• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.175-180
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• 2008

This paper is dedicated to the development of cooling devices such as mLHP with Fan-Fin system limited by noise and vibration. As we know, Heat pipe has the limitation of cooling capability to cool down the electronics. It is bounded by capillary and thermal limitation but heat load that it has to deal with is increasing. Especially Today's electronic technology has a tendency to integrate lots of function into the small piece of a processor like Dual core having 35W heat load for mobile and desktop computer respectively. There is an optimum operating condition of temperature, below $70^{\circ}C$, during the maximum heat load, 35W. There is the motivation needed to develop the new type of cooling devices and we can discuss about the new challenge beyond heat pipe.