Effect of chemical in post Ru CMP Cleaning solutions on abrasive particle adhesion and removal (Post Ru CMP Cleaning에서 연마입자의 흡착과 제거에 대한 chemical의 첨가제에 따른 영향)
-
- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
- /
- 2007.11a
- /
- pp.529-529
- /
- 2007