• 한국전기전자재료학회논문지
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• 제13권7호
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• pp.612-616
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• 2000

This paper describes on the fabrication and characteristics of hot-film type micro-flowsensors integrated with Pt-RTD(resistance thermometer device) and micro-heater on the Si membrane in which MgO thin-film was used as medium layer in order to improve adhesion of Pt thin-film to SiO$_2$layer. The MgO layer improved adhesion of Pt thin-film to SiO$_2$layer without any chemical reactions to Pt thin-film under high annealing temperatures. Output voltages increased due to increase of heat-loss from sensor to external. The output voltage was 82 mV at $N_2$flow rate of 2000 sccm/min heating power of 1.2 W. The response time($\tau$:63%) was about 50 msec when input flow was stepinput

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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• pp.314-317
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• 1997

The electrical and physical characteristics of aluminum oxide and Pt thin films on it, deposited by reactive sputtering and DC magnetron sputtering respectively, were analyzed with increasing annealing temperature(400~80$0^{\circ}C$) by four point probe, SEM and XRD. Under $600^{\circ}C$ of annealing temperature, aluminum oxide had the properties of improving Pt adhesion to SiO$_2$and insulation without chemical reaction to Pt thin films and the resistivity of Pt thin films was improved. But these properties of aluminum oxide and Pt thin films on it were degraded over $700^{\circ}C$ of annealing temperature because aluminum oxide was changed into metal aluminum and then reacted to Pt thin films deposited on it. In the analysis of the thermal charateristics of Pt micro-heater fabricated on Si07/si substrate, the temperature of Pt micro-heater is up to 41$0^{\circ}C$ with the power dissipation 1.8 watts.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1902-1907
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• 2008

The current work presents a design and fabrication technique for a microchannel system to measure the local temperature distribution inside microchannel. This micro channel system fabricated by MEMS technique is integrated with a heater and an array of temperature sensors so that detailed heat transfer phenomena inside micro-scale channel can be studied. Materials widely used in semiconductor process were selected to fabricate a heater and temperature sensors on a silicon wafer. On these heater and sensors a channel wall was fabricated with SU-8. The friction constant and the local Nusselt number distribution measured for the deionized water flow in the microchannel is presented.

• 센서학회지
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• 제20권5호
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• pp.311-316
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• 2011

Monitoring the carbon dioxide concentration in arterial blood is vital for the evaluation and prevention of pulmonary disease. Yet, domestic pure arterial blood carbon dioxide sensor technologies are not being developed, instead all sensors are imported. In this paper, we develop a real time monitoring system for arterial blood partial pressure of carbon dioxide($pCO_2$) gas from the wrist by using a carbon micro-heater. The micro-heater was fabricated with a thickness of 0.3 ${\mu}m$ in order to collect the carbon dioxide under the skin. The micro-heater has been designed to perform temperature compensation in order to prevent damage to the skin. Two clinical trials of the system were undertaken. As a result, we demonstrated that a portable, transcutaneous carbon dioxide analysis($TcpCO_2$) device produced domestically is possible. In addition, this system reduced the analysis time significantly. Carbon films could reduce the unit price of these sensors by replacing the gold film used in foreign models. Also, we developed a real time monitoring system which can be used with optical biosensors for medical diagnostics as well as gas sensors for environmental monitoring.

• 대한기계학회논문집A
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• 제32권9호
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• pp.720-727
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• 2008

Microfluidic single chip integrating thermopneumatic micropump and micro check valve are developed. The micropump and micorvalve are made of biocompatible materials, glass and PDMS, so as to be applicable to the biochip. By using the passive-type check valve, backward flow and fluid leakage are blocked and flow control is stable and precise. The chip is composed of three PDMS layers and a glass substrate. In the chip, flow channel and pump chamber were made on the PDMS layers by the replica molding technique and pump heater was made on the glass substrate by Cr/Au deposition. Diameter of the pump chamber is 7 mm and the width and depth of the channel are 200 and $180{\mu}m$, respectively. The PDMS layers chip and the heater deposited glass chip are combined by a jig and a clamp for pumping operation, and they are separable so that PDMS chip is used as a disposable but the heater chip is able to be used repeatedly. Pumping performance was simulated by CFD software and investigated experimentally. The performance was the best when the duty ratio of the applied voltage to the heater was 33%.

• 대한의용생체공학회:의공학회지
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• 제43권4호
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• pp.219-229
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• 2022

In this study, we propose a miniaturized micro-ceramic heater device. After screen-printing a silver paste between pre-sintered two aluminum oxide plates to integrate a heating circuit, the device was fabricated through a low-temperature sintering process. In order to configure the optimal heating circuit integration condition, the output current evaluation and heating test were performed according to the number of screen prints of the silver paste at various voltages. A silver paste-based heating circuit printed with a line width of 200 ㎛ and a thickness of 60 ㎛ was successfully integrated on a pre-sintered alumina substrate through a low-temperature sintering process. In the case of the 5 times printed device, the thermal response showed a response rate of 18.19 ℃/sec. To demonstrate feasibility of the proposed device in the medical field, such as bio-tissue suturing and hemostasis, a voltage was applied to pig tissue in the device to test tissue change due to heat generated from the device. These results show the possibility that the proposed small ceramic heater could be used in the medical field based on its excellent temperature response.

• 센서학회지
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• 제6권5호
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• pp.400-406
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• 1997

DC 마그네트론 스퍼터링 반응성 스퍼터링으로 각각 증착된 알루미늄산화막과 그 위에 증착된 Pt 박막의 열처리 온도에 따른 전기적, 물리적 특성을 4침 탐침기, 주사전자현미경 및 X선 회절법을 이용하여 분석하였다. $600^{\circ}C$ 이하의 열처리 조건에서는 알루미늄산화막은 Pt 박막과 화학적 반응 없이 Pt 박막의 $SiO_{2}$에 대한 부착특성을 개선시켰으며 그 위에 증착된 Pt 박막의 전기적 특성도 열처리 온도가 증가함에 따라 개선되었다. 그러나 $700^{\circ}C$ 이상의 열처리 온도에서는 알루미늄산화막이 절연특성이 저하되고 그 위에 증착된 Pt 박막과 반응하여 Pt 박막의 전 기적 특성도 저하되었다. Pt-RTD 온도센서를 이용한 Pt 미세발열체의 발열특성 분석에서 활성영역이 작을 수록 발열체의 발인특성이 개선되었으며 활성영역 면적이 $200{\mu}m{\times}200{\mu}m$의 구조를 갖는 Pt 미세발열체는 소비전력 1.5watts에 $400^{\circ}C$ 정도의 양호한 발열특성을 나타냈다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• 한국정밀공학회지
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• 제26권11호
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• pp.138-145
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• 2009

A suspended membrane micro fluidic heat flux sensor that is able to measure the heat flow rate was designed and fabricated by a complementary-metal-oxide-semiconductor-compatible process. The combination of a thirty-junction gold and nickel thermoelectric sensor with an ultralow noise preamplifier, low pass filter, and lock-in amp has enabled the resolution of 50 nW power and provides the sensitivity of $11.4\;mV/{\mu}W$. The heater modulation method was used to eliminate low frequency noises from sensor output. It is measured with various heat flux fluid of DI-water to test as micro fluidic application. In order to estimate the heat generation of samples from the output measurement of a micro fluidic heat-flux sensor, a methodology for modeling and simulating electro-thermal behavior in the micro fluidic heat-flux sensor with integrated electronic circuit is presented and validated. The electro-thermal model was constructed by using system dynamics, particularly the bond graph. The electro-thermal system model in which the thermal and the electrical domain are coupled expresses the heat generation of samples converts thermal input to electrical output. The proposed electro-thermal system model shows good agreement with measured output voltage response in transient state and steady-state.

• 센서학회지
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• 제18권5호
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• pp.349-352
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• 2009

This paper describes the fabrication and characteristics of micro heaters built on AlN($0.1{\mu}m$)/3C-SiC($1{\mu}m$) suspended membranes by surface micromachining technology. In this work, 3C-SiC and AlN films are used for high temperature environments. Pt thin film was used as micro heaters and temperature sensor materials. The resistance of temperature sensor and the power consumption of micro heaters were measured and calculated. The heater is designed for operating temperature up to about $800^{\circ}C$ and can be operated at about $500^{\circ}C$ with a power of 312 mW. The thermal coefficient of the resistance(TCR) of fabricated Pt resistance of temperature detector(RTD)'s is 3174.64 ppm/$^{\circ}C$. A thermal distribution measured by IR thermovision is uniform on the membrane surface.