• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.1
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• pp.58-61
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• 2016

Degradation in power cables used in distribution lines to the material of the wire, manufacturing method, but also the line of the environment, generates a variety of degradation depending upon the type of load. The local wire deterioration weighted wire breakage accident can occur frequently, causing significant proprietary damage can lead to accidents and precious. In this study, the signal detected by the eddy current aim to develop algorithms capable of determining the signals for the top part and at least part of the signal by using a signal processing technique called K-means algorithm.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.121-126
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• 2012

Piezoresistive type contact force sensor array is fabricated by (111) Silicon bulk micromachining for continuous blood pressure monitoring. Length and width of the unit sensor structure is $200{\mu}m$ and $190{\mu}m$, respectively. The gap between sensing elements is only $10{\mu}m$. To achieve wafer level packaging, the sensor structure is capped by PDMS soft cap using wafer molding and bonding process with $10{\mu}m$ alignment precision. The resistance change over contact force was measured to verify the feasibility of the proposed sensor scheme. The maximum measurement range and resolution is 900 mm Hg and 0.57 mm Hg, respectively.

• Journal of Power Electronics
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• v.10 no.6
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• pp.587-594
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• 2010

The paper reports about methodology at design of interactive e-learning modules that are suitable both for teaching and learning. They cover special topics of electrical engineering, starting from the fundamentals, through electrical machines, power electronics to the fields of controlled electromechanical energy conversion, like electrical drives, complex drive systems, application of drives, mechatronic systems, telemanipulation, and robotics. In the paper, the emphasis is devoted in detail to philosophy and realization of the modules from fields of Power Electronics and Electrical Drives. On several examples there are explained main principles and specialties at their development.

• Journal of the Korean Institute of Gas
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• v.18 no.5
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• pp.1-5
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• 2014

As high-tech science has developed, the need of semiconductor is required constantly. However, there are many processes which use a great deal of poisonous gas in the semiconductor process, so the dangerousness by a gas leak is latent in these processes. Especially, the accident of toxic gas is almost made by ammonia and chlorine. Therefore this report estimates the damage by the leak of ammonia and chlorine used in LPCVD system.

• Proceedings of the KAIS Fall Conference
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• 2008.05a
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• pp.313-315
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• 2008

본 논문에서는 지하격납형 LPG저장탱크에서의 가스누출로 인한 폭발의 가능성을 파악하기 위한 것으로, 국내 LPG저장탱크의 설치는 가스관계법에 의하여 지상형과 지하매몰형이 있으며, 지상형은 화염 등에 의한 위험성이 높으며, 지하매몰형은 부식 등에 의한 경제적 손실이 크다. 따라서 지상형과 지하매몰형의 장점을 취한 지하격납형 LPG저장탱크의 안전성을 통한 법 적용여부를 파악하기 위한 기본연구이다.

• Proceedings of the KAIS Fall Conference
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• 2008.05a
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• pp.49-51
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• 2008

가스의 수요가 늘어나면서 대량수요처에 대한 위험성과 안전성을 확보하기 위한 노력이 필요한 시점이다. 본 연구에서는 LPG저장탱크의 안전성과 경제성을 고려한 저장탱크를 파악하기 위하여 TRIZ 기법을 활용하였다. 지상형은 화염 등에 의한 위험성이 높으며, 지하매몰형은 부식 등에 의한 경제적 손실이 크다. 따라서 지상형과 매몰형에 대한 문제점을 해결하기 위해 6SC(6 Step Creativity)을 응용하였으며, 그 결과 지하격납형을 도출하였다.

• Journal of the Semiconductor & Display Technology
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• v.9 no.3
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• pp.35-39
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• 2010

Interfacial stress singularity induced in an analysis model consisting of the polymeric thin film and the elastic substrate has been investigated using the boundary element method. The interfacial singular stresses between the viscoelastic thin film and the elastic substrate subjected to a uniform moisture ingression are investigated for the case of a small interfacial edge crack. It is assumed that moisture effects are assumed to be analogous to thermal effects. Then, the overall stress intensity factor for the case of a small interfacial edge crack is computed. The numerical procedure does not permit calculation of the limiting case for which the edge crack length vanishes.

• Journal of the Semiconductor & Display Technology
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• v.17 no.2
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• pp.61-66
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• 2018

The objective of this research study is to investigate the optimal process parameters of electrical discharge machining (EDM) on SCM440 steel with copper as a tool electrode. The effect of various process parameters on machining performance is investigated in this study. Modern ED machinery is capable of machining geometrically complex or hard material components, that are precise and difficult-to-machine such as heat treated tool steels, composites, super alloys, ceramics, etc. This paper reports the results of an experimental investigation by Taguchi method carried out to study the effects of machining parameters on material surface roughness in electric discharge machining of SCM440 steel. To predict the optimal condition, the experiments are conducted by using Taguchi's L27 orthogonal array. The work material was ED machined with copper electrodes by varying the pulsed current, pulse on-time, voltage, servo speed and spark speed. Investigations indicate that the surface roughness is strongly depend on pulsed current.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.79-84
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• 2017

This paper outlines the Taguchi optimization methodology, which is applied to optimize cutting parameters in end milling when machining STS304 with TiAlN coated SKH59 tool under up and down end milling conditions. The end milling parameters evaluated are depth of cut, spindle speed and feed rate. An orthogonal array, signal-to-noise (S/N) ratio and analysis of variance (ANOVA) are employed to analyze the effect of these end milling parameters. The Taguchi design is an efficient and effective experimental method in which a response variable can be optimized, given various control and noise factors, using fewer resources than a factorial design. An orthogonal array of $L_9(33)$ was used. The most important input parameter for cutting force, however, is the feed rate, and depending on the cutter rotation direction. Finally, confirmation tests verified that the Taguchi design was successful in optimizing end milling parameters for cutting force.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.