• Title/Summary/Keyword: MPA capping

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Comparative Study on Compressive Strength of Concrete with New Sand-Cap and Neoprene Pad

  • Park, Young-Shik;Suh, Jin-Kook
    • International Journal of Concrete Structures and Materials
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    • v.2 no.1
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    • pp.15-19
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    • 2008
  • The most typical capping method for concrete structures is a sulfur-mortar compound capping, provided it satisfied the standard criterion set forth by ASTM C 617, but this conventional bonded-type method has many problems. It exhibits relatively the smaller unreliable value of the strength of high-strength concrete due to the differences of elasticity and strength between the cylinder and the cap, and manifests poor serviceability such as dangerous working tasks or a waste of the working time. To prevent these problems, unbonded-type capping methods have taken the place of the conventional methods in recent years. One of the popular methods is the use of synthetic rubber like a neoprene pad. Serious problems still remain in this method, which include the consideration of its chemical characteristics in consideration of the selection, the safekeeping and the economy of the pads. Moreover, the synthetic rubber pads cannot be used in concrete cylinder with strength greater than 80 MPa according to ASTM C 1231-00. New 'sand-capping method' presented in this study, can be applicable to the compressive strength evaluation of the high strength concrete in the range of $70{\sim}100\;MPa$. This new method has better simplicity and reliability than those of existing 'sand-box', because usual materials such as standard sand and simply-devised apparatus are used for the capping system. The statistical analysis of the test results revealed that the new sand-capping method exhibited the smallest deviation and dispersion, attesting for its much better reliability than other methods specified in ASTM C 1231/1231M.

Biological Toxicity Changes of Mercaptoacetic Acid and Mercaptopropionic Acid Upon Coordination onto ZnS:Mn Nanocrystal

  • Kong, Hoon-Young;Hwang, Cheong-Soo;Byun, Jong-Hoe
    • Bulletin of the Korean Chemical Society
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    • v.33 no.2
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    • pp.657-662
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    • 2012
  • Mercaptoacetic acid (MAA) and mercaptopropionic acid (MPA) capped ZnS:Mn nanocrystals were synthesized and their physical characteristics were examined by XRD, HR-TEM, EDXS, and FT-IR spectroscopy. The optical properties of the MPA capped ZnS:Mn nanocrystals dispersed in aqueous solution were also measured by UV/Vis and solution photoluminescence (PL) spectra, which showed a broad emission peak around 598 nm (orange light emissions) with calculated relative PL efficiency of 5.2%. Comparative toxicity evaluation of the uncoordinated ligands, MAA and MPA, with the corresponding ZnS:Mn nanocrystals revealed that the original ligands significantly suppressed the growth of wild type E. coli whereas the ligandcapped nanocrystals did not show significant toxic effects. The reduced cytotoxicity of the conjugated ZnS:Mn nanocrystals was also observed in NIH/3T3 mouse embryonic fibroblasts. These results imply that potential toxicities of the capping ligands can be neutralized on ZnS:Mn surface.

Fluxless Bonding Method between Sn and In Bumps Using Ag Capping Layer (Ag층을 이용한 Sn과 In의 무 플럭스 접합)

  • Lee Seung-Hyun;Kim Young-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.2 s.31
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    • pp.23-28
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    • 2004
  • We utilized Ag capping layer for fluxless bonding. To investigate the effect of Ag capping layer, two sets of sample were used. One set was bare In and Sn solders. The other set was In and Sn solders with Ag capping layer. In ($10{\mu}m$) and Sn ($10{\mu}m$) solders were deposited on Cu/Ti/Si substrate using thermal-evaporation, and Ag ($0.1{\mu}m$) capping layers were deposited on In and Sn solders. Solder joints were made by joining two In and Sn deposited specimens at $130^{\circ}C$ for 30 s under 0.8, 1.6, 3.2 MPa using thermal compression bonder. The contact resistance was measured using four-point probe method. The shear strength of the solder joints was measured by the shear test of cross-bar sample in the direction. The microstructure of the solder joints was characterized with SEM and EDS. In and Sn solders without Ag capping layers were only bonded at $130^{\circ}C$ under high bonding pressure. Also the shear strength of the In-Sn solder joints under was lower than that of the Ag/In-Ag/Sn solder joints. The resistance of the solder joints was $2-4\;m{\Omega}$ The solder joints consisted of In-rich phase and Sn-rich phase and the intermixed compounds were found at the interface. As bonding pressure increased, the intermixed compounds formed more.

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White Light Emission from a Colloidal Mixture Containing ZnS Based Nanocrystals: ZnS, ZnS:Cu and ZnS:Mn

  • Lee, Jae Woog;Hwang, Cheong-Soo
    • Bulletin of the Korean Chemical Society
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    • v.35 no.1
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    • pp.189-196
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    • 2014
  • Water dispersible ZnS based nanocrystals: ZnS (blue), ZnS:Cu (green) and ZnS:Mn (yellow-orange) were synthesized by capping the surface of the nanocrystals with a mercaptopropionic acid (MPA) molecule. The MPA capped ZnS based nanocrystal powders were characterized by using XRD, HR-TEM, EDXS, FT-IR, and FT-Raman spectroscopy. The optical properties of the colloidal nanocrystals were also measured by UV/Vis and photoluminescence (PL) spectroscopies in aqueous solvents. The PL spectra showed broad emission peaks at 440 nm (ZnS), 510 nm (ZnS:Cu) and 600 nm (ZnS:Mn), with relative PL efficiencies in the range of 4.38% to 7.20% compared to a reference organic dye. The measured average particle sizes from the HR-TEM images were in the range of 4.5 to 5.0 nm. White light emission was obtained by mixing these three nanocrystals at a molar ratio of 20 (ZnS):1 (ZnS:Cu):2 (ZnS:Mn) in water. The measured color coordinate of the white light was (0.31, 0.34) in the CIE chromaticity diagram, and the color temperature was 5527 K.

Residual Stress Behavior and Characterization of Polyimide Crosslinked Networks via Ring-opening Metathesis Polymerization (개환 복분해 중합을 통한 가교형 폴리이미드 박막의 잔류응력 거동 및 특성 분석)

  • Nam, Ki-Ho;Seo, Jongchul;Jang, Wonbong;Han, Haksoo
    • Polymer(Korea)
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    • v.38 no.6
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    • pp.752-759
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    • 2014
  • Crosslinked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the crosslinked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of crosslinked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the crosslinked PI makes them potential candidates for versatile high-density multi-layer structure applications.

Thin and Hermetic Packaging Process for Flat Panel Display Application

  • Kim, Young-Cho;Jeong, Jin-Wook;Lee, Duck-Jung;Choi, Won-Do;Lee, Sang-Geun;Ju, Byeong-Kwon
    • Journal of Information Display
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    • v.3 no.1
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    • pp.11-16
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    • 2002
  • This paper presents a study on the tubeless Plasma Display Panel (PDP) packaging using glass-to-glass electrostatic bonding with intermediate amorphous silicon. The bonded sample sealing the mixed gas with three species showed high strength ranging from 2.5 MPa to 4 MPa. The glass-to-glass bonding for packaging was performed at a low temperature of $180^{\circ}C$ by applying bias of 250 $V_{dc}$ in ambient of mixed gases of He-Ne(27 %)-Xe(3 %). The tubeless packaging was accomplished by bonding the support glass plate of $30mm{\times}50mm$ on the rear glass panel and the capping glass of $20mm{\times}20mm$. The 4-inch color AC-PDP with thickness of 8 mm was successfully fabricated and fully emitted as white color at a firing voltage of 190V.

Synthesis of Ceria Nanoparticles Using Supercritical Methanol with Various Surface Modifiers (초임계 메탄올을 이용한 표면개질된 세리아 나노입자의 합성)

  • Ahn, Ki Ho;Shin, Nae-Chul;Kim, Minsoo;Youn, Yong-Suk;Hong, Giyoung;Lee, Youn-Woo
    • Korean Chemical Engineering Research
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    • v.50 no.4
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    • pp.678-683
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    • 2012
  • Ceria is one of the most important catalytic materials which can be used in three-way catalysts, waste water treatment, petroleum refining, etc. So far, many methods have been studied to produce ceria nanoparticles. In this study, ceria nanoparticles were prepared via solvothermal synthesis using supercritical methanol in short reaction time using a batch reactor. The size of synthesized ceria nanoparticles in supercritical methanol is 6 nm without capping agent, which is smaller than that made in supercritical water at the same conditions of $400^{\circ}C$ and 30 MPa. Size difference results from density and critical point difference between water and methanol and slow reaction rate at the surface of ceria particles in supercritical methanol which reduces crystal growth rate. Several organic compounds were added to modify the surface of ceria nanoparticles, and in-situ surface modification was confirmed by FT-IR and TGA analysis. Surface modified ceria nanoparticles have excellent dispersibility in organic solvent. Size and shape of surface modified ceria particles can be controlled by adjusting molar ratio of modifier to precursor and selection of modifier.