• 대한전자공학회논문지SD
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• 제45권1호
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• pp.7-13
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• 2008

본 논문에서는 PMOLED(passive matrix organic light emitting diodes) 데이터 구동회로의 전류 편차를 보상하는 새로운 구조의 회로를 제안한다. 일반적인 PMOLED 데이터 구동 회로의 경우 MOS(metal oxide semiconductor) 공정 변화에 의해서 발생하는 데이터 구동 회로 출력단의 전류 편차는 보상 할 수 없으나, 제안된 데이터 구동회로는 출력단의 전류 편차를 보상하여 균일한 값의 전류를 OLED 패널(panel)에 인가 할 수 있다. 제안하는 회로는 종래의 데이터 출력 회로에 스위칭 트랜지스터를 추가하여 데이터 출력 전류용 회로를 공통 연결선에 연결함으로써 공정 변화에 의한 출력 전류의 편차를 최소화 할 수 있다. 제안한 회로는 $128(RGB){\times}128$의 해상도를 지원하는 PMOLED 패널을 기준으로 설계 하였고, 구동 회로 개발에 이용된 공정은 0.35um이다. 실험 결과 제안한 데이터 구동회로의 출력 전류는 1%대의 오차를 갖는 반면, 종래의 데이터 구동회로의 경우 출력 전류는 9% 대로 심한 변화를 나타내었다. 본 논문에서 제안한 PMOLED 데이터 구동회로를 이용할 경우 고화질의 OLED 디스플레이 구현이 가능하여 고 품위의 디스플레이 특성을 요구하는 휴대용 디스플레이 기기에 적용 할 수 있다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.