• 한국전산구조공학회:학술대회논문집
• /
• 한국전산구조공학회 2001년도 가을 학술발표회 논문집
• /
• pp.353-360
• /
• 2001

Electro Electric Systems Division of HHI is developing new series of models for industrial mid/compact size motors to satisfy the demand of costumers. Various essential technologies are required for motors to support design technology on design and development stage. Conventional motors have several things to analyze for mechanical strength and structural deformation during manufacturing process or operation. Therefore, the manufacturing cost will be reduced and the danger of accident during operation will be prevented by recognizing and revising the problems prior to actual manufacturing and operation. 112 Frame motor (3.7 kW) has been analyzed for this study and the basic analysis technology is eventually developed by analyzing other models gradually (sequence of 112, 135, 250, 200, 280, 225, 160, 180 Frame motors). Then, the developed technologies are established as main factors to support the motor design technology and competitive motors will be manufactured to satisfy the costumers.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1987년도 한국자동제어학술회의논문집; 한국과학기술대학, 충남; 16-17 Oct. 1987
• /
• pp.376-381
• /
• 1987

There are many kinds of intelligent devices on the factory floor nowadays. Standardized communication methods became a necessity for efficient flow of production information among various systems. MAP (Manufacturing Automation Protocol) based on ISO (International Standard Organization) OSI (Open Systems Interconnection) is gaining acceptance of major industries worldwide.

• 한국기계가공학회지
• /
• 제14권3호
• /
• pp.21-26
• /
• 2015

Many 3D printing technologies are being used in various industries, and their demands for well-educated engineers are increasing. Moreover, novel technologies are being developed to overcome the limits of existing 3D printing technologies. In this regard, adequate education and a related curriculum especially in the Mechanical Engineering field, which is the basis of the industry, is essential. In this paper, the development of the 3D printing curriculum and its assessment in Mechanical Engineering education are proposed. The education program consisted of lectures and practice. It consisted of major 3D printing technologies, such as SLA, FDM, SLS, LOM, and Polyjet. Moreover, post-processing, room temperature vulcanizing (RTV), and coloring were also taught. The effectiveness of the proposed education program was assessed by the questionnaire survey, and the results were analyzed. Areas of improvement were deduced from the survey results.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 추계학술대회 논문집
• /
• pp.993-998
• /
• 1997

The advanced technology of micro-machining is starting to penetrate our lives. This technology, with which it is possible to make micro-structures by means of processing on the order of nm (micrometer = 1/1,000 mm) or less, is realizing machines that were only part of our wildest imagination. However, the fact is that many issues remain in the quest for a variety of applications. With the advent of computing technologies, information technologies, and telecommunications technologies, we foresee the need for new approaches in design, process, and the use of materials, technologies, and people in a globalized manufacturing enterprise. A new thinking paradigm is needed to focus on quality of service on the products we design and manufacture. Factories in different regions need to be co-ordinated through use of the state-of-the-art information on productivity, diagnostics, and service evaluation of manufacturing systems could be shared among different locations and partners. In this research, We develope the internet based Diagnosis system for micro machining and evaluate its characteristics by using mechatronic sensor like Dynamometer, acoustic emission, Acceleration sensor, micro phone, vision, infra-red thermometer.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
• /
• pp.53-58
• /
• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2008년도 추계학술대회 논문집
• /
• pp.19-20
• /
• 2008

• 한국전자거래학회지
• /
• 제23권2호
• /
• pp.123-133
• /
• 2018

최근 세계 각국은 4차 산업혁명의 중심에 있는 스마트제조 시스템 구축에 앞장서기 위하여 산학연이 협력하여 활발한 연구, 개발 및 비즈니스화를 추구해 가고 있다. 기존의 연구 보고에 따르면 우리나라는 스마트공장의 기초기술, 하드웨어, 소프트웨어 분야의 경쟁력이 선진국 대비 70% 미만의 수준으로 보고되고 있다. 본 연구에서는 기존 연구문헌 검토 및 분석을 통하여 제조업에서 스마트제조 기술의 활용사례 현황과 연구의 주요 이슈를 파악하여 핵심 기술 연구자들과 비즈니스 프로세스를 가지고 있는 기업과의 협력에 아이디어를 제공하고자 한다. 공장과 제조분야에 적용되거나 고려된 기술로는 사물인터넷이 가장 활발한 연구가 이루어지고 있었으며, CPS, 로봇의 순서로 많은 연구가 이루어지고 있음을 볼 수 있다. 각 요소 기술의 기업 적용사례를 통하여 초기 단계의 연구자와 기업과의 협력이 이루어지고 있음을 볼 수 있다.

• 한국인터넷방송통신학회논문지
• /
• 제19권5호
• /
• pp.219-227
• /
• 2019

제조업의 생산 방법은 노동집약적인 방법에서 제조설비 중심의 기술집약적인 방법으로 변경되어가고 있다. 사람의 노동력을 제조설비가 대체하게 되면서 제조설비의 모니터링과 관리의 중요성이 강조되고 있다. 또한, 최근 빅데이터 기술은 한정된 데이터에서 새로운 가치를 찾아내는 중요한 기술로 등장하였다. 따라서 제조업의 변화는 기존 제조 공장에 사물인터넷(IoT), 정보통신기술, 센서 데이터, 빅데이터를 융합한 스마트팩토리의 필요성을 증대시켰다. 본 논문에서는 제조설비 데이터를 몽고DB에 실시간으로 분산 저장 및 처리하는 기술과 R 프로그래밍을 사용한 시각화를 통해 기존 국내 제조업 공장이 빅데이터 기반의 스마트팩토리가 되기 위한 전략을 제시하고자 한다.

• 산업공학
• /
• 제18권1호
• /
• pp.88-93
• /
• 2005

There has been many research activities in the area of fault managements in distributed manufacturing environments. This paper proposes and implements web-based fault managements using web and mobile technologies. Web-based project document management system, web-based fault management system and web-based tryout management system are developed and adopted to the press die shop of a Korean automotive company. To do that, as-is and to-be business processes for fault managements are constructed. Because of its distributed environments of shops, necessities of using the mobile technology are proposed. New application for fault managements using WWW, wireless LAN, SMS and mobile phone are suggested and implemented in this paper. Using this system, agile, convenient and reliable way of fault management is realized, and knowledge management for the die manufacturing become possible.

• 한국정밀공학회지
• /
• 제28권4호
• /
• pp.513-520
• /
• 2011

The NIL processes have been studied to implement low cost, high throughput and high resolution application. A RNIL(roller NIL) is an alternative approach to flat nanoimprint lithography. RNIL process is necessary to transfer patterns on flexible substrates. Compared with flat NIL, RNIL has the advantages of better uniformity, less pressing force, and the ability to repeat the patterning process continuously on a large substrate. This paper studies the design, construction and verification of a thermal RNIL system. The proposed RNIL system can easily adopt the flat shaped hot plate which is one of the most important technologies for NIL. The NIL system can be used to transfer patterns from a flexible stamp to a flexible substrate, from a flexible stamp to a Si substrate, and from a roller stamp to a flexible substrate, etc. Patterning on flexible substrates is one of the key technologies to produce bendable displays, solar cells and other applications.