• Journal of IKEEE
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• v.23 no.2
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• pp.594-598
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• 2019

We demonstrate an alternative alignment process using transferring process on solution driven HfZnO film. Parallel pattern is firstly fabricated on a silicon wafer by laser interference lithography. Prepared HfZnO solution fabricated by sol-gel process is spin-coated on a glass substrate. The silicon wafer with parallel pattern is placed on the HfZnO film and annealed at $100^{\circ}C$ for 30 min. After transferring process, parallel grooves on the HfZnO film is obtained which is confirmed by atomic force microscopy and scanning electron microscopy. Uniform liquid crystal alignment is achieved which is attributed to an anisotropic characteristic of HfZnO film by parallel grooves. The liquid crystal cell exhibited a pretilt angle of $0.25^{\circ}$ which showed a homogeneous alignment property.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.86-86
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• 2012

The new approaches for silicon solar cell of new concept have been actively conducted. Especially, solar cells with wire array structured radial p-n junctions has attracted considerable attention due to the unique advantages of orthogonalizing the direction of light absorption and charge separation while allowing for improved light scattering and trapping. One-dimenstional semiconductor nano/micro structures should be fabricated for radial p-n junction solar cell. Most of silicon wire and/or pillar arrays have been fabricated by vapour-liquid-solid (VLS) growth because of its simple and cheap process. In the case of the VLS method has some weak points, that is, the incorporation of heavy metal catalysts into the growing silicon wire, the high temperature procedure. We have tried new approaches; one is electrochemical etching, the other is noble metal catalytic etching method to overcome those problems. In this talk, the silicon pillar formation will be characterized by investigating the parameters of the electrochemical etching process such as HF concentration ratio of electrolyte, current density, back contact material, temperature of the solution, and large pre-pattern size and pitch. In the noble metal catalytic etching processes, the effect of solution composition and thickness of metal catalyst on the etching rate and morphologies of silicon was investigated. Finally, radial p-n junction wire arrays were fabricated by spin on doping (phosphor), starting from chemical etched p-Si wire arrays. In/Ga eutectic metal was used for contact metal. The energy conversion efficiency of radial p-n junction solar cell is discussed.

• Korean Journal of Materials Research
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• v.20 no.8
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• pp.444-449
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• 2010

Transparent ceramics are used in new technology because of their excellent mechanical properties over glasses. Transparent ceramics are nowadays widely used in armor, laser windows, and in high temperature applications. Silicon nitride ceramics have excellent mechanical properties and if transparent silicon nitride is fabricated, it can be widely used. h-BN has a lubricating property and is ductile. Therefore, adding h-BN to silicon nitride ceramics gives a lubricating property and is also machinable. Translucent silicon nitride was fabricated by hot-press sintering (HPS) and 57% transmittance was observed in the near infrared region. A higher wt. % of h-BN in silicon nitride ceramics does not favor transparency. The optical, mechanical, and tribological properties of BN dispersed polycrystalline $Si_3N_4$ ceramics were affected by the density, ${\alpha}:{\beta}$-phase ratio, and content of h-BN in sintered ceramics. The hot pressed samples were prepared from the mixture of $\alpha-Si_3N_4$, AlN, MgO, and h-BN at $1850^{\circ}C$. The composite contained from 0.25 to 2 wt. % BN powder with sintering aids (9% AlN + 3% MgO). A maximum transmittance of 57% was achieved for the 0.25 wt. % BN doped $Si_3N_4$ ceramics. Fracture toughness increased and wear volume and the friction coefficient decreased with an increase in BN content. The properties such as transmittance, density, hardness, and flexural strength decreased with an increase in content of h-BN in silicon nitride ceramics.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.02a
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• pp.256.2-256.2
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• 2009

• Proceedings of the Korean Vacuum Society Conference
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• 2009.02a
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• pp.256.1-256.1
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• 2009

• Journal of the Korean Vacuum Society
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• v.4 no.S1
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• pp.40-68
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• 1995

As silicon divice geometrics become smaller and aspect ratios larger, processing technoloty is moving from PVD into the area of CVD and OMCVD. Many new source materials are in the research and development stage, and have placed challenging demands on materials delivery technology. This paper will describe the many successes achieved with various delivery methods including thermal, bubblers, pressure-based and Direct Liquid Injection.

• International Journal of Air-Conditioning and Refrigeration
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• v.16 no.2
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• pp.64-69
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• 2008

Electronic and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers were designed and tested by varying geometry and operating conditions. In addition, air-cooling heat exchangers were tested to provide performance data for the comparison with the liquid-cooling heat exchangers. The liquid-cooling heat exchangers had twelve rectangular channels with different flow paths of 1, 2, and 12. Silicon rubber heaters were used to control the heat load to the heat exchangers. Heat input ranged from 293 to 800W, and inlet temperatures of working fluid varied from 15 to $27^{\circ}C$. The heat transfer coefficients were strongly affected by flow conditions. All liquid-cooling heat exchangers showed higher cooling performance than the air-cooling heat exchanger. The heat exchanger with 2-paths could provide more controllability on the maximum temperature than the others.

• Corrosion Science and Technology
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• v.4 no.4
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• pp.136-139
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• 2005

The effect of oxidation and hot corrosion on the solid particle erosion was investigated for hot-pressed silicon nitride using as-polished, pre-oxidized and pre-corroded specimens by molten sodium sulfates. Erosion tests were performed at 22, 500 and $900^{\circ}C$ using angular silicon carbide particles of mean diameter $100{\mu}m$. Experimental results show that solid particle erosion rate of silicon nitride increases with increasing temperature for as-polished or pre-oxidized specimens in consistent with the prediction of a theoretical model. Erosion rate of pre-oxidized specimens is lower than that of as-polished specimens at $22^{\circ}C$, but it is higher at $900^{\circ}C$. Lower erosion rate at $22^{\circ}C$ in the pre-oxidized specimens is attributed due to the blunting of surface flaws, and the higher erosion rate at $900^{\circ}C$ is due to brittle lateral cracking. Erosion rate of pre-corroded specimens decreases with increasing temperature. Less erosion at $900^{\circ}C$ than at $22^{\circ}C$ is associated with the liquid corrosion products sealing off pores at $900^{\circ}C$ and the absence of inter-granular crack propagation observed at $22^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.48 no.4
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• pp.288-292
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• 2011

In this study, we investigated the mechanical behavior of carbon fiber reinforced silicon carbide composites by indentation stress. Relatively porous and dense fiber reinforced ceramic composites were fabricated by liquid silicon infiltration (LSI) process. Densification of fiber composite was controlled by hardening temperature of preform and consecutive LSI process. Load-displacement curves were obtained during indentation of WC sphere on the carbon fiber reinforced silicon carbide composites. The indentation damages at various loads were observed, and the elastic modulus were predicted from unloading curve of load-displacement curve.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.111.1-111.1
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• 2011

The solar energy is dramatically increasing as the alternative energy source and the silicon(Si) solar cell are used the most. In this study, the improved process and equipment for the metallurgical refinement of multicrystalline Si were evaluated for the inexpensive solar cell. The planar plane and columnar dendrite aheadof the liquid-solid interface position caused the superior segregation of impurities from the Si. The solidification rate and thermal gradient determined the shape of dendrite in solidified Si matrix solidified by the directional solidification(DS) method. To simulate this equipment, the commercial software, PROCAST, was used to solve the solidification rate and thermal gradient. Si was vertically solidified by the DS system with Stober process and up-graded metallurgical grade or metallurgical grade Si was used as the feedstock. The inductively coupled plasma mass spectrometry (ICP) was used to measure the concentration of impurities in the refined Si ingot. According to the result of ICP and simulation, the high thermal gradient between the two phases wasable to increase the solidification rate under the identical level of refinement. Also, the separating heating zone equipped with the melting and solidification zone was effective to maintain the high thermal gradient during the solidification.