• 제목/요약/키워드: Mechanics' Institute

검색결과 2,807건 처리시간 0.031초

Diplexer 구조를 이용한 Dual Band 방향성 커플러 (A Dual Band Directional Coupler with Feedback Compensation Using Diplexer Structure)

  • 김기중;박자영;정영학;배효근;김남흥;김학선
    • 한국전자파학회논문지
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    • 제16권8호
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    • pp.783-789
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    • 2005
  • 본 논문은 glass 기판 위에 RE IPD(Integrated Passive Device) 기술을 이용하여 dual band 방향성 커플러의 새로운 설계와 구현을 하였으며, 이러한 구조는 전력 증폭기의 출력부에 closed loop 전력 제 어용 GSM/GPRS cellular phones에 적용할 수 있다. 커플러는 방향성 향상을 위하여 보상 capacitor를 이용하였으며, 상호 밴드의 간섭을 최소화하기 위하여 새로운 방법의 필터링 구조(diplexer)를 갖는 커플러를 구현하였다.

전자장치 응용을 위한 금속(은, 구리) 나노입자의 합성 (Synthesis of Metal Nanoparticles for the Application of Electronic Device)

  • 전병호;조수환;조정민;김성은;김동훈;김성진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.53-53
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    • 2010
  • The development of synthetic pathway to produce a highly yield nanoparticles is an important aspect of industrial technology. Herein, we report a simple, rapid approach to synthesize organic-soluble Cu and Ag nanoparticles in colloidal method for the application in a conductive pattern using inkjet printing. The silver nanoparticles have been synthesized in highly concentrated organic phase. The Cu nanoparticles have been synthesized by the reducing of the copper oxide materials using acid molecules in high concentrated organic phase. Their sintering and electric conductivity properties were investigated by melting process between $200^{\circ}C$ and $250^{\circ}C$ for application to printed electronics.

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Thermal stabilities and dynamic mechanical properties of dielectric materials for next generation PCB

  • 조재춘;이화영;임성택;박문수;이근용;오준록
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.253-253
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    • 2008
  • Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. For making dense wiring of metal conductors, we investigated CTE and peel strength of dielectric materials for next generation PCB. It is an object of this research to develop an epoxy resin composition for an interlayer insulating material exhibiting low CTE and high peel strengnth and making an insulating layer thinner.

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Doppler LIDAR Measurement of Wind in the Stratosphere

  • Dong, Jihui;Cha, Hyun-Ki;Kim, Duk-Hyeon;Baik, Sung-Hoon;Wang, Guocheng;Tang, Lei;Shu, Zhifeng;Xu, Wenjing;Hu, Dongdong;Sun, Dongsong
    • Journal of the Optical Society of Korea
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    • 제14권3호
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    • pp.199-203
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    • 2010
  • A mobile direct detection Doppler LIDAR based on molecular backscattering for measurement of wind in the stratosphere has been developed in Hefei, China. First, the principle of wind measurement with direct detection Doppler LIDAR is presented. Then the configuration of the LIDAR system is described. Finally, the primary experimental results are provided and analyzed. The results indicate that the detection range of the designed Doppler LIDAR reached 50 km altitude, and there is good consistency between the molecular Doppler wind LIDAR(DWL) and the wind profile radar(WPR) in the low troposphere.

Etching resist와 Copper substrate 간의 Adhesion 향상을 위한 표면개질 (Surface Modification for Improving Adhesion between Etching Resist and Copper Substrate)

  • 박성준;서상훈;김용식;김태구;이상균;정재우
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.129-129
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    • 2006
  • 인쇄회로를 제작하기 위하여 기판상에 에칭 레지스트, 도금막, 절연재료, 솔더 마스크 등을 패터닝 하게 되는데, 일반적으로 이러한 유기체 막들은 대부분 액상이나 고형의 필름 형태로 패턴을 형성하게 된다. 형성된 패턴과 동박과의 접착력 향상이 가장 주요한 문제점 중의 하나이다. 상대적으로 편평한 동박면과 유기체 막과의 접착력을 향상시키기 위해 일반적으로 접촉 면적을 증가시키기 위한 표면개질을 하게 된다. 기계적 브러싱이나 스크러빙에 의해서도 기판상의 동박의 surface topography 를 개선하기 위한 노력이 시도 되고 있지만, 본 연구에서는 microetching 방법에 의해서 화학적으로 동박 표면상에 최대한 요철을 많이 형성하여 에칭 레지스트와 동박 간의 접착력을 증대시키기 위한 연구를 수행하였다.

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Camera Imaging Lens Fabrication using Wafer-Scale UV Embossing Process

  • Jeong, Ho-Seop;Kim, Sung-Hwa;Shin, Dong-Ik;Lee, Seok-Cheon;Jin, Young-Su;Noh, Jung-Eun;Oh, Hye-Ran;Lee, Ki-Un;Song, Seok-Ho;Park, Woo-Je
    • Journal of the Optical Society of Korea
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    • 제10권3호
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    • pp.124-129
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    • 2006
  • We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

Design and Development of a Single-photon Laser and Infrared Common Aperture Optical System

  • Wu, Hongbo;Zhang, Xin;Tan, Shuanglong;Liu, Mingxin;Wang, Lingjie;Yan, Lei;Liu, Yang;Shi, Guangwei
    • Current Optics and Photonics
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    • 제6권2호
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    • pp.171-182
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    • 2022
  • A single-photon laser and mid-wave infrared (MWIR) common aperture optical system was designed and developed to detect and range a long-distance civil aviation aircraft. The secondary mirror of the Ritchey-Chretien (R-C) optical system was chosen as a dichroic lens to realize the design of a common aperture system for the laser and MWIR. Point spread function (PSF) ellipticity was introduced to evaluate the coupling efficiency of the laser receiving system. A small aperture stop and narrow filter were set in the secondary image plane and an afocal light path of the laser system, respectively, and the stray light suppression ability of the small aperture stop was verified by modeling and simulation. With high-precision manufacturing technology by single point diamond turning (SPDT) and a high-efficiency dichroic coating, the laser/MWIR common aperture optical system with a 𝜑300 mm aluminum alloy mirror obtained images of buildings at a distance of 5 km with great quality. A civil aviation aircraft detection experiment was conducted. The results show that the common aperture system could detect and track long-distance civil aviation aircraft effectively, and the coverage was more than 450 km (signal-to-noise ratio = 6.3). It satisfied the application requirements for earlier warning and ranging of long-range targets in the area of aviation, aerospace and ground detection systems.

Boundary stress resolution and its application to adaptive finite element analysis

  • Deng, Jianhui;Zheng, Hong;Ge, Xiurun
    • Structural Engineering and Mechanics
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    • 제6권1호
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    • pp.115-124
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    • 1998
  • A novel boundary stress resolution method is suggested in this paper, which is based upon the displacements of finite element analysis and of high precision with stress boundary condition strictly satisfied. The method is used to modify the Zienkiewicz-Zhu ($Z^2$) a posteriori error estimator and for the h-version adaptive finite element analysis of crack problems. Successful results are obtained.

LCD Backlight용 CCFL 보호 회로에 관한 연구 (A Study of Protection Circuit for CCFL in LCD Backlight System)

  • 장유진;구본암;공정철;공승곤;신상철;민병운
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2007년도 하계학술대회 논문집
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    • pp.117-119
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    • 2007
  • 본 논문에서는 램프가 한개 이상 개방 시 피드백 제어 회로를 동작하지 않도록 하면서, 램프를 보호할 수 있는 개방전압을 출력하는 LCD 백라이트 구동용 인버터 회로도에 관한 것이다. 램프 개방전압 출력을 위한 회로는 램프 전류 피드백 블록, 개방전압시 이상신호를 감지하는 전압 피드백 블록, 램프 개수에 상관없이 최고치 값을 감지하는 블록으로 되어 있다. 전술한 회로가 내장된 인버터는 램프의 개방 시 램프의 개수 상관없이 CCFL의 보호 스펙인 2500V의 개방전압을 출력한다. 이러한 인버터가 내장된 LCD패널은 향상된 안정화 동작을 구현하게 된다.

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메탈 인쇄용 압전 헤드 제작 프로세스 연구 (Studies of Printing Head Fabrication Process For Mano Metal Printing System)

  • 유영석;김영재;심원철;박창성;정재우;오용수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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    • pp.1623-1624
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    • 2006
  • It is a paper for design, manufacture and estimation of industry inkjet head. Simulations for Actuator, Ink flow and Ejection are executed for securing design ability. Relations between droplet and properties of ink are explained closely through simulation for nozzle. Actually, two silicon plates are made by dry and wet etching and directly bonded. PZT materials is attached on the bended ink flow part and cut to $540{\mu}m$ interval by dicing saw. Actuator was seen variation within 10% between simulation and actual head. Through the ejection estimation, it is shown that stabilized driving voltages change according to viscosity and surface tension of metal ink. Using the metal ink of viscosity of 4.8 cps and surface tension of 0.025 N/m, it is possible to eject the stable droplets with 5m/s, 20 pl, 5 kHz.

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