• Title/Summary/Keyword: Micro Fabrication Technology

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A Study on Fracture Behavior in Shear Band during Micro Hole Punching Process (미세 홀 펀칭시 전단 파괴 거동 연구)

  • 유준환;임성한;주병윤;오수익
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.230-235
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    • 2003
  • In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, stain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu\textrm{m}$, 25 $\mu\textrm{m}$ micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with man holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover, burnish zone, fracture zone and it shows similar fracture behavior in shear band, but? by high strain rate (10$^2$∼ 10$^3$s$\^$-1/) unlike macro hole fabrication and increment of relative grain size several different results are shown.

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Fabrication of 3C-SiC micro heaters and its characteristics (3C-SiC 마이크로 히터의 제작과 그 특성)

  • Chung, Gwiy-Sang;Jeong, Jae-Min
    • Journal of Sensor Science and Technology
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    • v.18 no.4
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    • pp.311-315
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    • 2009
  • This paper describes the characteristics of a poly 3C-SiC micro heater which was fabricated on AlN(0.1 $\mu$m)/3C-SiC(1.0 $\mu$m) suspended membranes by surface micro-machining technology. The 3C-SiC and AlN thin films which have wide energy band gap and very low lattice mismatch were used sensors for high temperature and voltage environments. The 3C-SiC thin film was used as micro heaters and temperature sensor materials simultaneously. The implemented 3CSiC RTD(resistance of temperature detector) and the power consumption of micro heaters were measured and calculated. The TCR(thermal coefficient of the resistance) of 3C-SiC RTD is about -5200 ppm/$^{\circ}C$ within a temperature range from 25 $^{\circ}C$ to 50 $^{\circ}C$ and -1040 ppm/$^{\circ}C$ at 500 $^{\circ}C$. The micro heater generates the heat about 500 $^{\circ}C$ at 10.3 mW. Moreover, durability of 3C-SiC micro heaters in high voltages is better than Pt micro heaters. A thermal distribution measured and simulated by IR thermovision and COMSOL is uniform on the membrane surface.

Demonstration of Alternative Fabrication Techniques for Robust MEMS Device

  • Chang, Sung-Pil;Park, Je-Young;Cha, Doo-Yeol;Lee, Heung-Shik
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.4
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    • pp.184-188
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    • 2006
  • This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.

A Study on the Characteristics of Electrode Fabrication for Micro Hole-making (미세 구멍가공을 위한 전극성형 가공특성에 관한 연구)

  • Lee, Ju-Kyoung;Lee, Jong-Hang;Park, Cheol-Woo;Cho, Woong-Sick
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.11
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    • pp.1053-1058
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    • 2007
  • Micro-EDM technology (or the manufacture of miniature parts is used to make a micro hole. Two electrode shaping methods, mechanical electrode grinding and WEDG technique, have been studied. In this study, an electrode shaping method by using previously machined hole is introduced in order to obtain an optimal hole-making condition. Key factors such as applied voltage, capacitance, feedrate, and hole-dimension have an influence on the fabricating error of electrode shaping, which are taper ratio of a hole, electrode form accuracy, and electrode surface. Therefore, we try to investigate the optimal fabricating of electrode shaping from various experiments. Results from experiments, it was able to minimize the electrode fabricating error as voltage increases, and also applied feedrate and capacitance decreases.

Design and Fabrication method of combustor for micro solid propellant thruster (MEMS 고체 추진제 추력기의 추진제실 설계와 구조체 가공 방법)

  • Lee, Jong-Kwang;Kwon, Se-Jin
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2006.11a
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    • pp.251-254
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    • 2006
  • Micro thruster is a key technology in the micro/nano satellite. MSPT has been attracted attention as a one of possible solution for micro thruster MSPT as a systems four components. It is composed of nozzle, igniter, combustion chamber and propellant. This paper surveys varioud MSPTs which have been reported. The model of MSPT arrays for total impulse of 1 mNs is proposed. Combustion chamber is designed and fabricated.

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Fabrication of Micro Electrodes for Electrochemical Machining (전해 가공을 위한 미세 전극 제작)

  • Kim B. H.;Park B. J.;Chu C. N.
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2005.05a
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    • pp.407-412
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    • 2005
  • For micro electrochemical machining (ECM), tool electrodes with various sizes and shapes are necessary. In this paper, tool electrodes were fabricated by micro electrical discharge machining (EDM). Electrode material is tungsten carbide which has high rigidity and good conductivity for micro electrochemical machining. Disk-type and sphere-type electrodes were fabricated to prevent taper shape of side walls or to produce spherical features. Various 3D micro structures were fabricated by electrochemical milling with developed electrodes.

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Fabrication of MFISFET Compatible with CMOS Process Using $SrBi_2Ta_2O_9$(SBT) Materials

  • You, In-Kyu;Lee, Won-Jae;Yang, Il-Suk;Yu, Byoung-Gon;Cho, Kyoung-Ik
    • Transactions on Electrical and Electronic Materials
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    • v.1 no.1
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    • pp.40-44
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    • 2000
  • Metal-ferroelectric-insulator-semoiconductor field effect transistor (MFISFETs) were fabricated using CMOS processes. The Pt/SBT/NO combined layers were etched for forming a conformal gate by using Ti/Cr metal masks and a two step etching method, By the method, we were able to fabricate a small-sized gate with the dimension of $16/4{\mu}textrm{m}$ in the width/length of gate. It has been chosen the non-self aligned source and drain implantation process, We have deposited inter-layer dielectrics(ILD) by low pressure chemical vapor deposition(LPCVD) at $380^{circ}C$ after etching the gate structure and the threshold voltage of p-channel MFISFETs were about 1.0 and -2.1V, respectively. It was also observed that the current difference between the $I_{ON}$(on current) and $I_{OFF}$(off current) that is very important in sensing margin, is more that 100 times in $I_{D}-V_{G}$ hysteresis curve.

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Fabrication of NO sensor integrated SiC micro heaters for harsh environments and its characteristics (SiC 마이크로 히터가 내장된 극한 환경용 NO 센서의 제작과 특성)

  • Kim, Kang-San;Chung, Gwiy-Sang
    • Journal of Sensor Science and Technology
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    • v.19 no.3
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    • pp.197-201
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    • 2010
  • This paper describes the fabrication and characteristics of a NO sensor using ZnO thin film integrated 3C-SiC micro heater based on polycrystalline 3C-SiC thin film of operation in harsh environments. The sensitivity, response time, and operating properties in high temperature and voltages of NO sensors based SiC MEMS are measured and analyzed. The sensitivity of device with pure ZnO thin film at the heater operating power of 13.5 mW ($300^{\circ}C$) is 0.875 in NO gas concentration of 0.046 ppm. In the case of Pt doping, the sensitivity of at power consumption of 5.9 mW ($250^{\circ}C$) was 1.92 at same gas flow rate. The ZnO with doped Pt was showed higher sensitivity, lower working temperature and faster adsorption characteristics to NO gas than pure ZnO thin film. The NO gas sensor integrated SiC micro heater is more strength than others in high voltage and temperature environments.

Manufacturing process of micro-nano structure for super hydrophobic surface (초발수 표면을 만들기 위한 마이크로-나노 몰드 제작 공정)

  • Lim, Dong-Wook;Park, Kyu-Bag;Park, Jung-Rae;Ko, Kang-Ho;Lee, Jeong-woo;Kim, Ji-Hun
    • Design & Manufacturing
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    • v.15 no.4
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    • pp.57-64
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    • 2021
  • In recent materials industry, researches on the technology to manufacture super hydrophobic surface by effectively controlling the wettability of solid surface are expanding. Research on the fabrication of super hydrophobic surface has been studied not only for basic research but also for self-cleaning, anti-icing, anti-friction, flow resistance reduction in construction, textile, communication, military and aviation fields. A super hydrophobic surface is defined as a surface having a water droplet contact angle of 150 ° or more. The contact angle is determined by the surface energy and is influenced not only by the chemical properties of the surface but also by the rough structure. In this paper, maskless lithography using DMD, electro etching, anodizing and hot embossing are used to make the polymer resin PMMA surface super hydrophobic. In the fabrication of microstructure, DMDs are limited by the spacing of microstructure due to the structural limitations of the mirrors. In order to overcome this, maskless lithography using a transfer mechanism was used in this paper. In this paper, a super hydrophobic surface with micro and nano composite structure was fabricated. And the wettability characteristics of the micro pattern surface were analyzed.

Analysis of Micro Machining Characteristics using End-milling and Its Applications (초소경 엔드밀링을 이용한 미세 가공특성 분석 및 응용가공)

  • Choi, Hwan-Jin;Park, Eun-Suk;Jeon, Eun-Chae;Je, Tae-Jin;Choi, Doo-Sun
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.12
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    • pp.1279-1284
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    • 2012
  • Micro structures which are widely used at various fields are commonly fabricated by lithograph, etching and laser methods. Recently, with the emergence of micro tools and ultra-precision machine tools, fabrication of the micro structures obtained using end-milling are studied. However, there are some problems due to the diameter of the micro end-mill getting smaller below $100{\mu}m$. The micro run-out resulted from miniaturization of end-mills have influence seriously on accuracy of micro structures. The error of run-out with a tooling jig showed a decrease of about $9.3{\mu}m$. Furthermore, micro structures with width of $30{\mu}m$ could be applied through experiments of slot machining obtained using 30 and $50{\mu}m$ end-mill. Also, narrow angle structures with $30^{\circ}$ angle could be applied through analysis of machining acute angle structures. Based on basic experiments, micro fluidics channels and spiral patterns for air bearing were machined.