• Title/Summary/Keyword: Metal-droplet deposition

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A Study on the Uniform Metal-Droplet Deposition Using Laser (레이저를 이용한 균일 금속액적 적층에 관한 연구)

  • 유성복;김용욱;양영수
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.667-670
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    • 2002
  • Uniform metal-droplet deposition using laser is analyzed. Using the variation principle and modeling the semi-solid phase as a non-Netwonian slurry, this model can greatly save the computational expenses that conventional numerical procedures have suffered from. The simulation results revealed that the developed model could reasonably describe the collision behavior of molten metal with solid surface. Simulations were made with variation of the falling distance and time.

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Analysis of Temperature Distribution and Residual Stress in Deposition Process of Metal Droplet by Using Laser Beam (레이저를 이용한 금속액적 적층시 온도분포와 잔류응력 해석)

  • Yun Jin-Oh;Yang Young-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.3 s.168
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    • pp.187-193
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    • 2005
  • The temperature distribution of the deposited droplet was predicted by using the finite element analysis and it was assumed that the droplet was axisymmetrical model. The analysis of residual stress was performed with the temperature data, which is obtained from the result. Axisymmetric droplet is deposited three times to consider the actual phenomenon of droplet deposition. The analysis of the temperature distribution is respectively performed whenever the axisymmetric droplet is laminated and the residual stresses of the laminated axisymmetric droplet are calculated with the value of the temperature distribution.

Evaporation Cooling of Single Droplet on a Heated Solid Surface (가열된 고체표면에 부착된 단일 액적의 증발냉각)

  • Yu, Gap-Jong;Bang, Chang-Hun;Kim, Jeong-Su
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.25 no.6
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    • pp.845-852
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    • 2001
  • The characteristics of evaporation cooling of single droplet on a heated surface were studied experimentally. The two kinds of heater modules were tested to measure cooling characteristics of metal surface (high conductivity) and Teflon surface (low-energy surface, low conductivity). The results showed that time averaged heat flux during droplet evaporation increased exponentially with initial surface temperatures of brass, copper and steel. The heat flux and evaporation time did not varied with metal conductivities. However, the temperature drop after the deposition of droplet was larger on Teflon than on the metals. Thus, the correlation of interface temperature between liquid droplet and metal surface was proposed as a function of the initial surface temperature of heating materials, which could be applied to both metal and non-metal ones.

A Study on the Impact and Solidification of the Liquid Metal Droplet in the Thermal Spray Deposition onto the Substrate with Surface Defects (표면 결함이 있는 모재에 대한 용사 공정에서 용응 금속 액적의 충돌현상과 응고 과정 해석)

  • Ha, Eung-Ji;Kim, Woo-Seung
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.11
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    • pp.1597-1604
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    • 2002
  • In this study, numerical investigation has been performed on the impingement, spreading and solidification of a coating material droplet impacting onto a solid substrate in the thermal spray process. The numerical model is validated through the comparison of the present numerical result with experimental data fer the flat substrate without surface defects. An analysis of deposition formation on the non-polished substrate with surface defects is also performed. The parametric study is conducted with various surface defect sizes and shapes to examine the effect of surface defects on the impact and solidification of the liquid droplet on the substrate.

A Study on the impact and solidification of the liquid metal droplet in the thermal spray deposition (용사 공정에서 용융 금속 액적의 충돌현상과 응고 과정 해석)

  • Ha, Eung-Ji;Kim, Woo-Seung
    • Proceedings of the KSME Conference
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    • 2001.06d
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    • pp.214-219
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    • 2001
  • In this study, numerical investigation has been performed on the spreading and solidification of a droplet impacting onto a solid substrate in the thermal spray process. The finite difference method with volume-of-fluid approach is used to analyze the free surface flow and the source-based enthalpy method is employed to model the latent heat release during the solidification. In this work, the numerical model is validated through the comparison of the present numerical result with experimental data available for the flat substrate.

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Deposition of YBCO Thin Film by Aerosol Assisted Spray Pyrolysis Method using Nitrate Precursors (질산염 전구체 원료로 분무 열분해 방법에 의한 YBCO 박막 증착)

  • Kim, Byeong-Joo;Hong, Seok-Kwan;Kim, Jae-Geun;Lee, Jong-Beom;Lee, Hee-Gyoun;Hong, Gye-Won
    • Progress in Superconductivity
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    • v.12 no.1
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    • pp.68-73
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    • 2010
  • Y123 films have been deposited on $LaAlO_3$ (100) single-crystal and IBAD substrates by spray pyrolysis method using nitrate precursors. Ultrasonic atomization was adopted to decrease the droplet size, spraying angle and its moving velocity toward substrate for introducing the preheating tube furnace in appropriate location. A small preheating tube furnace was installed between spraying nozzle and substrate for fast drying and enhanced decomposition of precursors. C-axis oriented films were obtained on both LAO and IBAD substrates at deposition temperature of around $710{\sim}750^{\circ}C$ and working pressures of 10~15 torr. Thick c-axis epitaxial film with the thickness of $0.3{\sim}0.6\;{\mu}m$ was obtained on LAO single-crystal by 10 min deposition. But the XRD results of the film deposited on IBAD template at same deposition condition showed that the buffer layers of the IBAD metal substrate was affected by long residence of metal substrate at high temperature for YBCO deposition.

Electrodeposition of Some Selective Metals Belonging to Light, Refractory and Noble Metals from Ionic Liquid Electrolytes

  • Dilasari, Bonita;Kwon, Kyung-Jung;Lee, Churl-Kyoung;Kim, Han-Su
    • Journal of the Korean Electrochemical Society
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    • v.15 no.3
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    • pp.135-148
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    • 2012
  • Ionic liquids are steadily attracting interests throughout a recent decade and their application is expanding into various fields including electrochemistry due to their unique properties such as non-volatility, inflammability, low toxicity, good ionic conductivity, wide electrochemical potential window and so on. These features make ionic liquids become an alternative solution for electrodeposition of metals that cannot be electroplated in aqueous electrolytes. In this review, we classify investigated metals into three categories, which are light (Li, Mg), refractory (Ti, Ta) and noble (Pd, Pt, Au) metals, rather than covering the exhaustive list of metals and try to update the recent development in this area. In electrodeposition of light metals, granular fine Li particles were successfully obtained while the passivation of electrodeposited Mg layers is an obstacle to reversible deposition-dissolution process of Mg. In the case of refractory metals, the quality of Ta and Ti deposit particles was effectively improved with addition of LiF and pyrrole, respectively. In noble metal category, EMIM TFSA ionic liquid as an electrolyte for Au electrodeposition was proven to be effective and BMP TFSA ionic liquid developed a smooth Pd deposit. Pt nanoparticle production from ionic liquid droplet in aqueous solution can be cost-effective and display an excellent electrocatalytic activity.

Compositing Modes and Microstructures of $Cu-X(=Al_2O_3,W)_p$ Composite by Centrifugal Spray-Cast Deposition (원심분사주조법에 의한 $Cu-X(=Al_2O_3,W)_p$ 복합재료의 미세조직 및 복합화)

  • Bae, Cha-Hurn;Jeong, Hae-Yong
    • Journal of Korea Foundry Society
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    • v.17 no.5
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    • pp.480-487
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    • 1997
  • Particle reinforced metal matrix composites(MMCs) via a centrifugal spray-cast deposition(CSD) process were fabricated by injecting second phase particles($Al_2O_3$<40${\mu}m$, W<17.3${\mu}m$) into copper melt on the atomizing disc. Compositing modes were investigated by combining microstructures and mathematical modeling between Cu droplets and the reinforced particles injected. The $Cu/W_P$ powders were shown that the W particles penetrate and get embedded in the Cu droplets. It is considered that the W particles composite preferentially in Cu melt on the atomizing disc. On the other hand, the $Al_2O_3$, particles did not penetrate into the Cu droplets on the atomizing disc but get attached in surface of Cu droplets during the flight. It is considered that the compositing may be attained in the flight distance which the relative velocity between Cu droplet and $Al_2O_3$, particle is maximum. The microstructure of the $Cu/W_P$ and the $Cu/(Al_2O_3)_p$ composite preform was strongly influenced by compositing modes of droplets, and after subsequent deposition it was comprised as it is called the dispersed type and the cell type of microstructure, respectively.

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