• Proceedings of the IEEK Conference
• /
• 2002.07b
• /
• pp.778-781
• /
• 2002

In this paper, we designed the anti-fuse program circuit, and there are an anti-fuse program/sense/latch circuit, a negative voltage generator, power-up circuit and etc. in this circuit. An output voltage of a negative voltage generator is about -4,51V. We detected certainly it regardless of simulation result power rise time or temperature change to detect the anti-fuse program state of an anti-fuse program/sense/latch circuit and were able to know what performed a steady action. And as a result of having done a simulation while will change a resistance value voluntarily in order to check an anti-fuse resistance characteristic of this circuit oneself, it recognized as a programmed anti-fuse until 23k$\Omega$, and we were able to know that this circuit was a lot of margin than general anti-fuse resistance 500$\Omega$. Therefore, the anti-fuse program circuit of this study showed that was able to apply for configuration of the programmable logic device.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.46 no.3
• /
• pp.1-9
• /
• 2009

In this paper proposed a new method which adaptively eliminates comparator offsets using the threshold voltage shift by the Fowler-Nordheim stress. The method evaluates the sign of comparator offset and gives the FN stress to the stronger MOSFETs of the comparator, leading to offset reduction. We have used an appropriate stressing operation, named 'stress-packet', in order to converge the offset value to zero. We applied the method to the latch-type comparator which is prevalently used for DRAM bitline sense amplifier, and verified through experiments that offsets of the latch-type comparators are nearly eliminated with the stress-packet operations. We also discuss about the reliability issues that must be guaranteed for field application of this method.

• Corrosion Science and Technology
• /
• v.4 no.5
• /
• pp.211-216
• /
• 2005

Failure analysis of the latch ram ball and the C-ram ball with the trade name AFBMA Gr. 50 Colmonoy No. 6, has been performed to identify the root cause of the failure. The study required the extraction of the both failed and normal balls from the nuclear fuel exchanger. Microstructures of both balls were examined after polishing and etching. Breaking tests of both the ball revealed similarity in cleavage surfaces. Fracture surfaces of both failed ball and normal ball after breaking test were examined with SEM and EDX. Microstructure of the ball revealed an austenite phase with coarse Cr rich precipitate. Indented marks observed on the surface of the failed ball are believed to be produced by overloading. In the light of the afore mentioned observations and studies, the failure mechanism of the ball in nuclear fuel exchanger seem to be caused by impact or mechanical overloading on ball.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2013.05a
• /
• pp.791-794
• /
• 2013

Electronic systems may be cause of various serious failures due to an ionizing radiation effect when exposed to a prompt gamma-ray pulse. This transient electrical malfunction can, in some cases, results in a failure of the electronic system of which the circuits are a part. Transient radiation measurement and evaluation system is required to development for enhanced radiation-resistance against the initial nuclear radiation produced by the detonation of a nuclear weapon of semiconductor devices. In these studies, we performed the following work. In the first part of the work, we carried out a SPICE simulation applied to nuclear radiation condition for PN diode and we also investigated the photocurrent by a pulsed gamma-ray on a PN diode using a TCAD simulation.

• Journal of IKEEE
• /
• v.24 no.3
• /
• pp.890-894
• /
• 2020

In this paper, we propose an ESD protection device with improved electrical characteristics through structural changes of LVTSCR, a typical ESD protection device. The proposed ESD protection device has a higher holding voltage than the existing LVTSCR by inserting a long N+ drift region and additional P-Well and N-Well, and improves the latch-up immunity, a chronic disadvantage of a general SCR-based ESD protection device. In addition, the effective base width of parasitic BJTs was set as a design variable, and the electrical characteristics of the proposed ESD protection device were verified through Synopsys' TCAD simulation so that it can be applied to the required application by applying the N-Stack technology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.1
• /
• pp.17-23
• /
• 2005

The switching characteristics of MOS-Controlled Thyristor(MCT) is studied with variation of the channel length and impurity concentration in ON and OFF FET channel. The proposed MCT power device has the lateral structure and P-epitaxial layer in substrate. Two dimensional MEDICI simulator and PSPICE simulator are used to study the latch-up current and forward voltage-drop from the characteristics of I-V and the switching characteristics with variation of channel length and impurity concentration in P and N channel. The channel length and N impurity concentration of the proposed MCT power device show the strong affect on the transient characteristics of current and power. The N channel length affects only on the OFF characteristics of power and anode current, while the N doping concentration in P channel affects on the ON and OFF characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.4
• /
• pp.273-279
• /
• 2000

Electrical repair method which has replaced laser repair method can replace defective cell by redundancy’s in the redundancy scheme of conventional high density memory. This electrical repair circuit consists of the antifuse program/read/latch circuits, a clock generator a negative voltage generator a power-up pulse circuit a special address mux and etc. The measured program voltage of made antifuses was 7.2~7.5V and the resistance of programmed antifuses was below 500 Ω. The period of clock generator was about 30 ns. The output voltage of a negative voltage generator was about 4.3 V and the current capacity was maximum 825 $mutextrm{A}$. An antifuse was programmed using by the electric potential difference between supply-voltage (3.3 V) and output voltage generator. The output pulse width of a power-up pulse circuit was 30 ns ~ 1$mutextrm{s}$ with the variation of power-up time. The programmed antifuse resistance required below 44 ㏀ from the simulation of antifuse program/read/latch circuit. Therefore the electrical repair circuit behaved safely and the yield of high densitymemory will be increased by using the circuit.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.9
• /
• pp.758-763
• /
• 2002

A new small size Lateral Trench Electrode Insulated Gate Bipolar Transistor (LTEIGBT) is proposed and fabricated to improve the characteristics of device. The entire electrode of LTEIGBT is placed to trench type electrode. The LTEIGBT is designed so that the width of device is 19w. The latch-up current density of the proposed LTEIGBT is improved by 10 and 2 times with those of the conventional LIGBT and LTIGBT. The forward blocking voltage of the LTEIGBT is 130V. At the same size, those of conventional LIGBT and TIGBT are 60V and 100V, respectively. Because the electrodes of the proposed device is formed of trench type, the electric field in the device are crowded to trench oxide. When the gate voltage is applied 12V, the forward conduction currents of the proposed LTEIGBT and the conventional LIGBT are 80mA and 70mA, respectively, at the same breakdown voltage of 150V.

• Journal of Satellite, Information and Communications
• /
• v.9 no.4
• /
• pp.63-68
• /
• 2014

Electrostatic Discharge(ESD) protection performance of PPS(PMOS pass structure) embedded N-type silicon controlled rectifier(NSCR_PPS) device with different partial p-well(PPW) structure was discussed for high voltage I/O applications. A conventional NSCR_PPS standard device shows typical SCR-like characteristics with low on-resistance, low snapback holding voltage and low thermal breakdown voltage, which may cause latch-up problem during normal operation. However, our proposed NSCR_PPS devices with modified PPW demonstrate the stable ESD protection performance with high latch-up immunity.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
• /
• v.12 no.2
• /
• pp.150-154
• /
• 2019

In the design of semiconductor integrated circuits, ESD is one of the important issues related to product quality improvement and reliability. In particular, as the process progresses and the thickness of the gate oxide film decreases, ESD is recognized as an important problem of integrated circuit design. Many ESD protection circuits have been studied to solve such ESD problems. In addition, the proposed device can modify the existing SCR structure without adding external circuit to effectively protect the gate oxide of the internal circuit by low trigger voltage, and prevent the undesired latch-up phenomenon in the steady state with high holding voltage. In this paper, SCR-based novel ESD(Electro-Static Discharge) device with the high holding voltage has been proposed. The proposed device has the lower triggering voltage without an external trigger circuitry and the high holding voltage to prevent latch-up phenomenon during the normal condition. Using TCAD simulation results, not only the design factors that influence the holding voltage, but also comparison of conventional ESD protection device(ggNMOS, SCR), are explained. The proposed device was fabricated using 0.35um BCD process and was measured electrical characteristic and robustness. In the result, the proposed device has triggering voltage of 13.1V and holding voltage of 11.4V and HBM 5kV, MM 250V ESD robustness.