• Laser Solutions
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• v.7 no.1
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• pp.37-47
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• 2004

Laser-assisted selective infiltration is a new method of building metal layers to make metal parts layer by layer, in which superheated microscopic metal droplets are infiltrated into a laser-preheated layer of microscopic metal powders. In this work, the selective infiltration of a low melting-point metal, Sn-37Pb wt%, was conducted to investigate the effects of such dominant parameters as superheating temperature, Nd:YAG laser power for preheating, substrate temperature, etc. The optimal conditions for successful selective infiltration of a single layer of microscopic metal powder were experimentally obtained

• Laser Solutions
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• v.3 no.3
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• pp.21-29
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• 2000

For the direct metal shape processing the powder feed device which is different from the widely used in rapid prototyping. is developed, The three dimensional object is shaped with the melting metal powder. The developed research has applied to rapid prototyping in ultraprecision for MEMS and medical science fields required of rapid manufacture of complex shape. The goal of this study make 3D model which has precision accuracy. Powder spreading apparatus has been more improved because that the control of powder spread is very important in layer manufacturing. It consists of the vibration motor, nozzle and tube which supplies various metal powder. This apparatus could control the spreading velocity that could control powder spreading thickness. Laser on/off switch was adapted because laser scanning velocity must be preserved constantly to prevent heat transformation of laser overheating. The error between sintered thickness md experimental one occurred by shrinkage in sintering melting process. The problem of heat transformation was solved by On/Off switching system.

• Journal of Welding and Joining
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• v.32 no.1
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• pp.66-70
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• 2014

In Ti active brazing of YSZ to STS 430 using Ag-Cu Filler Metal, the effect of Ti contents on the shear bonding strength were investigated together with the effect of brazing temperature and holding time. The addition of Ti in Ag-Cu Filler Metal increased the bonding strength up to 4.68% Ti, followed by the decrease with further addition. This seems to be caused by formation of TixOy at the reaction layer. Brazing temperature was optimized at $960^{\circ}C$ among a given temperature ranges. The addion of Sn to Ag-Cu filler metal brought the decrease of its melting temperature its melting temperature without a significant decrease of bonging strength.

• The Journal of Advanced Prosthodontics
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• v.9 no.1
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• pp.52-56
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• 2017

PURPOSE. Considering the importance of metal-ceramic bond, the present study aimed to compare the bond strength of ceramics to cobalt-chrome (Co-Cr) alloys made by casting and selective laser melting (SLM). MATERIALS AND METHODS. In this in-vitro experimental study, two sample groups were prepared, with one group comprising of 10 Co-Cr metal frameworks fabricated by SLM method and the other of 10 Co-Cr metal frameworks fabricated by lost wax cast method with the dimensions of $0.5{\times}3{\times}25\;mm$ (following ISO standard 9693). Porcelain with the thickness of 1.1 mm was applied on a $3{\times}8-mm$ central rectangular area of each sample. Afterwards, bond strengths of the samples were assessed with a Universal Testing Machine. Statistical analysis was performed with Kolmogorov-Smirnov test and T-test. RESULTS. Bond strength in the conventionally cast group equaled $74.94{\times}16.06\;MPa$, while in SLM group, it equaled $69.02{\times}5.77\;MPa$. The difference was not statistically significant ($P{\leq}.05$). CONCLUSION. The results indicated that the bond strengths between ceramic and Co-Cr alloys made by casting and SLM methods were not statistically different.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.6
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• pp.31-37
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• 1993

InSb thin films were fabricated by zone melting recrystallization of In/Sb multilayered thin films prepared by sequential evaporation. Unreacted metal phase or dispersed metal precipitates lowered the electron mobility and the electron mobility increased with development of (111) prefered orientation. Properties of the film could be controlled by changing mzximum temperature and scanning speed, and the electron mobility as high as 12, 000 cm $^2$/Vsec could be obtained under the optimized conditions.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.434-439
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• 2020

Selective laser melting (SLM) manufactures an alloy using laser as a heat source, and has recently been introduced in the dental industry. However, there is a lack of analytical research on metal-ceramic restorations achieved by SLM. This study evaluates and compares the metal-ceramic bond strength of Co-Cr alloys produced by selective laser melting and casting methods. Co-Cr samples required for this study were produced through the sintering process of ceramics, by applying the SLM and CAST methods. The metal-ceramic bond strength was measured by applying the shear bond strength test. In order to determine the area fraction of adherent ceramic, Si content of the specimen was measured using scanning electron microscopy SEM/ EDS. Results of the metal-ceramic bond strength and AFAC were analyzed by t-test (α = 0.05). No significant difference was observed comparing the bond strength of SLM and CAST Co-Cr alloys (P> 0.05). However, the SLM group had much better ceramic adherence than the CAST group (P < 0.001). Moreover, oxidation characteristics were similar for both SLM and CAST Co-Cr alloys, but metal structures were different. These results imply that although the bond of ceramic and Co-Cr alloy is not related to the manufacturing method, SLM alloys impart better ceramic adherence. This indicates that alloys made with SLM can be used to fabricate upper implant prostheses in the future. In particular, it is expected to overcome the shortcomings of the CAST method, and save time and cost.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.659-663
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• 2001

In Japan, the municipal solid waste, which amounts to 50 million tons, is generated every year and most of it is incinerated. The bottom and fly ashes are disposed to the registered disposal areas under the provisions of The Waste Disposal and Public Cleaning Law. Especially, as the fly ash from the municipal waste incineration (the primary fly ash) contains heavy metals (lead, zinc, etc) and dioxins, it cannot be disposed directly without decontamination, such as moiling, cementation, chelating and dissolving processes provided in the law. However, these procedures for decontamination, except melting, are not enough for dioxins. Even in case of melting, the fly ash from the process (the secondary fly ash) contains high concentration of heavy metals (e.g., Zn; 1-20%, Pb; 1-10%). For these reasons, Metal Mining Agency of Japan (MMAJ), a governmental organization, started a four-year project to develop the treatment technologies of these fly ashes in 1999. The purpose of the project is to establish the integrated technologies to recover the valuable metals from, and to decontaminate, the primary and secondary fly-ashes in the practical scale by utilizing the existing metallurgical processes and facilities, along with the energy saving and the reduction of the environmental impact.

• Journal of Korean Society for Atmospheric Environment
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• v.22 no.1
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• pp.35-41
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• 2006

The steel foundries with electric arc furnaces handling metal scraps have recently gained an attention as a potential source of dusts. The present study focuses on the analysis of dust emissions and removals during furnace charging and melting processes by commercial CFD software named FLUENT. A body fitted grid system consisting of 880,000 meshes was first generated by Gambit for the electric arc furnace with the capacity of 60 ton/cycle and then FLUENT was invoked to solve the corresponding NavierStokers equation for the momentum, temperature and dust concentration. The entire processes from metal charging to metal melting were simulated to investigate the unsteady behaviors of fluid flows and dust concentrations. The model simulation results showed that as the top of the electric arc furnace opened for metal charging, hot plumes bursted out from the furnace rose strongly by buoyance and escaped mostly through the main hood. Therefore, the capacity of main hoods determined the vent efficiency in the metal charging process. As the furnace was closed after the metal charging and the metal melting processes was followed, the hot flow stream stretching from the furnace to the main hood was dissipated fast and the flow from the inlet of the bottom of the left hand side to the main and monitoring hoods constituted the main stream. And there was only a slow flow in the right hand side of the furnace. Therefore, the dust concentrations were calculated higher in the left hand side of the furnace, which was consistent with observations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.6
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• pp.262-266
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• 2004

Rutile single crystals were grown by the skull melting method. Ti metal ring was used for initial RF induction heating. The grown crystals were cut into wafer of 5.5 mm diameter and 1mm thickness. The wafers were annealed in air at $1300^{\circ}C$ up to 15 hours and their transmittance spectra $(\lambda= 200~25000 nm)$ were obtained.