• Title/Summary/Keyword: Latch

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The novel SCR-based ESD Protection Device with High Holding Voltage (높은 홀딩전압을 갖는 사이리스터 기반 새로운 구조의 ESD 보호소자)

  • Won, Jong-Il;Koo, Yong-Seo
    • Journal of IKEEE
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    • v.13 no.1
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    • pp.87-93
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    • 2009
  • The paper introduces a silicon controlled rectifier (SCR)-based device with high holding voltage for ESD power clamp. The holding voltage can be increased by extending a p+ cathode to the first n-well and adding second n-well wrapping around n+ cathode. The increase of the holding voltage above the supply voltage enables latch-up immune normal operation. In this study, the proposed device has been simulated using synopsys TCAD simulator for electrical characteristic, temperature characteristic, and ESD robustness. In the simulation result, the proposed device has holding voltage of 3.6V and trigger voltage of 10.5V. And it is confirmed that the device could have holding voltage of above 4V with the size variation of extended p+ cathode and additional n-well.

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Path Delay Testing for Micropipeline Circuits (마이크로파이프라인 회로를 위한 지연 고장 테스트)

  • Kang, Yong-Seok;Huh, Kyung-Hoi;Kang, Sung-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.8
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    • pp.72-84
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    • 2001
  • The timings of all computational elements in the micropipeline circuits are important. The previous researches on path delay testing using scan methods make little account of the characteristic of the path delay tests that the second test pattern must be more controllable. In this paper, a new scan latch is proposed which is suitable to path delay testing of the micropipelines and has small area overhead. Results show that path delay faults in the micropipeline circuits using the new scan are testable robustly and the fault coverage is higher than the previous researches. In addition, the new scan latch for path delay faults testing in the micropipeline circuits can be easily expanded to the applications such as BIST for stuck-at faults.

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Modeling and Experimental Response Characterization of the Chevron-type Bi-stable Micromachined Actuator (Chevron형 bi-stable MEMS 구동기의 모델링 및 실험적 응답특성 분석)

  • 황일한;심유석;이종현
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.2
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    • pp.203-209
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    • 2004
  • Compliant bi-stable mechanism allows two stable states within its operation range staying at one of the local minimum states of the potential energy. Energy storage characteristics of the bi-stable mechanism offer two distinct and repeatable stable states, which require no power input to maintain it at each stable state. This paper suggests an equivalent model of the chevron-type bi-stable microactuator using the equivalent spring stiffness in the rectilinear and the rotational directions. From this model the range of spring stiffness where the bi-stable mechanism can be operated is analyzed and compared with the results of the FEA (Finite Element Analysis) using ANSYS for the buckling analysis, both of which show a good agreement. Based on the analysis, a newly designed chevron-type bi-stable MEMS actuator using hinges is suggested for the latch-up operation. It is found that the experimental response characteristics of around 36V for the bi-stable actuation for the 60$mu extrm{m}$ stroke correspond very well to the results of the equivalent model analysis after the change in cross-sectional area by the fabrication process is taken into account. Together with the resonance frequency experiment where 1760Hz is measured, it is shown that the chevron-type bi-stable MEMS actuator using hinges is applicable to the optical switch as an actuator.

Study on the Optimal CPS Implant for Improved ESD Protection Performance of PMOS Pass Structure Embedded N-type SCR Device with Partial P-Well Structure (PMOS 소자가 삽입된 부분웰 구조의 N형 SCR 소자에서 정전기 보호 성능 향상을 위한 최적의 CPS 이온주입에 대한 연구)

  • Yang, Jun-Won;Seo, Yong-Jin
    • Journal of Satellite, Information and Communications
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    • v.10 no.4
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    • pp.1-5
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    • 2015
  • The ESD(electrostatic discharge) protection performance of PPS(PMOS pass structure) embedded N-type silicon controlled rectifier(NSCR_PPS) device with different partial p-well(PPW) structure was discussed for high voltage I/O applications. A conventional NSCR_PPS standard device shows typical SCR-like characteristics with low on-resistance, low snapback holding voltage and low thermal breakdown voltage, which may cause latch-up problem during normal operation. However, our proposed NSCR_PPS devices with modified PPW_PGM(primary gate middle) and optimal CPS(counter pocket source) implant demonstrate the stable ESD protection performance with high latch-up immunity.

Improvement of Electrostatic Discharge (ESD) Protection Performance through Structure Modification of N-Type Silicon Controlled Rectifier Device (N형 실리콘 제어 정류기 소자의 구조 변형을 통한 정전기 보호성능의 향상에 대한 연구)

  • Yang, Jun-Won;Seo, Yong-Jin
    • Journal of Satellite, Information and Communications
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    • v.8 no.4
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    • pp.124-129
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    • 2013
  • An electrostatic discharge (ESD) protection device, so called, N-type SCR with P-type MOSFET pass structure (NSCR_PPS), was analyzed for high voltage I/O applications. A conventional NSCR_PPS device shows typical SCR-like characteristics with extremely low snapback holding voltage, which may cause latch-up problem during normal operation. However, a modified NSCR_PPS device with counter pocket source(CPS) and partial p-type well(PPW) structure demonstrates highly latch-up immune current-voltage characteristics.

A Two-Stage Power Amplifier with a Latch-Structured Pre-Amplifier (래치구조의 드라이브 증폭단을 이용한 2단 전력 증폭기)

  • Choi Young-Shig;Choi Heyk-Hwan
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.9 no.2
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    • pp.295-300
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    • 2005
  • In this paper we have designed a two-stage Class I power amplifier operated at 2.4CHz for Class-1 Bluetooth application. The power amplifier employs class-I topology to exploit its soft-switching property for high efficiency. The latch-structured pre-amplifier with amplifiers makes its output signal as sharp as possible for soft switching of the next power amplifier. It improves the overall efficiency of the proposed power amplifier. It shows 65.8$\%$ PAE, 20dB power gain and 20dBm output power.

A Study on the Design of High speed LIne Memory Circuit for HDTV (HDTV용 고속 라인 메모리 회로 설계에 관한 연구)

  • 김대순;정우열;김태형;백덕수;김환용
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.17 no.5
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    • pp.529-538
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    • 1992
  • Recently, image signal processing techniques for HDTV signal have been drastically developed. This kind of skill improvement on signal processing need specific memory device for video signal. in this paper, data latch scheme which implements CMOS flip-flop to hold Information from in-put strobe and new reading method is devised to attain a proper access time suitable for HDTY signal. Compared with conventional write scheme, data latch method has two procedures to complete write operation : bit line write and storage cell write, enabling concurrent I /0 operation at the same address. Also, fast read access is possible through the method similar to static column mode and the separated read word line.

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A Study of The Electrical Characteristics of Small Fabricated LTEIGBTs for The Smart Power ICs (스마트 파워 IC에의 활용을 위한 소형 LTEIGBT의 제작과 전기적인 특성에 관한 연구)

  • 오대석;김대원;김대종;염민수;강이구;성만영
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.338-341
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    • 2002
  • A new small size Lateral Trench Electrode Insulated Gate Bipolar Transistor (LTEIGBT) is proposed and fabricated to improve the characteristics of device. The entire electrode of LTEIGBT is placed to trench type electrode. The LTEIGBT is designed so that the width of device is 19$\mu\textrm{m}$. The latch-up current density of the proposed LTEIGBT is improved by 10 and 2 times with those of the conventional LIGET and LTIGBT The forward blocking voltage of the LTEIGBT is 130V. At the same size, those of conventional LIGBT and LTIGBT are 60V and 100V, respectively. Because that the electrodes of the proposed device is formed of trench type, the electric field in the device are crowded to trench oxide. We fabricated He proposed LTEIGBT after the device and process simulation was finished. When the gate voltage is applied 12V, the forward conduction currents of the proposed LTEIGBT and the conventional LIGBT are 80mA and 70mA, respectively, at the same breakdown voltage of 150V,

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