• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• 제16권6호
• /
• pp.622-631
• /
• 2005

In this paper, we reduce 'over and under deviation' and 'over and under testing' which have a cause of uncertainty in electromagnetic radiated immunity test. We analyze continued measurement method of field uniformity and propose new estimate method having the minimum uncertainty condition. We test comparison in 4 anechoic chambers and analyze FDI(Field Deviation Index) which is the minimum deviation excess 6 dB on fields. We obtain that the proposed test method improve 1.193 dB than domestic standard(KN 61000-4-3) and 0.017 dB than international standard (IEC61000-4-3) in every frequency. In the test result 'over and under testing point' have 926 point at every field area and have 118 point at center uniform area. These result know that proposed measurement method have 10 point less at every field area and 9 point less at center uniform area than continued measurement method. The proposed test method have few point more than continued measurement method. Therefore, we confirmed that the proposed test method have the minimum uncertainty in electromagnetic radiated immunity test.

• Journal of the Korean Society for Precision Engineering
• /
• 제18권9호
• /
• pp.61-70
• /
• 2001

This paper introduces a new digitization method with sensor fusion for shape measurement in reverse engineering. Digitization can be classified into contact and non-contact type according to the measurement devices. Important thing in digitization is speed and accuracy. The former is excellent in speed and the latter is good for accuracy. Sensor fusion in digitization intends to incorporate the merits of both types so that the system can be automatized. Firstly, non-contact sensor with vision system acquires coarse 3D point data rapidly. This process is needed to identify and loco]ice the object located at unknown position on the table. Secondly, accurate 3D point data can be automatically obtained using scanning probe based on the previously measured coarse 3D point data. In the research, a great number of measuring points of equi-distance were instructed along the line acquired by the vision system. Finally, the digitized 3D point data are approximated to the rational B-spline surface equation, and the free-formed surface information can be transferred to a commercial CAD/CAM system via IGES translation in order to machine the modeled geometric shape.

• The Journal of the Acoustical Society of Korea
• /
• 제13권3호
• /
• pp.41-50
• /
• 1994

We studied an inherent error be caused by a measuring acoustic intensity using probe which can measure simultaneously the three-dimensional acoustic intensity. This three-dimensional intensity probe was constructed with four microphones, proposed by Suzuki et al. . In the computer simulation, we analyzed the nearfield measurement error with arbitary direction and each of axis direction on the ideal point source and the plate sound source which have finite size. From the results, in case of point source, we obtained accurate measurement below about 1dB when the distance of measurement was about 2.5 times with the distance among microphones in this probe. And in the case of plate sound source, the nearfield measurement error was decreased as the length of one side became above 0.02m, we obtained accurate measurement below about 1dB when the length of one side is 0.2m. The nearfield measurement error of finite size sound is small to ignore. Therefore this probe is useful to measure nearfield intensity.

• Proceedings of the Optical Society of Korea Conference
• /
• 한국광학회 1990년도 제5회 파동 및 레이저 학술발표회 5th Conference on Waves and lasers 논문집 - 한국광학회
• /
• pp.82-86
• /
• 1990

A camera type optical bench system equipped with a lens collimator and an image analyzer is fabricated to measure the equivalent focal length and distortion of lenses. This system is automatized by the computer which controls stepping motors. A nodal slide optical bench system equipped with an off axis reflective collimator is fabricated and improved by using rotating arms and air bearing system. distortion measurement on a wide angle lens using the camera method and the nodal slide method is reported. Defocusing error in the distortion measurement with the nodal slide optical bench is analyzed and improved by iteration method to search the correct image point.

• Journal of the Korean Society of Safety
• /
• 제17권3호
• /
• pp.13-21
• /
• 2002

The tincture toughness is evaluated by using U(compact tension) and 3PB(three point bending) specimens of AI alloys far propulsive engine. To evaluate the static fracture toughness, strain gage method is used. The static fracture toughness obtained from the strain measurement is compared with the results by ASTM standard and FEM analysis. For the reliable evaluation of fracture toughness, strain gages are attached at various positions.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 한국소음진동공학회 2002년도 추계학술대회논문집
• /
• pp.950-955
• /
• 2002

ISO 140-11 specifies a method for measuring the acoustic properties of floor coverings from the view-point of reducing impact sound transmission. This test method is limited to the specification of procedures for the physical measurement of sound originating from an artificial impact source under laboratory conditions. In this study, ISO 140-11 was reviewed to applicable to domestic floor coverings installed on lightweight floors.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 한국소음진동공학회 2002년도 추계학술대회논문초록집
• /
• pp.392.2-392
• /
• 2002

ISO 140-11 specifies a method for measuring the acoustic properties of floor coverings from the view-point of reducing impact sound transmission. This test method is limited to the specification of procedures for the Physical measurement of sound originating from an artificial impact source under laboratory conditions. In this study, ISO 140-11 was reviewed to applicable to domestic floor coverings installed on lightweight floors.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1992년도 한국자동제어학술회의논문집(국내학술편); KOEX, Seoul; 19-21 Oct. 1992
• /
• pp.937-940
• /
• 1992

A cost-saving feeding rate contro method for a batch reaction process is proposed by reconfigurating the flow rate control loop where the feeding rate is estimated by differentiating weight measurement. While the existing control methods require either a flow rate measurement device or a flow rate estimator, the proposed method is devised not to require neither of these facilities by directly controlling the tank weight with a time-varying set point. Experimental evaluation in a pilot-scale unit shows that the proposed method can significantly reduce the actuator hunting of the existing method where the flow rate is estimated by differentiating the weight measurement.

• Proceedings of the Membrane Society of Korea Conference
• /
• 한국막학회 1991년도 추계 총회 및 학술발표회
• /
• pp.4-8
• /
• 1991

The characterization of pore properties (mean pore size and pore size distribution) of the active layer in a UF membrane is important not only in order to obtain information about the factors affecting pore formation during membrane manufacturing but also to understand deeply the mechanism of solute and solvent transport through pores. Many methods of characterizing quantitatively the pore properties of UF membranes have been suggested in the literature: solvent and gas flow measurement, bubble point determination, electron microscopy, gas adsorption/desorption measurement, rejection measurement etc. But most of these methods involve time-consuming procedures and involve some wellknown problems and uncertainties.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• 제7권1호
• /
• pp.47-52
• /
• 2008

We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.