• Title/Summary/Keyword: Mechanical Joints

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Analysis of rigid and semi-rigid steel-concrete composite joints under monotonic loading - Part II: Parametric study and comparison with the Eurocode 4 proposal

  • Amadio, C.;Fragiacomo, M.
    • Steel and Composite Structures
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    • v.3 no.5
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    • pp.371-382
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    • 2003
  • This paper analyses the response of rigid and semi-rigid steel-concrete composite joints under monotonic loading. The influence of some important parameters, such as the presence of column web stiffening and the mechanical properties of component materials, is investigated by using a three-dimensional finite element modelling based on the Abaqus code. Numerical and experimental responses of different types of composite joints are also compared with the analytical results obtained using the component approach proposed by Eurocode 4. The results obtained with this approach generally fit well with the numerical and experimental values in terms of strength. Conversely, some significant limits arise when evaluating initial stiffness and non-linear behaviour of the composite joint.

Three Dimensional Modeling and Simulation of a Wheel Loader (휠로더의 3 차원 모델링 및 시뮬레이션)

  • Park, Jun-Yong;Yoo, Wan-Suk;Kim, Heui-Won;Hong, Je-Min;Ko, Kyoung-Eun
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.870-874
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    • 2004
  • This paper presents a three dimensional modeling and simulations of operation and running of a wheel loader using the ADAMS program. A wheel loader consists of a bucket, a boom, a crank, a front frame, a rear frame, a bucket cylinder, two boom cylinders, two steering cylinders, nine spherical joints, six universal joints, five translation joints, three inline joints, a revolute and a fixed joint. Judging from the actual degrees of freedom of the wheel loader, proper kinematic joints are selected to exclude redundant constraints in the modeling. Through the running simulation over a bump with the three dimensional modeling, the joint reaction forces are calculated.

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A Study on the Fatigue Strength Evaluation of Load-Carrying Fillet welded Cruciform Joints (하중전달 십자형 필렛 용접부의 피로강도 평가에 관한 연구)

  • Lee, Yong-Bok;Nam, Byung-Chan;Park, In-Kju;Chung, Chin-Sung;Kim, Ho-Kyung
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.200-205
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    • 2000
  • Fatigue failure modes of load-carrying cruciform weld joints are dependent on the characteristics of the fatigue crack initiation and propagation from the weld toe or the weld root. In this study, constant amplitude fatigue tests on load-carrying fillet welded specimen carried out, and fatigue strengths were evaluated. Also, an attempt is made to develop a new analytical model with more accuracy to predict the fatigue crack propagation life of fillet welded cruciform joints of SWS 490B steels containing lack of penetration defects. From the result of this study, fatigue crack growth characteristics of load-carrying fillet welded cruciform joints, containing lack of penetration defects are found to be affected by the weld geometry, stress range and microstructures of the weld zone.

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A Comparative Study of the Fatigue Behavior of SnAgCu and SnPb Solder Joints (무연솔더(SnAgCu)와 유연솔더(SnPb)의 피로 수명 비교 연구)

  • Kim, Il-Ho;Park, Tae-Sang;Lee, Soon-Bok
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.12
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    • pp.1856-1863
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    • 2004
  • In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

Fatigue Analysis of Spot-welded Multi-Lap Joint of STS301L Using the Maximum Stress (최대응력을 이용한 STS301L 다중접합 점용접 이음재의 피로해석)

  • 남태헌;정원석;배동호
    • Transactions of the Korean Society of Automotive Engineers
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    • v.11 no.6
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    • pp.101-107
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    • 2003
  • Since stainless steel sheets have good mechanical properties, weldability, appearance and corrosion resistance, they are commonly used as one of the structural materials of the railroad cars or the commercial vehicles which are manufactured by the spat welding. Among the many kinds of spot welded lap joints, it can be found that multi-lap joints are employed in their body structure. But, fatigue strength of these joints is lower than that of base metal due to high stress concentration at the nugget edge of spot weld and is considerably influenced by welding conditions as well as the mechanical and geometrical factors. Thus, it is necessary to establish a reasonable and systematic design criterion for the long life design of the spot-welded body structures. In this paper, the stress distribution and deformation around the spot-welded multi-lap joints subjected to tensile shear load was numerically analyzed. Also, the $\Delta$P-Nf curve was obtained by fatigue tests. Using these results, $\Delta$P-Nf curves were rearranged in to the ${\Delta}{\sigma}$-Nf relation with the maximum stress at nugget edge of spot weld.

Strength Analysis of Bolt Joints for an Open Frame Structure (개방형 프레임 구조물의 볼트 조인트 강도해석)

  • Lee, Jin-Min;Lee, Min-Uk;Cho, Su-Kil;Koo, Man-Hoi;Gimm, Hak-In;Lee, Tae-Hee
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.8
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    • pp.819-825
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    • 2009
  • An open frame structure is fastened by bolt joints for strength and shock attenuation. Therefore the full finite element model of an open frame structure should be properly modeled including bolt joints for strength analysis of the frames and joint assemblies which are operated under multi-loading conditions such as driving, drop, inertia and torsional loads. Then the joints and frames must satisfy the specified allowable strength constraints. Because the full finite element model has a large number of elements to perform strength analysis, a detailed fine bolt analysis seems to be very expensive. Therefore bolts of the full finite element model are approximately modeled by coupling method to constrain degree of freedoms between adjacent nodes. However, the coupling method can exaggerate stress results at the constrained nodes. Thus a detailed bolt analysis and a theoretical/experiential formula of bolts for a worst bolt joint are performed using reaction force applied both bolt and bolt joint. Finally, the results from the two methods are compared and discussed to verify the safety of the open frame structure.

Constraint of Semi-elliptical Surface Cracks in T and L-joints (T-형 및 L-형 배관내 반타원 표면균열에서의 구속상태)

  • Lee, Hyeong-Il
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.9
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    • pp.1325-1333
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    • 2001
  • Critical defects in pressure vessels and pipes are generally found in the form of a semi-elliptical surface crack, and the analysis of which is consequently an important problem in engineering fracture mechanics. Furthermore, in addition to the traditional single parameter K or J-integral, the second parameter like T-stress should be measured to quantify the constraint effect. In this work, the validity of the line-spring finite element is investigated by comparing line-spring J-T solutions to the reference 3D finite element J-T solutions. A full 3D-mesh generating program for semi-elliptical surface cracks is employed to provide such reference 3D solutions. Then some structural characteristics of the surface-cracked T and L-joints are studied by mixed mode line-spring finite element. Negative T-stresses observed in T and L-joints indicate the necessity of J-T two parameter approach for analyses of surface-cracked T and L-joints.

Comparison of Impulses Experienced on Human Joints Walking on the Ground to Those Experienced Walking on a Treadmill

  • So, Byung-Rok;Yi, Byung-Ju;Han, Seog-Young
    • International Journal of Control, Automation, and Systems
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    • v.6 no.2
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    • pp.243-252
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    • 2008
  • It has been reported that long-term exercise on a treadmill (running machine) may cause injury to the joints in a human's lower extremities. Previous works related to analysis of human walking motion are, however, mostly based on clinical statistics and experimental methodology. This paper proposes an analytical methodology. Specifically, this work deals with a comparison of normal walking on the ground and walking on a treadmill in regard to the external and internal impulses exerted on the joints of a human's lower extremities. First, a modeling procedure of impulses, impulse geometry, and impulse measure for the human lower extremity model will be briefly introduced and a new impulse measure for analysis of internal impulse is developed. Based on these analytical tools, we analyze the external and internal impulses through a planar 7-linked human lower extremity model. It is shown through simulation that the human walking on a treadmill exhibits greater internal impulses on the knee and ankle joints of the supporting leg when compared to that on the ground. In order to corroborate the effectiveness of the proposed methodology, a force platform was developed to measure the external impulses exerted on the ground for the cases of the normal walking and walking on the treadmill. It is shown that the experimental results correspond well to the simulation results.

The Solderability and Mechanical Properties of In, Bi Added Sn-9Zn/Cu Joint (In, Bi가 첨가된 Sn-9wt.%Zn/Cu 접합부의 납땜성 및 기계적 성질)

  • Baek, Dae-Hwa;Lee, Kyung-Ku;Lee, Doh-Jae
    • Journal of Korea Foundry Society
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    • v.20 no.2
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    • pp.116-121
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    • 2000
  • Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

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Thermal Fatigue Life of Underfilled $\mu\textrm$ BGA Solder Joint

  • Kim, H.H.;Han, S.W.;Kim, H.I.;Choi, M.;Shin, Y.E.
    • International Journal of Korean Welding Society
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    • v.4 no.1
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    • pp.61-66
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    • 2004
  • In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

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