• IE interfaces
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• v.23 no.3
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• pp.229-238
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• 2010

Virtual metrology (VM), a critical component of semiconductor manufacturing, is an efficient way of assessing the quality of wafers not actually measured. This is done based on a model between equipment sensor data (obtained for all wafers) and the quality characteristics of wafers actually measured. This paper considers principal component regression (PCR), partial least squares regression (PLSR), kernel PCR (KPCR), and kernel PLSR (KPLSR) as VM models. For each regression model, two cases are considered. One utilizes all explanatory variables in developing a model, and the other selects significant variables using the genetic algorithm (GA). The prediction performances of 8 regression models are compared for the short- and long-term etch process data. It is found among others that the GA-KPLSR model performs best for both types of data. Especially, its prediction ability is within the requirement for the short-term data implying that it can be used to implement VM for real etch processes.

• Proceedings of the Acoustical Society of Korea Conference
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• autumn
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• pp.369-370
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• 2004

초음파의 조차에 의한 인체내부의 온도상승의 측도로 열지수(thermal index)가 사용되고 있으며, 이는 주파수 및 음향파워에 의존한다. 초음파 조사에 의한 인체내부의 온도상승을 평가하는데 사용되는 재료를 조직 모사 물질이라 한다. 본 논문아사는 단위 음향파워에 대한 온도 변화인 열 감도(thermal sensitivity)를 새로이 정의하였으며, 이 물리량으로 조직모사물질의 성능을 평가 할 수 있다는 것을 제안하고자 한다.

• Proceedings of the Acoustical Society of Korea Conference
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• autumn
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• pp.351-352
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• 2004

본 논문에서는 초음파 영상 진단기용 선형어레이 변환기를 장착할 수 있는 수조 와 128 채널의 스위칭 회로를 제작하여 변환기의 각 채널별 음향파워를 측정하였다. 실험은 128 채널 중 하나의 채널이 불량인 어레이 프로브를 대상으로 수행되었다. 측정 결과, 불량 채널의 음향 파워가 다른 채널에 비해 현저히 작게 나타남을 확인하였다.

• Proceedings of the Acoustical Society of Korea Conference
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• autumn
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• pp.349-350
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• 2004

매질 내부로 전파하는 초음파는 점성손실(viscous loss), 열전도 손실(heat conduction loss) 둥 다양한 상호작용을 통해 흡수되어 열에너지로 변환되기 때문에 매질 내의 온도 변화를 발생시킨다. 본 논문에서는 RTV 고무 내부에 47 개의 열전대를 장착하여 초음파 영상 진단기로부터 발생되는 초음파 음장에 따른 각 열전대의 채널별 온도변화의 측정결과를 제시하였다.

• ETRI Journal
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• v.32 no.5
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• pp.722-728
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• 2010

This paper presents the design and fabrication model of a touchpad based on a contact-resistance-type force sensor. The touchpad works as a touch input device, which can sense contact location and contact force simultaneously. The touchpad is 40 mm wide and 40 mm long. The touchpad is fabricated by using a simple screen printing technique. The contact location is evaluated by the calibration setup, which has a load cell and three-axis stages. The location error is approximately 4 mm with respect to x-axis and y-axis directions. The force response of the fabricated touchpad is obtained at three points by loading and unloading of the probe. The touchpad can detect loads from 0 N to 2 N. The touchpad shows a hysteresis error rate of about 11% and uniformity error rate of about 3%.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.619_620
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• 2009

본 논문은 자기장을 이용하여 전류를 안정화시켜 정밀전류를 발생 시킬 수 있는 장치에 관한 연구이다. 일반적으로 전류를 안정화 시키는 방법은 전류회로에 직렬로 저항을 연결하여 저항 양단에 유도되는 전압을 측정하여 전류를 제어하는 방법을 많이 사용한다. 그러나 이 방법은 정밀한 전류를 제어하기 위하여 직렬로 연결되는 저항값이 커야하며, 또한 전류에 의해 발생되는 열로 인해 저항값이 증가하기 때문에 정밀한 제어가 어렵다. 이러한 단점을 보완 할 수 있는 방법으로 전류회로에 직렬로 코일을 연결하여 전류가 변화면 코일속에 자기장이 변화는 원리를 이용하여 전류를 안정화시켜 정밀전류를 발생 할 수 있다. 본 연구에서는 저자기장 국가표준 확립 및 물리고유상수인 양성자 자기회전비율 측정을 위해 원자자기공명 방법을 이용하여 직류전류를 1 A 범위에서 $0.1{\mu}A$ 수준으로 안정화 시켰다.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.3
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• pp.273-278
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• 2008

In this paper, effects of thermoelastic stress by using lock-in thermography was measured in the cantilever beam. In experiment, a circular holed plate was applied to analyze variation of transient stress under the condition of repeated cyclic loading. And the finite element modal analysis as computational work was performed. According to the surface temperature obtained from infrared thermography, the stress of the nearby hole was predicted based on thermoelastic equation. As results, each stress distributions between 2nd and 3rd vibration mode were qualitatively and quantitatively investigated, respectively. Also, dynamic stress concentration factors according to the change of vibration amplitude were estimated for the resonance frequency.

• Journal of the Korean Society of Safety
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• v.21 no.4 s.76
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• pp.13-18
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• 2006

In spite of frequent defect in industrial boilers, life assessment or diagnostic method for them has not been actively studied. In this research, SS400 carbon steel used in industrial boilers is simulated with artificial aging heat treatment. To do qualitative life assessment, differences in micro-structures and hardness of SS400 by the degradation time are studied. In addition, variation in material properties by aging was observed with the tensile test at room temperature and $179^{\circ}C$ and changes in ductile to brittle transition temperature was observed with the charpy impact test performed at several test temperature.

• Journal of the Korean Society for Heat Treatment
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• v.15 no.3
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• pp.127-135
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• 2002

Shore hardness test was developed in 1906 to overcome the limit of Brinell hardness test. However, the detailed requirements on the tester was not clearly specified except the scale, i.e., 100 HS for high carbon steel and 10 HS for soft brass. As a result, the shore hardness was used for quite long time without well established standards. For the establishment of hardness standards, standard tester, standard procedure, and standard hardness block must be provided. So far the standard of Shore hardness was maintained by correlating Shore hardness scale to Vickers hardness through converting equation. This is the so called converted Shore hardness and it is not the true Shore hardness standard strictly. In this paper, the possibility of establishing Shore hardness standard based on the Shore standard hardness tester is reported.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.674-677
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• 2003

This work presents a method of point-to-surface assignment for 3D inspection of solder pastes on PCB. A bounding box enclosing the solder paste tightly on all sides is introduced to avoid incorrect point-to-surface assignment. The shape of bounding box for solder paste brick is variable according to geometry of measured points. The surface geometry of the bounding box is obtained by using five peaks selected from the histogram of normalized gradient vectors for measured points. By using the bounding box enclosing the solder paste. the task of point-to-surface assignment is successfully executed. Subsequently, the geometrical features are obtained via surface fitting.