• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1052-1057
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• 2004

A small-scale loop heat pipe with polypropylene wick was fabricated and tested for its thermal performance. The container and tubing of the system was made of stainless steel and several working fluids were used to see the difference in performance including methanol, ethanol, acetone, R134a, and water. The heating area was 35 mm ${\times}$ 35 mm and there were nine axial grooves in the evaporator to provide a vapor passage. The pore size of the polypropylene wick inside the evaporator was varied from 0.5 m to 25 m. The size of condenser was 40 mm (W) ${\times}$ 50 mm (L) in which ten coolant paths were provided. The inner diameter of liquid and vapor transport lines were 2.0 mm and 4.0 mm, respectively and the length of which were 0.5 m. The PP wick LHP was operated with methanol, acetone, and ethanol normally. R134a was not compatible with PP wick and water was unsuitable within operating limit of $100^{\circ}C$. The minimum thermal load of 10 W (0.8 W/cm2) and maximum thermal load of 80 W (6.5 W/cm2) were achieved using methanol as working fluid with the condenser temperature of $20^{\circ}C$ with horizontal position.

• Journal of ILASS-Korea
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• v.7 no.2
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• pp.31-36
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• 2002

According to the improvement of PC performance, it is expected that calorific value, which causes PC to malfunction, is increased. Therefore, the development of new cooling system is recently required. As the method to solve this problem, we applied loop heat pipe to PC cooling system. The advantage of the loop heat pipe is that it has a small size, light weight, simple shape, long life and it has a good performance on heat transfer, no-noise, wide range of applicable temperature and no supply of power from the outside. It is confirmed that loop heat pipe reduces thermal resistance and has a good performance on PC cooling.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2137-2143
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• 2008

This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.

• Proceedings of the KSR Conference
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• 2008.11b
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• pp.1710-1716
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• 2008

The Loop Heat Pipe (LHP) operates to pump the working fluid by means of the capillary force in a wick structure. Particularly, it is difficult to design and manufacture the evaporator consisted of a grooved container and a compensation chamber as well as the wick structure. This study is related to design and manufacture the grooved container coupled with wick structure, the properties of the wick structure such as the permeability, the porosity, and the maximum capillary pressure were measured to apply the cooling technology for Insulated Gate Bipolar Transistor (IGBT). The container of the LHP was manufactured by the electrical discharge process and the wick structure was sintered with the nickel particle by an axial-press apparatus with the pulse electronic discharge. As results, the properties of the wick were experimentally obtained about 60% of the porosity, 35kPa of the maximum capillary force and $1.53{\times}10-13m2$ of the permeability.

• Proceedings of the KSR Conference
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• 2008.11b
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• pp.422-429
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• 2008

The objective of the present study is to develope a propultion unit cooling system for the next-generation High-speed EMU. The propulsion power control unit consists of some IGBT semiconductors. In general, those power semiconductors are very sensitive to temperatures and need a cooling system to keep them at a proper operational conditions in the range of $50{\sim}100^{\circ}C$. In this first year of study, we tried to focuss on the understanding of fundamental technologies for each of the two different cooling systems and collecting basic data for design and manufacturing for both cases. For the water cooling system, a heat sink with multi channels of liquid flow was considered and a model unit was designed and performance test was conducted. For the heat pipe cooling system, a Loop Heat Pipe(LHP) was considered as an element to transport heat from IGBT to environment air flow and a model unit was designed and performance test was conducted. The analysis using SINDA/FLUINT showed that those design parameters are good enough for the LHP to properly operate under a heat load up to around 360W.

• Journal of Mechanical Science and Technology
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• v.19 no.4
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• pp.1052-1061
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• 2005

A small-scale loop heat pipe (LHP) with polypropylene wick was fabricated and tested for investigation of its thermal performance. The container and tubing of the system were made of stainless steel and several working fluids were tested including methanol, ethanol, and acetone. The heating area was $35\;mm\;{\times}\;35\;mm$ and nine axial grooves were provided in the evaporator to provide vapor passages. The pore size of the polypropylene wick inside the evaporator was varied from $0.5\; {\mu}m\;to\;25\;{\mu}m.$ The inner diameter of liquid and vapor transport lines were 2.0 mm and 4.0 mm, respectively and the length of which were 0.5 m. The size of condenser was $40\;mm\;(W)\;{\times}\;50\;mm\;(L)$ in which ten coolant paths were provided. Start-up characteristics as well as steady-state performance was analyzed and discussed. The minimum thermal load of $10\;W\;(0.8\;W\;/cm^{2})$ and maximum thermal load of $80\;W\;(6.5\;W\;/cm^{2})$ were achieved using methanol as working fluid with the condenser temperature of $20^{\circ}C$ with horizontal position.

• Proceedings of the SAREK Conference
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• 2003.07a
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• pp.65-65
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• 2003