• Journal of the Semiconductor & Display Technology
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• v.7 no.2
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• pp.35-38
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• 2008

This study shows the improvement of PR-Ashing rates in semi-conductor process using Atmospheric Plasma. Taguchi method is used to improve Ashing rates of photo-resist that is spread on the surface of a wafer. Improvement of Ashing rates is acquired through the decision of the effective factors and suitable combination of the factors. The results show the contribution rate of each factor and the effectiveness of Plasma for PR-Ashing process in this system.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.26-30
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• 2020

In this paper, we studied the problem if the experiment number occurring in order to identify defect in scaffold. We need to change each of the 5 print factor to predict defect when printing disk type scaffold using FDM 3d printer. So then the number of scaffold print will be more than 100,000 times. This experiment number is difficult to perform in the field. In order to solve this problem, we have produced a prediction model based on machine learning multiple linear regression using print conditions and defect scaffold data for print conditions. The prediction model produced was verified through experiments. The verification confirmed that the error was less than 0.5 %. We have confirmed that satisfied within the target margin of error 5 %.

• Proceedings of the KAIS Fall Conference
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• 2008.05a
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• pp.302-305
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• 2008

본 논문에서는 상압 플라즈마 방식이 적용된 반도체 에싱공정의 포토레지스트 에싱율을 향상시키기 위한 연구가 수행되었다. 웨이퍼 표면에 도포된 포토레지스트의 에싱율을 높이기 위하여 공정에 다구찌 기법을 적용하여 실험하였다. 유의한 인자를 파악하고 적합한 인자의 조합을 결정하여 에싱율 향상을 위한 효율적인 접근을 시도하였다. 이 연구는 상압플라즈마 방식이 적용된 에싱공정에서 개별 인자가 지니고 있는 시스템에 대한 기여율에 대하여 나타내었으며 또한 포토레지스트 에싱에 대한 플라즈마의 효용성을 보여준다.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.1-5
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• 2019

This study has been focused on properties of surface technology for large diameter upper electrode using in high density plasma process as like semi-conductor manufacturing process. The experimental studies have been carried out to get mirror surface for upper electrode. For a formation of high surface quality upper electrode, single crystal silicon upper electrode has been mechanical and chemical machining worked. Mechanical machining work of the upper electrode is carried out with varying mesh type using diamond wheel. In case of chemical machining work, upper electrode surface roughness was observed to be strongly dependent upon the etchant. The different surface roughness characteristics were observed according to etchant. The machining result of the surface roughness and surface morphology have been analyzed by use of surface roughness tester, laser microscope and ICP-MS.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.46-50
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• 2019

In this paper, We used the regression model of machine learning for improve the print quantity problem when which print scaffold with 400 ㎛ pore using FDM 3d printer. We have difficult to experiment with changing all factors in the field. So we reduced print quantity by selected two factors that most impact the pore size. We printed and measured scaffold 5 times under same conditions. We created regression model using scaffold pore size and print conditions. We predicted pore size of untested print condition using the regression model. After print scaffold with 400 ㎛ pore, we printed scaffold 5 times under same conditions. We compare the predicted scaffold pore size and the measured scaffold pore size. We confirmed that error is less than 1 % and we verified the results quantitatively.

• Journal of the Semiconductor & Display Technology
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• v.18 no.2
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• pp.92-97
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• 2019

In this paper, we investigated the problems and solutions in the production of scaffolds using commercially available FDM 3D printers. We used ADRIGE TRIZ algorithm to systematically analyze the problems and suggest solutions. We printed scaffolds using suggested solutions. We measured the pore size and printing time of the scaffolds. We have confirmed that the printing precision is greater than 99% and the printing time is decreased by half. The suggested solutions proved its validity through experiments and showed satisfactory results.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.106-110
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• 2017

Due to the plasma applied from the outside, which acts as an etchant during the etching process, considerable heat is transferred to the wafer and a separate cooling process is performed to effectively remove the heat after the process. In this case, a direct cooling method using a refrigerant is suitable for cooling through effective heat exchange. The direct cooling method using the refrigerant using the latent heat exchange is superior to the cooling method using the sensible heat exchange. Therefore, in this paper, AMESim is used to design a direct refrigerant cooling system using latent heat exchange simulator was built.The constructed simulator is reliable compared with the actual experimental results. It is expected that this simulator will help to design and search for optimal process conditions.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.46-50
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• 2018

The purpose of this study is to analyze effects of filtering system of cutting fluid which is used for machining silicon electrode. For the research, different sizes of filter clothes are applied to check grain size of sludge of cutting fluid. Surface roughness of machined workpiece, depth of damage inside of silicon electrode, and suspended solids of cutting fluid are experimented and analyzed. From these experiments, it is verified that filtering system of cutting fluid is very important factor for machining. Results of this study can affect various benefits to the semiconductor industry for better productivity and better atmospheric pollution in workplace.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.70-75
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• 2018

In this paper, we have studied the deformation problem of the scaffold caused by the FDM type 3D printer. The DOE (Design of experiment) and 3SC was used to solve the deformation problem of the scaffold generated from the adhesion surface between the scaffold and the bed. The methodology was used to derive the solution and the experiment was conducted on the derived solution. As a result of evaluating the experimental results obtained for the solution, it was found that the deformation of the scaffold was much improved. By using the DOE, We were possible to derive the output condition of scaffold.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.98-105
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• 2017

In the display industry, the residual vibration of the transfer robot can increase the process time and cause the breakage of the glass substrate, which is critical to productivity of display manufacturing. In this paper, the natural frequencies of transfer robot are analyzed by finite element method. On the basis of the analyzed data, we investigated the response characteristics of input shaping control with or without the glass presence on the hand of the transfer robot using MATLAB program, and compared with the current response characteristics of input shaping control applied to the industry. Based on this, we suggest an optimal residual vibration control method for the practical application in display industry.