• Asian Pacific Journal of Cancer Prevention
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• v.14 no.3
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• pp.1879-1887
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• 2013

To investigate the level of genotoxicity over Bangkok atmosphere, $PM_{10}$ samples were collected at the Klongchan Housing Authority (KHA), Nonsree High School (NHS), Watsing High School (WHS), Electricity Generating Authority of Thailand (EGAT), Chokchai 4 Police Station (CPS), Dindaeng Housing Authority (DHA) and Badindecha High School (BHS). For all monitoring stations, each sample covered a period of 24 hours taken at a normal weekday every month from January-December 2006 forming a database of 84 individual air samples (i.e. $12{\times}7=84$). Atmospheric concentrations of low molecular weight PAHs (i.e. phenanthrene, anthracene, pyrene and fluoranthene) were measured in $PM_{10}$ at seven observatory sites operated by the pollution control department of Thailand (PCD). The mutagenicity of extracts of the samples was compared in Salmonella according to standard Ames test method. The dependence of the effects on sampling time and on sampling location was investigated with the aid of a calculation of mutagenic index (MI). This MI was used to estimate the increase in mutagenicity above background levels (i.e. negative control) at the seven monitoring sites in urban area of Bangkok due to anthropogenic emissions within that area. Applications of the AMES method showed that the average MI of $PM_{10}$ collected at all sampling sites were $1.37{\pm}0.10$ (TA98; +S9), $1.24{\pm}0.08$ (TA98; -S9), $1.45{\pm}0.10$ (TA100; +S9) and $1.30{\pm}0.09$ (TA100; -S9) with relatively less variations. Analytical results reconfirm that the particulate PAH concentrations measured at PCD air quality monitoring stations are moderately low in comparison with previous results observed in other countries. In addition, the concept of incremental lifetime particulate matter exposure (ILPE) was employed to investigate the potential risks of exposure to particulate PAHs in Bangkok atmosphere.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Journal of the Korean Academy of Child and Adolescent Psychiatry
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• v.24 no.2
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• pp.83-89
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• 2013

Objectives : It is known that children with attention-deficit hyperactivity disorder (ADHD) experience significant difficulty in recognizing facial emotion, which involves processing of emotional facial expressions rather than speech, compared to children without ADHD. This objective of this study is to investigate the differences in facial emotion recognition between children with ADHD and normal children used as control. Methods : The children for our study were recruited from the Suwon Project, a cohort comprising a non-random convenience sample of 117 nine-year-old ethnic Koreans. The parents of the study participants completed study questionnaires such as the Korean version of Child Behavior Checklist, ADHD Rating Scale, Kiddie-Schedule for Affective Disorders and Schizophrenia-Present and Lifetime Version. Facial Expression Recognition Test of the Emotion Recognition Test was used for the evaluation of facial emotion recognition and ADHD Rating Scale was used for the assessment of ADHD. Results : ADHD children (N=10) were found to have impaired recognition when it comes to Emotional Differentiation and Contextual Understanding compared with normal controls (N=24). We found no statistically significant difference in the recognition of positive facial emotions (happy and surprise) and negative facial emotions (anger, sadness, disgust and fear) between the children with ADHD and normal children. Conclusion : The results of our study suggested that facial emotion recognition may be closely associated with ADHD, after controlling for covariates, although more research is needed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.8
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• pp.1045-1050
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• 2010

Fatigue analysis and lifetime evaluation are very important in design procedure for assuring the safety and reliability of rubber components for mechanical systems. Till recently, the technology for the design, analysis, and evaluation of rubber products was required to manufacture rubber products with high quality, fidelity, and reliability. However, in the rubber-manufacturing companies in Korea, the processes of compound mixing, manufacturing of rubber products, and improvement of rubber properties are based on the trial-and-error method and experience. The objectives of this study are to establish methods for testing rubber materials, to develop a database of the properties of rubber materials, to evaluate the performance of rubber components, and to develop a system for predicting fatigue life. A method to predict fatigue-life of rubber components was proposed; in this method, the finite-element analysis and fatigue damage parameter as determined from a fatigue test are incorporated.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.89-98
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• 2003

The electrical and mechanical properties of sputtered Cu(Mg) films are investigated for highly reliable interconnects. The roughness, adhesion, hardness and resistance to thermal stress of Cu(Mg) film annealed in vacuum at $400^{\circ}C$ for 30min were improved than those of pure Cu film. Moreover, the flat band voltage(V$_{F}$ ) shift in the Capacitance-Voltage(C-V) curve upon bias temperature stressing(BTS) was not observed and leakage currents of Cu(Mg) into $SiO_2$ were three times less than those of pure Cu. Because Mg was easy to react with oxide than Cu and Si after annealing, the Mg Oxide which formed at surface and interface served as a passivation layer as well.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Journal of the Korean Ceramic Society
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• v.51 no.3
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• pp.170-176
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• 2014

Effective glass frit compositions enabled to absorb laser energy, and to seal a commercial dye-sensitized solar-cell-panel substrate were developed by using $V_2O_5$-based glasses with various amounts of $TeO_2$ substitution. The latter was intended to increase the lifetime of the solar cells. Substitution of $V_2O_5$ by $TeO_2$ provided a strong network structure for the glasses via the formation of tetrahedral pyramids in the glass, and changed the various glass properties, such as glass transition temperature ($T_g$), dilatometric softening point ($T_d$), crystallization temperature, coefficient of thermal expansion (CTE), and glass flowage without any detrimental effect on the laser absorption property of the glasses. The thermal expansion mismatch (${\Delta}{\alpha}$) between the glass frit and the substrate could be controlled within less than ${\pm}5%$ by addition of 10 wt% of ${\beta}$-eucryptite. An 810 nm diode laser was used for the sealing test. The laser sealing test revealed that the VZBT20 glass frit with 10 wt% ${\beta}$-eucryptite was successfully sealed the substrates without interfacial cracks and pores. The optimum sealing conditions were provided by a beam size of 3 mm, laser power of 40 watt, scan speed of 300 mm/s, and 200 irradiation cycles.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.10
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• pp.1199-1203
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• 2011

Nanocomposites were prepared through the compounding of rubber and clay. Measurements of the static and dynamic mechanical properties of different compositions over a temperature range $70-100^{\circ}C$ showed that the mechanical properties of these rubber/clay nanocomposites are superior to those of existing rubber materials. In this study, by using the parameter of the maximum Green.Lagrange strain appearing at certain locations, the relationship between fatigue life and maximum Green.Lagrange strain, and the correlations between test-piece tests and bench tests of actual rubber components are proved. In order to predict the fatigue life of rubber components at the design stage, a simple procedure of life prediction is suggested. The predicted fatigue lives of the rubber engine mounts agree fairly well with the fatigue lives determined experimentally.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.41 no.3
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• pp.186-193
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• 2018

Modern manufacturing industries is to produce both precise and robust mechanical parts without failure while they are in service. In order to prevent a part failure for its lifetime, a mechanical design for a part should be examined on a basis of mechanical simulation. A nozzle plate, being a key part in steam engines, changes flow directions of steam in a turbine used in power plant. This paper is to the design and test for part safety and durability. Currently, nozzle plates are fabricated by welding nozzles to their plates. Welding causes some defects on the used materials while they are being manufactured. Another major defect is un-even pitches between welded nozzles. Welding causes phase changes because of high melting temperature of metal. This leads to decay on the welding spots, which weakens their structural strength and then, may lead to early damages on mechanical structures. This research proposes assembly-typed nozzle plate without welding. From the beginning, nozzle and plate are designed for insertion-typed assembly. Nozzle head and foot are designed in accordance with the grooves on outer ring and inner ring of a plate to make mating surfaces. Then the nozzle plate should be proved for structural and fatigue safety before they are put in manufacturing. This research adopts commercial softwares for modeling and mechanical simulation. The test result shows that the design with smaller mating area and deeper insertion produces higher safety in terms of structure and durability. From the conclusion, this paper proposes the assembly-typed nozzle plate to replace the welding typed.

• Journal of the Korean Society of Safety
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• v.33 no.4
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• pp.90-97
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• 2018

As the result(also after it's been carried out the damping force test with 800ea lateral dampers of 50ea trainset from entering heavy maintenance workshop to implement heavy maintenance inspection cycle, there were 86.25%(650ea) which were out of $350kg{\pm}15%$ of the standard value of damping force compared to the reference value. After the implementation of heavy maintenance inspection cycle, it's been examined damping force test with total samples 32ea(samples 8ea per a trainset) from actual running EMU 4ea trainset. As the result, percent defective was 84.4%(27ea), which was a very high level. System. The lateral damper's the failure cause of damping force defective was oil leakage caused by tearing crack of oil seal and foreign material in oil iron 473 ~ 1932 times higher than that of new oil, copper 36 ~ 98 times higher than that of new oil reduced oil amount cycling damping valve. It resulted from the change cause of damping force. In the static analysis on the shape of lateral damper oil seal's the existing and improved product, the stress of the improved product was smaller than that of the existing product. In the fatigue analysis, the existing product showed a low life in the upper area. However, in case of the improved product, it could be confirmed that the destruction did not occur up to the specified 1.0e + 006 cycles and the lifetime was further improved in most areas.