• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.1008-1011
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• 2005

It is necessary for the design of lead frame punches in blanking to consider buckling because inner lead pitch of lead frame has been narrowed by miniaturization and high accumulation of semiconductor. In addition, if process variables change in press stamping process, the lift of punches is no longer influenced in wear and punches can be broken suddenly. To prevent the fracture of fine pitch lead frame punches, having considered applying reinforcement to it, this paper verified the design with buckling analysis. This study presents the optimal position and number of reinforcement to be attached to punches. Finally this study presents design rules of attaching reinforcement.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.189-193
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• 1996

Piezoelectric actuator is widely used in precision positioning applications due to its excellent positioning resolution. However, serious hysteresis nonlinearity of the actuator deteriorates its open loop positioning capability. Generally, a nonlinear hysteresis model is used in feedforward loop to improve positioning accuracy. In this study, however, a simple lead compensator is proposed as a substitution for a complex nonlinear hysteresis model and tested through experiments for precision position control.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.2
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• pp.38-47
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• 2001

This paper decribes the development of computer-aided design of a very precise progressice die for lead frame of semiconductor chip. The approach to the system is based on knowledgr-based rules. Knowledge of fie이 experts. This system has been written in AutoLISP using AutoCAD ona personal computer and the I-DEAS drafting programming Language on the I-DEAS mater series drafting with on HP9000/715(64) workstation. Data exchange between AutoCAD and I-DEAS master series drafting is accomplished using DXF(drawing exchange format) and IGES(initial graphics exchange specification) files. This system is composed of six main modules, which are input and shape treatment, production feasibility check, strip layout, data conversion, die layout, and post processing modules. Based on Knowledge-based rules, the system considers several factors, such as V-notches, dimple, pad chamfer, spank, cavity punch, camber, coined area, cross bow, material and thickness of product, complexities of blank geometry and punch profiles, specifications of available presses, and the availability of standard parts. As forming processes and the die design system using 2D geometry recognition are integrated with the technology of process planning, die design, and CAE analysis, the standardization of die part for lead frames requiting a high precision process is possible. The die layout drawing generated by the die layout module s displayed in graphic form. The developed system makes it possible to design and manufacture lead frame of a semiconductor more efficiently.

• International Journal of Precision Engineering and Manufacturing
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• v.5 no.1
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• pp.36-41
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• 2004

The blanking of thin sheet metal using progressive dies is an important process on production of precision electronic machine parts such as IC leadframe. This paper summarizes the results of simulating the progressive blanking process by means of LS/DYNA. In order to verify the influence of blanking order on the final lead profile and deformed configuration, simulation technique has been proposed and analyzed using a commercial FEM code, LS/DYNA. The results of FE-simulations are in good agreement with the experimental result. After then, to construct rule base in progressive blanking process, FE-simulation has been performed using a simple model. Based on this result rule base is set up and then the blanking order of inner lead is rearranged. Consequently, from the results of FE-simulation using suggested method in this paper, it is possible to predict the shift of lead to manufacture high precision lead frame in progressive blanking process. The proposed method can give more systematic and economically feasible means for designing progressive blanking process.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.156-162
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• 2005

In this paper, we study the mechanism of lead deformation by numerically simulating the stamping process by means of a commercial finite element code. It is very important to analyze effects that the lead shape makes on the lead deformation, because the lead shape is often modified in order to minimize the deformation or to increase the buckling critical load of the punch. Therefore the stamping process, first, numerically simulated by considering as a quasi-static problem. Second, the effect on the lead deformation due to the lead shape variation, a linear lead geometry and a bent lead, was numerically analyzed and discussed. Finally, the punching order was optimized fur multi-lead generating stamping process. The results show that the bent lead is little bit more shifted than the linear lead after the punching process. But the bent lead is vertically less deformed than the linear lead. The punching order to successively generate the lead is good to keep the lead space uniform. The results will be very effectively applied for the design of the blanking or punching dies in industry.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.5
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• pp.9-18
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• 1998

The components with J-lead. which are more integrated and smaller than ones with Gull-wing. are rapidly being used in electronic board such as the PCB, for they have the advantage of occupying a small space compared to the other components. However, the development of inspection system for these new components is not so rapid as component development. Component-inspection with J-lead using vision system is difficult because they are hidden from camera optical axis. X-ray inspection, which has the advantage of inspecting the inside of solder state, is used to J-lead inspection. However. it is high cost and dangerous by leaking out X-ray compared to vision system. Therefore, in this paper, we design vision system suited to J-lead inspection and then propose algorithm which have flexibility in mount and rand error.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.25-29
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• 1999

The lead frame manufactured by press stamping process, is an important part of semiconductor. The recent technical trend of semiconductor, chip sized and high performance package technology, requires the lead frame to be of more multi-leads and of fine ILP (Inner Lead Pitch). As the ILP is getting finer, its corresponding punch of the stamping die is getting narrower. The punch narrower than its stamping limit has been broken due to local buckling. This paper analyzed the phenomena of punch breakdown. Moreover, the punch design was modified to increase the critical limit of buckling force. This paper, also, suggested new design rules of the punch, which asks the modification of its lead frame design that has to be considered in the stage of semiconductor package design. The new design rules of lead frame design yields a good reliability of semiconductor package as well as a good quality of lead frame.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.35-41
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• 2003

The multihole blanking of thin sheet metal using progressive die set is an important process on production of precision electronic machine parts such as IC leadframe. In this paper, in order to investigate the influence of blanking order on the final lead profile and deformed configuration, simulation technique for progressive blanking process is proposed and analyzed by LS-DYNA. The results of FE-simulations are in good agreement with the experimental results. Consequently, from the results of FE-analysis based on the procedure proposed in this paper, it is possible to predict the deformation of lead and to manufacture high precision leadframes in progressive blanking process and these results might be used as a guideline to develop layout design system in multihole blanking process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.437-438
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.723-724
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• 2009