• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.137.1-137.1
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• 2016

반도체, LED, 스마트 정보통신 첨단 기기에는 고가의 비철스크랩을 많이 사용하고 있으나 폐기되고 있는 비철제품을 사용후 반드시 회수되어야 한다. 수출향상을 위해서는 적합한 분리회수 기술의 확보가 필수적이다. 금은 주로 PCB나 반도체, 전자기기, 핸드백이나 가방, 액세서리 등에 주로 사용되고 있으며, 이러한 금을 회수하면 부가가치를 달성할 수 있다. 초기에는 주로 전자제품에 사용 되었으나, 이후 디자인과 기능성부품 등으로 이용이 확대되었다. 현재 국내의 금 사용량과 수요량은 매년 급증하고는 있다. 하지만 가격불안정성과 같은 자원적 문제를 갖고 있을 뿐만 아니라 전량 수입에 의존하고 있다. 국내의 비철회수 현장에서는 W-Mo합금의 박리기술을 제공해 줄 것을 요청하고 있다. 이에 이러한 고가의 스크랩을 체계적으로 회수할 수 있는 기술정보를 제공하고자 한다.

• Journal of information and communication convergence engineering
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• v.14 no.3
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• pp.184-190
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• 2016

We present experimental demonstrations of electromagnetic bandgap (EBG) structures for the wideband suppression of radiated emissions from a power bus in high-speed printed circuit boards (PCBs). In most of the PCB designs, a parallel plate waveguide (PPW) structure is employed for a power bus. This structure significantly produces the wideband-radiated emissions resulting from parallel plate modes. To suppress the parallel plate modes in the wideband frequency range, the power buses based on the electromagnetic bandgap structure with a defected ground structure (DGS) are presented. DGSs are applied to a metal plane that is connected to a rectangular EBG patch by using a via structure. The use of the DGS increases the characteristic impedance value of a unit cell, thereby substantially improving the suppression bandwidth of the radiated emissions. It is experimentally demonstrated that the DGS-EBG structure significantly mitigates the radiated emissions over the frequency range of 0.5 GHz to 2 GHz as compared to the PPW.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.281-281
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• 2013

본 연구에서는 고출력 금속 인쇄회로기판(Metal PCB) 개발을 위해 절연층으로 양극산화막을 형성하고 이 절연층 위에 Screen Printing 법을 이용하여 Ag paste를 패턴 인쇄한 알루미늄 기판을 사용하였다. 이 기판 위에 무전해 방식으로 구리 박막을 성장시켜, 무전해 도금 조건이 구리 박막 성장에 미치는 영향에 대해 연구하였다. 무전해 도금 시, pH 농도와 plating 온도를 변화시켜 이 변화에 따른 무전해 구리도금 박막의 물리적/전기적 특성을 비교 분석하여 무전해 도금에 의해 형성된 구리 박막과 기판과의 상관 관계도 비교 검토하였다. XRD (X-ray Diffraction), 광학현미경, FE-SEM (Field Emission Scanning Electron Microscope)등을 이용하여 성장된 구리 박막 및 기판의 결정성, 표면 및 단면 형상 등을 측정하였고, XPS (X-ray Photoelectron Spectroscopy)를 이용하여 무전해 도금에 의한 Cu의 화학구조 및 불순물 상태를 조사하였다.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.2643-2645
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• 2005

The power source of inverter welder stable power of low voltage and high current. Because if shouldn't be, it is caused to spark between the parent metal and the peak. So that, we designed to be base on high frequency transformer and reactor of DC part. Then, we optimized control of PWM, current rising slant, voltage, current, pulse current and inverter out-put voltage. Also we designed PCB for EMI and noises.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1432-1435
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• 2006

We report on carbon nano-fibers (CNFs) for applying to epoxy as a highly thermal conductive adhesive. In order to fabricate CNFs, electro-spinning process was performed with polyacrylonitrile (PAN) solutions. The sample was stabilized at the annealing temperature of $360^{\circ}C$, and carbonized from 900 to $1100^{\circ}C$. It is shown that the synthesized CNFs have a good thermal conductivity of several hundred W/m K. LED backlight units (BLUs) fabricated with MPCB using CNF-mixed epoxy give a better heat dissipation and higher performance than normal LED BLUs. On the basis of SEM, XRD, and FTIR, the characteristics of CNFs are described.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• Proceedings of the KIEE Conference
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• 2003.07d
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• pp.2772-2774
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• 2003

The power source of inverter welder stable power of low voltage and high current. Because if shouldn't be, it is caused to spark between the parent metal and the peak. So that, we designed to be base on high frequency transformer and reactor of DC part. Then, we optimized control of PWM, current rising slant, voltage, current, pulse current and inverter out-put voltage. Also we designed PCB for EMI and noises.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.217-218
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• 2007

Aluminum 분말과 고분자를 혼합하여 고분자-금속 복합재료(polymer-metal composite)를 만들어 copper foil과 기판의 접착력을 평가하였다. Tape casting 방법을 이용하여 sheet 만들고 vacuum lamination으로 PCB(Printed Circuit Board)기판을 제조한 후 포토공정으로 peel strength pattern을 형성하였으며, 본 연구에서는 최적의 aluminum 조건을 찾기 위하여 압력, 온도, copper foil의 표면 상태와 silane 표면 코팅에 따른 aluminum-polymer복합재료의 peel strength의 변화를 확인하였다. 최적의 조건은 silane 표면 코팅 처리를 한 aluminum 분말로 $210^{\circ}C$에서 $9.7kg/cm^2$ 압력으로 matte면의 돌기 크기가 크며, 응집이 잘 되어있는 copper foil을 사용하여 13.89N의 우수한 peel strength를 구현 할 수 있었다.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1888-1889
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• 2007

The power source of inverter welder stable power of low voltage and high current. Because if shouldn't be, it is caused to spark between the parent metal and the peak. So that, we designed to be base on high frequency transformer and reactor of DC part. Then, we optimized control of PWM, current rising slant, voltage, current, pulse current and 인버터 out-put voltage. Also we designed PCB for EMI and noises.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.38-41
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• 2010

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.