• Journal of Sensor Science and Technology
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• v.18 no.4
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• pp.301-306
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• 2009

This paper describes the design and fabrication of 16$\times$16 microbolometer infrared focal plane arrays based on iMEMS technology. Amorphous silicon was used for infrared-sensitive material, and it showed the resistance of 18 Mohm and the temperature coefficient of resistivity of -2.4 %. The fabricated sensors exhibited responsivity of 78 kV/W and thermal time constant of 8.0 msec at a bias voltage of 0.5 V. The array performances had satisfactory uniformity less than 5 % within one-sigma. Also, 1/f noise of pixel was measured and the noise factor of $6\times10^{-11}$ was extracted. Finally, we obtained detectivity of $1.27\times10^9cmHz^{0.5}/W$ and noise equivalent temperature difference of 200 mK at a frame rate of 30 Hz.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.259-262
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.24 no.5
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• pp.381-389
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• 2014

This study is concerned with the estimation of vibration-field of a cylindrical structure by modal expansion method(MEM). MEM is a technique that identifies modal participation factors using some of vibration signals and natural modes of the structure: The selection of sensor locations has a big influence on predicted vibration results. Therefore, this paper deals with four optimal sensor placement( OSP) methods, EFI, EFI-DPR, EVP, AutoMAC, for the estimation of vibration field. It also finds optimal sensor locations of the cylindrical structure by each OSP method and then performs MEMs. Predicted vibration results compared with reference ones obtained by forced response analysis. The standard deviations of errors between reference and predicted results were also calculated. It is utilized to select the most suitable OSP method for estimation of vibration field of the cylindrical structure.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.2 s.179
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• pp.146-153
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• 2006

Acceleration sensors have widely been used in the various fields of industry. In recent years, micromachining accelerometers have been developed and commercialized by the micromachining technique or MEMS technique. Typical structure of such sensors consist of a cantilever beam and a vibrating mass fabricated on Si wafers using etching. This study investigates the feasibility of powder blasting technique for microfabrication of sensor structures made of the pyrex glass alternating the existing Si based acceleration sensor. First, as preliminary experiment, effect of blasting pressure, mass flow rate of abrasive and no. of nozzle scanning on erosion depth of pyrex and soda lime glass is studied. Then the optimal blasting conditions are chosen for pyrex sensor. Structure dimensions of designed glass sensor are 2.9mm and 0.7mm for the cantilever beam length and width and 1.7mm for the side of square mass. Mask material is from aluminium sheet of 0.5mm in thickness. Machining results showed that tolerance errors of basic dimensions of glass sensor ranged from 3um in minimum to 20um in maximum. This results imply the powder blasting can be applied for micromachining of glass acceleration sensors alternating the exiting Si based sensors.

• Journal of the Korean Society of Visualization
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• v.9 no.2
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• pp.34-39
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• 2011

This paper presents a novel direct fabrication method of the thin metal film RTD temperature sensor array on an arbitrary curved surface by using MEMS technology to measure a distributed temperature field up to $300^{\circ}C$ without disturbing a fluid flow. In order to overcome the difficulty in the three dimensional photography of sensor patterning, the UV pre-irradiated photosensitive dry film resist technology has been developed newly. This method was applied to the fabrication of the temperature sensor array on a glass tube, which is arranged parallel and transverse to a main flow. Gold was used as a temperature sensing material. The resistance change was measured in a thermally controlled oven by increasing the environmental temperature. The linear increase in resistance change and a constant slope were obtained. Also, the sensitivity of each RTD temperature sensor was evaluated.

• Journal of Sensor Science and Technology
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• v.21 no.5
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• pp.339-344
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• 2012

This article describes a novel method for the detection of amyloid-${\beta}$($A{\beta}$) peptide that utilizes a photo-sensitive field-effect transistor (p-FET). According to a recent study, $A{\beta}$ protein has been known to play a central role in the pathogenesis of Alzheimer's disease (AD). Accordingly, we investigated the variation of photo current generated from p-FET with and without intracellular magnetic beads conjugated with $A{\beta}$ peptides, which are placed on the p-FET sensing areas. The decrease of photo current was observed due to the presence of the magnetic beads on the channel region. Moreover, a similar characteristic was shown when the Raw 264 cells take in magnetic beads treated with $A{\beta}$ peptide. This means that it is possible to simply detect a certain protein using magnetic beads and a p-FET device. Therefore, in this paper, we suggest that our method could detect tiny amounts of $A{\beta}$ for early diagnosis of AD using the p-FET devices.

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.473-478
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• 2004

This study focused on the charateristic of magnetic fluids, the viscosity deviation of magnetic fluids due to temperature changes, and fabrication of a 'purely' liquid type microvalve. The viscosity of magnetic fluids decreases sharply during increasing of temperature. The viscosity of magnetic fluids is rated 1,000 cP at the room temperature and 25 cP when the temperature reaches $100^{\circ}C$. Briefly, it is remarkable that the fluid flow can be controlled by the temperature and this characteristic can be adopted to the microfluidics as a microvalve. The fabrication of a liquid type microvalve is more easy than solid state microvalves and which can increase an efficiency of the controlability with respect to the thermo-pneumatic micropump which is studied broadly for many years. When the magnetic fluid used as a sealant for high level sealing, the pressure leakage is less than solid state microvalve. The experimental results show that the pressure drop in microchannel, filled with the magnetic fluid, is significant in the temperature range of $20^{\circ}C{\sim}50^{\circ}C$ and this result explains why the use of magnetic fluids is possible as a microvalve searcher uses this characteristics. Well known thermo-pnumatic.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.33 no.8
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• pp.573-579
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• 2009

A thermal mass air flow sensor, which consists of a micro-heater and thermal sensors on the silicon-nitride thin membrane structure, is micro-fabricated by MEMS processes. Three thermo-resistive sensors, one for the measurement of microheater temperature, the others for the measurement of membrane temperature upstream and downstream of the micro-heater respectively, are used. The micro-heater is operated under the constant temperature difference mode via a real time controller, based on inlet air temperature. Two design models for microfabricated flow sensor are compared with experimental results and confirmed their applicabilities and limitations. The thermal characteristics are measured to find the best flow indicator. It is found that two normalized temperature indicators can be adopted with some advantages in practice. The flow sensor with this control mode can be adopted for wide capability of high speed and sensitivity in the very low and medium velocity ranges.

• Journal of Sensor Science and Technology
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• v.19 no.3
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• pp.209-213
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• 2010

This paper describes the fabrication and characteristics of AlN piezoelectric MPG(micro power generator). The micro energy harvester was fabricated to convert ambient vibration energy to electrical power as a AlN piezoelectric cantilever with Si proof-mass. To be compatible with CMOS process, AlN thin film was grown at low temperature by RF magnetron sputtering and micro power generators were fabricated by MEMS technologies. X-ray diffraction pattern proved that the grown AlN film had highly(002) orientation with low value of FWHM(full width at the half maximum, $\theta=0.276^{\circ}$) in the rocking curve around(002) reflections. The implemented harvester showed the $198.5\;{\mu}m$ highest membrane displacement and generated 6.4 nW of electrical power to $80\;k{\Omega}$ resistive load with $22.6\;mV_{rms}$ voltage from 1.0 G acceleration at its resonant frequency of 389 Hz. From these results, the AlN piezoelectric MPG will be possible to suitable with the batch process and confirm the possibility for power supply in portable, mobile and wearable microsystems.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.9
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• pp.104-109
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• 2021

Tactile sensors and integrated circuits that detect external stimuli have been developed for use in various industries. Most tactile sensors have been developed using the MEMS(micro electro-mechanical systems) process in which metal electrodes and strain sensors are applied to a silicon substrate. However, tactile sensors made of highly brittle silicon lack flexibility and are prone to damage by external forces. Flexible tactile sensors based on polydimethylsiloxane and using a multi-walled carbon nano-tube mixture as a pressure-sensitive material are currently being developed as an alternative to overcome these limitations. In this study, a manufacturing process of pressure-sensitive materials with low initial electrical resistance is developed and applied to the fabrication of flexible tactile sensors. In addition, flexible tactile sensors are developed with pressure-sensitive materials dispensed on a substrate with flexible mechanical properties. Finally, a study is conducted on the change in electrical resistance of pressure-sensitive materials according to the modulus of elasticity of the substrate.