• Title/Summary/Keyword: Metal Frame Coupling

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Reduction of Radio-Frequency Interference in Metal-Framed Smartphone Using EBG Structures (EBG 구조를 이용한 메탈 프레임 스마트폰 내의 전자파 간섭 저감)

  • Park, Hyun Ho
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.10
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    • pp.945-948
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    • 2016
  • Recent premium smartphones commonly employ a metal frame and this trend is currently spreading over mid-range smartphones. However, the metal frame becomes a good coupling path of electromagnetic noises emitted from digital components in smartphones and then increases radio-frequency interference(RFI) to RF antennas located at top and bottom sides of smartphones. This paper proposed a metal frame with EBG(Electromagnetic Band Gap) structure to reduce the noise coupling to antenna by suppressing surface wave on the metal frame. By simulation, it is confirmed that the proposed metal frame with $7{\times}6$ mushroom-type EBG array pattern with multi-via can reduce the noise coupling to RF antenna by about 20 dB.

Design of Multi-band Antenna Using Metal Frame Coupling for Wearable Device Application (메탈 프레임 커플링을 이용한 웨어러블 디바이스용 다중대역 안테나 설계)

  • Lee, Kyunghak;Han, Minseok
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.10 no.6
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    • pp.522-528
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    • 2017
  • In this paper, we propose a multi-band antenna for wearable devices using metal frame coupling. The proposed antenna has a $45mm{\times}35mm$ antenna using metal frame and a ground dual coupling structure. The proposed multi-band antenna in this paper is optimized for small devices such as wearable devices. By using the metal frame as a part of the antenna, the volume of the antenna is reduced and satisfies under VSWR 3:1 impedance bandwidth of 70 MHz (870 ~ 940 MHz) in low frequency band, 280 MHz (1600 ~ 1880 MHz) and 280 MHz (1900 ~ 2170 MHz) in high frequency band. It also verified the applicability of wearable devices by measuring wireless performance indicators such as TRP/TIS.

Temperature effect on seismic performance of CBFs equipped with SMA braces

  • Qiu, Canxing;Zhao, Xingnan
    • Smart Structures and Systems
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    • v.22 no.5
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    • pp.495-508
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    • 2018
  • Shape memory alloys (SMAs) exhibit superelasticity given the ambient temperature is above the austenite finish temperature threshold, the magnitude of which significantly depends on the metal ingredients though. For the monocrystalline CuAlBe SMAs, their superelasticity was found being maintained even when the ambient temperature is down to $-40^{\circ}C$. Thus this makes such SMAs particularly favorable for outdoor seismic applications, such as the framed structures located in cold regions with substantial temperature oscillation. Due to the thermo-mechanical coupling mechanism, the hysteretic properties of SMAs vary with temperature change, primarily including altered material strength and different damping. Thus, this study adopted the monocrystalline CuAlBe SMAs as the kernel component of the SMA braces. To quantify the seismic response characteristics at various temperatures, a wide temperature range from -40 to $40^{\circ}C$ are considered. The middle temperature, $0^{\circ}C$, is artificially selected to be the reference temperature in the performance comparisons, as well the corresponding material properties are used in the seismic design procedure. Both single-degree-of-freedom systems and a six-story braced frame were numerically analyzed by subjecting them to a suite of earthquake ground motions corresponding to the design basis hazard level. To the frame structures, the analytical results show that temperature variation generates minor influence on deformation and energy demands, whereas low temperatures help to reduce acceleration demands. Further, attributed to the excellent superelasticity of the monocrystalline CuAlBe SMAs, the frames successfully maintain recentering capability without leaving residual deformation upon considered earthquakes, even when the temperature is down to $-40^{\circ}C$.