• Title/Summary/Keyword: Metal 3D Printing

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Heat Dissipation Trends in Semiconductors and Electronic Packaging (반도체 및 전자패키지의 방열기술 동향)

  • S.H. Moon;K.S. Choi;Y.S. Eom;H.G. Yun;J.H. Joo;G.M. Choi;J.H. Shin
    • Electronics and Telecommunications Trends
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    • v.38 no.6
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

A study on the effects of polymer core gate sizes on thickness shrinkage rate (폴리머코어 게이트 크기 변화가 두께 방향 수축률에 미치는 영향에 대한 연구)

  • Choi, Han-Sol;Jeong, Eui-Chul;Park, Jun-Soo;Kim, Mi-Ae;Chae, Bo-Hye;Kim, Sang-Yun;Kim, Yong-Dae;Yoon, Kyung-Hwan;Lee, Sung-Hee
    • Design & Manufacturing
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    • v.14 no.1
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    • pp.1-7
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    • 2020
  • In this study, the variation of the shrinkage in the thickness direction of the molded parts according to the gate size of the polymer core fabricated through the 3D printer using the SLS method was studied. The polymer cores are laser sintered and the powder material is nylon base PA2200. The polymer cores have lower heat transfer rate and rigidity than the metal core due to the characteristics of the material. Therefore, the injection molding test conditions are set to minimize the deformation of the core during the injection process. The resin used in the injection molding test is a PP material. The packing condition was set to 80, 90 and 100% of the maximum injection pressure for each gate size. The runner diameter used was ∅3mm, and the gates were fabricated in semicircle shapes with cross sections 1, 2, and 3 ㎟, respectively. Thickness measurement was performed for 10 points at 2.5 mm intervals from the point 2.5 mm away from the gate, and the shrinkage to thickness was measured for each point. The shrinkage rate according to the gate size tends to decrease as the cross-sectional area decreases as the maximum injection pressure increases. The average thickness shrinkage rate was close to 0% when the packing pressure was 90% for the gate area of 1mm2. When the holding pressure was set to 100%, the shrinkage was found to decrease by 3% from the standard dimension due to the over-packing phenomenon. Therefore, the smaller the gate, the more closely the molded dimensions can be molded due to the high pressure generation. It was confirmed that precise packing process control is necessary because over-packing phenomenon may occur.

Flexural strength of various kinds of the resin bridges fabricated with 3D printing (3D 프린팅으로 제작된 여러 종류의 레진브릿지의 굴곡강도에 대한 연구)

  • Park, Sang-Mo;Kim, Seong-Kyun;Park, Ji-Man;Kim, Jang-Hyun;Jeon, Yoon-Tae;Koak, Jai-Young
    • Journal of Dental Rehabilitation and Applied Science
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    • v.33 no.4
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    • pp.260-268
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    • 2017
  • Purpose: Manufacturing with AM (Additive manufacturing) technique has many advantages; but, due to insufficient study in the area, it is not being widely used in the general clinic. In this study, differences of flexural strength among various materials of 3 unit fixed dental prosthesis were analyzed. Materials and Methods: A metal jig for specimens that had a 3-unit-fixed dental prosthesis figure were fabricated. The jigs were made appropriately to the specifications of the specimens. Three different kinds of materials of specimens which were NC (mathacrylic esther based), DP-1 (Bisphenol A epoxy acrylate type oligomer based), and DT-1 (urethane acrylate based) were printed with DLP machine. Five specimens for each kind of material were printed with an angle of $30^{\circ}$ from the horizontal surface. The specimens were placed on the jig and the flexural strength was measured and recorded using Universal testing machine. The recorded data was analyzed in SPSS using One-way ANOVA and Tukey HSD to determine the significance of the differences of flexural strength among the groups. Results: The flexural strengths of each group were the followings: NC, $1119{\pm}305$ N; DP-1, $619{\pm}150$ N; DT-1, $413{\pm}65N$. Using One-way ANOVA and Tukey Honestly Significant Difference test, significant difference was found between NC and the other groups (P < 0.05), but there was no significant difference between DP-1 and DT-1 (P > 0.05). Conclusion: Higher flexural strength was shown in 3-unit-fixed dental prosthesis that were 3D printed using a DLP machine with NC material.