern was implemented on the core surface of KP4. A specimen with a hydrophobic pattern was produced through injection molding. The height of the molded hydrophobic pattern is 20 ㎛ less than the depth of the core and the contact angle measurement results are 92.1°. This is a contact angle smaller than the superhydrophobic criterion. Molding analysis was performed to analyze the cause of this, and it was analyzed that the molding was not molded due to the lack of pressure in the injection machine.

• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.617-618
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.529-530
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• 2006

• Proceedings of the Korean Fiber Society Conference
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• 2001.10a
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• pp.287-290
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• 2001

최근 정보통신 산업의 급속한 발전으로 이동 통신용 단말기 및 반도체 칩 케리어 등의 플라스틱 부품의 초소형 경량화 요구가 증대되고 있다. 미세 사출성형용(micro injection molding) 박판의 사출을 위한 미세사출 성형 고분자 재료는 매우 우수한 용융 유동 특성을 가져야 하고, 반도체나 소형 엔지니어링 부품으로 사용하려면 높은 인장강도, 충격강도 및 치수안정성을 가져야 한다. (중략)