• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Spatial Information Research
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• v.19 no.5
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• pp.87-96
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• 2011

Recently mobile users can access to internet using smart phone at any place and any time, through which they can search and share information. In addition, as the sensors with high-tech functions become cheaper and miniaturized along with the development of MEMS (micro-electo mechanical systems) technology, the extent to utilize smart phone is increasing. Smart phone is equipped with various sensors such as high-resolution camera, GPS, gyroscope and magnetic sensor, which is an appropriate system configuration for remote monitoring research using camera. The remote monitoring system requires camera for video and internet network to send video, for which it has a limitation that it is influenced by the monitoring location. This study is aimed to design and develop the monitoring app. which can be remotely monitored using smart phone technology. The developed monitoring app was designed to take images of ROI (region of interest) within the specified time and to automatically send the images to the server. The developed app. is also possible to be remotely controlled by SMS (short message service). The monitoring proposed in this study can take high-resolution images using CMOS built in the smart phone and send the images and information to the server automatically at any place and any time using 3G and Wi-Fi networks.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2251-2253
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• 2000

MEMS기술을 이용하여 단층 실리콘 나이트라이드($Si_{3}N_4$) 다이아프램을 제조하고, 이 다이아프램상에 저항성 가열 진공증착법과 고주파 마그네트론 스퍼터링법을 이용하여 차례로 In막과 ZnO막을 증착하고, In의 도핑을 위해 열처리하여 $NH_3$ 가스 감지용 마이크로센서를 제작하였다. 감지막의 열처리온도에 따른 구조적 및 전기적 특성은 XRD, SEM, AFM, 4-point probe 및 Electrometer를 통하여 각각 조사하였다. 제작된 센서의 열처리온도와 인가전력에 따라 $NH_3$ 가스에 대한 감도, 선택성 및 시간응답 특성을 조사하였다. 감지막 두께 3000 ${\AA}$, 열처리온도 400$^{\circ}C$로 제조된 마이크로 센서가 히터 인가전력 366 mW에서 100 ppm의 $NH_3$ 가스농도에서 대하여 16 %, 350 ppm의 가스농도에서 대하여 23 %의 가장 우수한 감도를 나타내었다. 그러나 CO 가스 및 $NO_x$ 가스에 대한 감지특성은 관찰되지 않았다.

• Journal of Sensor Science and Technology
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• v.30 no.6
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• pp.388-394
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• 2021

The conventional microelectromechanical system (MEMS) process has been used to fabricate sensors with high costs and high-volume productions. Emerging 3D printing can utilize various materials and quickly fabricate a product using low-cost equipment rather than traditional manufacturing processes. 3D printing also can produce the sensor using various materials and design its sensing structure with freely optimized shapes. Hence, 3D printing is expected to be a new technology that can produce sensors on-site and respond to on-demand demand by combining it with open platform technology. Therefore, this paper reviews three standard 3D printing technologies, such as Fused Deposition Modeling (FDM), Direct Ink Writing (DIW), and Digital Light Processing (DLP), which can apply to the sensor fabrication process. The review focuses on strain/load sensors having both sensing material features and structural features as well. NCPC (Nano Carbon Piezoresistive Composite) is also introduced as a promising 3D material due to its favorable sensing characteristics.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.6 s.324
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• pp.59-68
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• 2004

Thanks to the development of microelectromechanical systems(MEMS), wireless communication technology and microsensor technology, it was Possible to manufacture a very small and low costdata acquisition node with sensing function, processing function, wireless communication function and battery. Thus sensor networks begin to be prevailed. The sensor network is a spontaneous system which sets up automatically routing paths and transmits asignificant data to the destination. Sensor nodes requires low-power operation because most of them use a battery as operating power. Sensor nodes transmit a sensing data to the destination. Moreover, they play a router. In fact, because the later consumes more energy than the former, the low-power routing is very important. Sensor networks don't have a routing standard unlike general wireless Ad-hoc networks. So This paper proposes a low-power routing method for anting to sensor networks. It is based on AODV and adapts a method to drop probably RREQ depending on remaining power. We examined it through simulations. From simulation results, we could confirm to reduce power consumption about $10-20\%$ and distribute equally power consumption among nodes.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.604-609
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• 2019

In this study, we fabricated a capacitive humidity sensor with interdigitated (IDT) electrodes using a thermosetting polyimide as a humidifying material. First, the number of electrodes, thickness, and spacing of the polyimide film were optimized, and a mask was designed and fabricated. The sensor was fabricated on a silicon substrate using semiconductor processing equipment. The area of the sensor was $1.56{\times}1.66mm^2$, and the width of the electrode and the gap between the electrodes were each $3{\mu}m$. The number of electrodes was 166, and the length of an electrode was 1.294 mm for the sensitivity of the sensor. The sensor was then packaged on a PCB for measurement. The sensor was inserted into a chamber environment with a temperature of $25^{\circ}C$ and connected to an LCR meter to measure the change in capacitance at relative humidity (RH) of 20% to 90%, 1 V, and 20 kHz. The results showed a sensitivity of 26fF/%RH, linearity of < ${\pm}2%RH$, and hysteresis of < ${\pm}2.5%RH$.

• Journal of Sensor Science and Technology
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• v.21 no.6
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• pp.402-407
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• 2012

We report a Fabry-Perot interferometer (FPI)-based multi-channel micro-spectrometer used for multi-gas measurement in the spectral range of $3-5{\mu}m$ and its gas sensing performance. The fabricated infrared (IR) spectrometer consists of two parts: an FPI on the top side for selective IR filtering and a $V_2O_5$-based IR detector array on the bottom side for the detection of the filtered IR. Experimental results show that the FPI-based multi-channel gas sensor has reliability and selectivity for simultaneously detecting environmentally harmful gases such as $CH_4$, $CO_2$, $N_2O$ and CO in the spectral range of $3-5{\mu}m$. The fabricated FPI-based multi-channel gas sensor also demonstrated that a reliable and selective detection of gas concentrations ranging from 0 to 500 ppm is feasible. In addition, the electrical characteristics demonstrate a superior response performance in regards to the selectivity in the multi-target gases.

• Journal of Sensor Science and Technology
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• v.22 no.3
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• pp.191-196
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• 2013

A particulate matter sensor fabricated by MEMS process is proposed. It is developed to accommodate Euro6 on-board diagnostics regulation for diesel automobile. In the regulation, emission of diesel particulate matter is restricted to 9 mg/km. Particulate matter sensor is designed to use induced charges by charged particulate matter. To increase sensitivity of the sensor, groove is formed on sensor surface because wider surface area generates more induced charges. Sensitivity of the sensor is measured 10.6 mV/(mg/km) and the sensor shows good linearity up to 15.7 mg/km. Also its minimum detectable range is about 0.25 mg/km. It is suitable to detect failure of a diesel particulate filter which should filter particulate matter more than 9 mg/km. For removing accumulated particulate matter on the sensor which can disturb normal operation, platinum heater is designed on the backside of the sensor. The developed sensor can sense very low amount of particulate matter from exhaust gas in real-time with good linearity.

• Electronics and Telecommunications Trends
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• v.27 no.1
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• pp.1-18
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• 2012

미래 사회는 나노기술(NT)을 바탕으로 IT-ET-BT 기술이 융합된 유비쿼터스 사회로 진화하고 있으며, 미래 산업 사회로의 전환을 위해서는 성능개선이 아닌 성능한계 돌파의 패러다임 전환이 가능한 임계성능의 나노 소재/신소자의 개발이 절실히 요구되고 있다. 또한 차세대 단말기는 휴대성의 편리함, 융복합화/다기능화, 인간 친화형이 요구되고, flexible/stretchable/bendable한 형태로 발전하고 있는 상황이다. 나노 피에조트로닉스(nanopiezotronics) 기술은 역학적 에너지를 전기적 에너지로 변환하는 나노 발전 소자(nanogenerator)의 원리를 기반으로 하며 나노선, 나노벨트와 같은 1차원적 나노구조 소재의 압전성과 반전도성이 결합된 특성을 이용한 신기능의 미래 IT 융합 나노 전자/에너지 소자를 구현하는 기술로서 미래 유망 기술로 부각되고 있다. 현재 기술 수준은 압전 전계 효과 트랜지스터, 압전-다이오드, 압전 센서, 압전 나노 발전 소자 등과 같은 prototype 소자를 제작하는 수준에 머무르고 있으나 향후 초고감도 압전 센서, 자가발전 MEMS/NEMS 및 나노 시스템, 스마트 웨어러블 시스템, 건강 모니터링 시스템, 인체 삽입형 소자, portable 및 투명 유연 전자소자 등의 다양한 미래 융합 나노 소자 및 시스템에 광범위한 활용이 가능하며, 향후 신기능의 소자/부품/시스템 창출을 위한 기술로 자리매김할 것으로 전망된다. 본고에서는 압전 나노선, 나노튜브, 나노섬유 등의 1차원적 나노구조체 기반의 nanopiezotronics 기술과 최근의 연구결과들을 소개한다.

• Journal of Sensor Science and Technology
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• v.20 no.6
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• pp.363-367
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• 2011

This paper proposes a highly-sensitive gas flow sensor with a simple structure. The sensor is composed of a micro-heater for heating the gas medium and a pair of temperature sensors for detecting temperature differences due to gas flow in a sealed chamber on one axis. Operation of the gas flow sensor depends on the transfer of heat through the air medium. The proposed gas flow sensor has the capability to measure gas flow rates <5 $cm^3$/min with a resolution of approximately 0.01 $cm^3$/min. Furthermore, this paper reports some additional experiment results, including the sensitivity of the proposed gas flow sensor as a function of operating current and the flow of different types of gas(oxygen, carbon dioxide, and nitrogen). The fabrication process of the proposed sensor is very simple, making it a good candidate for mass production.