• Title/Summary/Keyword: MRR

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A Study of Syllable Maximum Repetition Rate for Stimuli, Age and Sex (검사어 및 성별.연령에 따른 음절 최대 반복 속도에 대한 연구)

  • 최홍식;차정민;심현섭
    • Journal of the Korean Society of Laryngology, Phoniatrics and Logopedics
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    • v.12 no.1
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    • pp.55-60
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    • 2001
  • Background and Objectives : Syllable Maximum Repetition Rate(MRR) is ability to repeat rapidly the articulators and is assessed for oromechanism function as one of the MPT. MRR is measured by rate(counts/sec), also simultaneously considered accuracy and consistency. The objective of the present was to examine stimuli effects and age and sex differences for MRR. Materials and Method : This study was participated 60 normal males and females(1 : 1) who were divided into two groups young(<40 years old) and old($\geq$40 years old). Stimuli were $/{P^=}a/,/{t^=}a/,/{k^=}a/,/{P^h}a/,/{t^h}a/,/{k^h}a/,/{P^=}{at^=}{ak^=}a/$ for, manner(tense and aspirated) of articulation, $/{p^h}{at^h}{ak^h}a/,/{t^h}{ap^h}{ak^h}a/$ for the effect of the order of syllable, glide /u-i/ for coordination of lip and tongue, interrupted vowel /i/ for laryngeal function. Results : There were little differences in two age groups and sex and manner of articulation for MRR tasks. The fastest average MRR of the single syllable included in this study was $/{t^=}a/$. significant differences existed between MRR for ${p^h}{at^h}{ak^h}a/ and /{t^h}{ap^h}{ak^h}a/$, which suggested that MRR was affected by the order of the syllables. MRR for interrupted vowel /i/ was about 2 counts/sec slower than average rate of 1 syllables. Conclusion : From these results, the order of the syllables was a crucial variable in MRR. rather than age or sex. There were no difference age, sex and manner of rate. The interrupted vowel repetition rate was slightly slow used and can provide basic information to assess the speech mechanism and can be useful to develop effective stimuli to differentiate the disordered group from normal.

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Study on the Lapping Characteristics of Sapphire Wafer by using a Fixed Abrasive Plate (고정 입자 정반을 이용한 사파이어 기판의 연마 특성 연구)

  • Lee, Taekyung;Lee, Sangjik;Jo, Wonseok;Jeong, Haedo;Kim, Hyoungjae
    • Tribology and Lubricants
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    • v.32 no.2
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    • pp.44-49
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    • 2016
  • Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.

Influence on Metal Removal Rate by Material and Size Difference of the Electrode (전극의 재료와 크기가 방전가공량에 미치는 영향)

  • 김희중
    • Journal of Advanced Marine Engineering and Technology
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    • v.22 no.6
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    • pp.809-815
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    • 1998
  • This study has been performed to investigate MRR(metal removal rate) surface roughness with various pulse-on duration using the copper and graphite electrode according to the electrode size on the heat treated STD 11 which is extensively used for metallic molding steel in the EDM. The results obtained are as follow ;a)MRR increases a lot when pulse-on duration is 100 $\mu{s}$ or less but MRR has little difference with pulse-on duration of 100 $\mu{s}$ or more b) According to the increase of Pulse-on duration the large the electrode size the more MRR c) Safe discharge is needed to make maximum of MRR and the metallic organization must be complicated for discharge induction. d) Actual machining time is longer than theoretical machining time at the short pulse-on duration because of skin effect of current. e) Graphite electrode needs the larger electric discharge energy than copper electrode to remove remained chips completely.

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Die-Sinking Electrical Discharge Machining with Dielectric Fluid Ejection System through the Inside of the Electrode (전극봉내 방전유 분산시스템에 의한 형조방전기공)

  • 왕덕현;우정윤
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.10 no.1
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    • pp.71-77
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    • 2001
  • Experimental study if die-sinking electrical discharge machining(EDM) was conducted with rotating electrode system including inside hole for increasing the material removal rate(MRR). With the help of dielectric fluid flow through the inside according to the different internal diameter of the hole, the molten workpiece debris could be removed and flushed out during the EDM, Cold die alloy(SKD-1) was executed for different peak current and duty factor. From this study, the MRR was found to be increased with the peak current. The more MRR was obtained for the case of electrode inside diam-eter of 10 mm, but the MRR was decreased as the diameter near at the 4mm and 6mm. The values of surface roughness and roundness were analyzed under various conditions, and these were affected by the inside diameter change of electrode.

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Material Removal Rate Modeling of SiO2/TiO2 Mixed-Abrasive Slurry CMP for SiC (SiO2/TiO2 혼합입자 슬러리 SiC CMP의 재료제거율 모델링)

  • Hyunseop Lee
    • Tribology and Lubricants
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    • v.39 no.2
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    • pp.72-75
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    • 2023
  • Silicon carbide (SiC) is used as a substrate material for power semiconductors; however, SiC chemical mechanical polishing (CMP) requires considerable time owing to its chemical stability and high hardness. Therefore, researchers are attempting to increase the material removal rate (MRR) of SiC CMP using various methods. Mixed-abrasive CMP (MAS CMP) is one method of increasing the material removal efficiency of CMP by mixing two or more particles. The aim of this research is to study the mathematical modeling of the MRR of MAS CMP of SiC with SiO2 and TiO2 particles. With a total particle concentration of 32 wt, using 80-nm SiO2 particles and 25-nm TiO2 particles maximizes the MRR at 8 wt of the TiO2 particle concentration. In the case of 5 nm TiO2 particles, the MRR tends to increase with an increase in TiO2 concentration. In the case of particle size 10-25 nm TiO2, as the particle concentration increases, the MRR increases to a certain level and then decreases again. TiO2 particles of 25 nm or more continuously decreased MRR as the particle concentration increased. In the model proposed in this study, the MRR of MAS CMP of SiC increases linearly with changes in pressure and relative speed, which shows the same result as the Preston's equation. These results can contribute to the future design of MAS; however, the model needs to be verified and improved in future experiments.

Predicting and Interpreting Quality of CMP Process for Semiconductor Wafers Using Machine Learning (머신러닝을 이용한 반도체 웨이퍼 평탄화 공정품질 예측 및 해석 모형 개발)

  • Ahn, Jeong-Eon;Jung, Jae-Yoon
    • The Journal of Bigdata
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    • v.4 no.2
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    • pp.61-71
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    • 2019
  • Chemical Mechanical Planarization (CMP) process that planarizes semiconductor wafer's surface by polishing is difficult to manage reliably since it is under various chemicals and physical machinery. In CMP process, Material Removal Rate (MRR) is often used for a quality indicator, and it is important to predict MRR in managing CMP process stably. In this study, we introduce prediction models using machine learning techniques of analyzing time-series sensor data collected in CMP process, and the classification models that are used to interpret process quality conditions. In addition, we find meaningful variables affecting process quality and explain process variables' conditions to keep process quality high by analyzing classification result.

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Greenhouse Evaluation of Melon Rootstock Resistance to Monosporascus Root Rot and Vine Decline as Well as of Yield and Fruit Quality in Grafted 'Inodorus' Melons

  • Jang, Yoonah;Huh, Yun-Chan;Park, Dong-Kum;Mun, Boheum;Lee, Sanggyu;Um, Yeongcheol
    • Horticultural Science & Technology
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    • v.32 no.5
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    • pp.614-622
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    • 2014
  • Melons (Cucumis melo L.) are generally grafted onto Cucurbita rootstocks to manage soilborne pathogens such as Monosporascus root rot and v ine decline (MRR/VD) and Fusarium wilt. However, g rafting onto Cucurbita rootstocks reportedly results in the reduction of fruit quality. In this study, the resistance to MRR/VD, yield, and fruit quality of melons grafted onto melon rootstocks were evaluated under greenhouse conditions. Eight melon rootstocks (R1 to R8) were used and the inodorus melon 'Homerunstar' was used as scion. Melon rootstocks R1 to R6 were selected based on resistance to MRR/VD under greenhouse conditions. Non-grafted 'Homerunstar' and plants grafted onto squash interspecific hybrid 'Shintozwa' rootstock (Cucurbita maxima D. ${\times}$ C. moschata D.) served as controls. Grafted melons were cultivated in the greenhouse infested with Monosporascus cannonballus during two growing seasons (summer and autumn). The responses to MRR/VD, yield, and fruit quality differed depending on the rootstocks and growing season. The melons grafted onto 'Shintozwa' exhibited less severe disease symptoms and higher survival rates than non-grafted melons in both seasons. While the melon rootstocks in the summer cultivation did not increase the survival rate compared to non-grafted melons, the melon rootstocks R1 and R2 in the autumn cultivation led to higher survival rates. The melon rootstocks resistant to MRR/VD increased the percentage of marketable fruits and marketable yields. Grafting onto the melon rootstocks caused little or no reduction of fruit quality such as low calcium content, fruit softening, and vitrescence, especially in lower-temperature autumn season. Accordingly, these results suggest that grafting onto the melon rootstocks may increase the tolerance to MRR/VD and the marketable yield without a reduction of fruit quality.

Analysis of Observational Cases Measured by MRR and PARSIVEL Disdrometer for Understanding the Physical Characteristics of Precipitation (강수의 물리적 특성 이해를 위한 MRR 및 PASIVEL 우적계의 관측사례 분석)

  • Cha, Joo-Wan;Chang, Ki-Ho;Oh, Sung-Nam;Choi, Young-Jean;Jeong, Jin-Yim;Jung, Jae-Won;Yang, Ha-Young;Bae, Jin-Young;Kang, Sun-Young
    • Atmosphere
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    • v.20 no.1
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    • pp.37-47
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    • 2010
  • The methods measuring the precipitation drop size distribution(hereafter referred to as DSD) at Cloud Physics Observation System (CPOS) in Daegwallyeong are to use PARSIVEL (PARticle SIze and VELocity) disdrometer (hereafter referred to as PARSIVEL) and Micro Rain Radar (hereafter referred to as MRR). First of all, PARSIVEL and MRR give good correlation coefficients between their rain rates and those of rain gage: $R^2=0.93$ and 0.91, respectively. For the DSD, the rain rates are classified in 3 categories (Category 1: rr (Rain Rate) ${\leq}0.5\;mm\;h^{-1}$, Category 2: $0.5\;mm\;h^-1$ < rr < $4.0\;mm\;h^{-1}$, Category 3: rr ${\geq}4\;mm\;h^{-1}$). The shapes of PARSIVEL and MRR DSD are relatively most similar in category 2. In addition, we retrieve the vertical rain rate and liquid water content from MRR under melting layer, calculated by Cha et al's method, in Daegwallyeong ($37^{\circ}41{\prime}N$, $128^{\circ}45^{\prime}E$, 843 m ASL, mountain area) and Haenam ($34^{\circ}33^{\prime}N$, $126^{\circ}34^{\prime}E$, 4.6 m ASL, coast area). The vertical variations of rain rate and liquid water content in Daegwallyeong are smaller than those in Haenam. We think that this different vertical rain rate characteristic for both sites is due to the vertical different cloud type (convective and stratiform cloud seem dominant at Haenam and Daegwallyeong, respectively). This suggests that the statistical precipitation DSD model, for the application of weather radar and numerical simulation of precipitation processes, be considered differently for the region, which will be performed in near future.

Feedrate Optimization using CL Surface (공구경로 곡면을 이용한 이송속도 최적화)

  • 김수진;양민양
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.547-552
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    • 2003
  • In mold machining, there are many concave machining regions where chatter and tool deflection occur since MRR (material removal rate) increases as curvature increases even though cutting speed and depth of cut are constant. Boolean operation between stock and tool model is widely used to compute MRR in NC milling simulation. In finish cutting, the side step is reduced to about 0.3mm and tool path length is sometimes over 300m. so Boolean operation takes long computation time and includes much error if the resolution of stock and tool model is larger than the side step. In this paper, curvature of CL(cutter location) surface and side step of tool path is used to compute the feedrate for constant MRR machining. The data structure of CL surface is Z-map generated from NC tool path. The algorithm to get local curvature from discrete data was developed and applied to compute local curvature of CL surface. The side step of tool path was computed by point density map which includes cutter location point density at each grid element. The feedrate computed from curvature and side step is inserted to new tool path to regulate MRR. The resultants wire applied to feedrate optimization system which generates new tool path with feedrate from NC codes for finish cutting. The system was applied to speaker mold machining. The finishing time was reduced to 12.6%. tool wear was reduced from 2mm to 1.1mm and chatter marks and over cut on corner were removed.

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