• 한국레이저가공학회지
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• 제12권4호
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• pp.17-25
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• 2009

The surface cleaning method based on the laser-induced breakdown (LIB) of gas and subsequent plasma and shock wave generation can remove small particles from solid surfaces. In the laser shock cleaning (LSC) process, a high-power laser pulse induces optical breakdown of the ambient gas above the solid surface covered with contaminant particles. The subsequently created shock wave followed by a high-speed flow stream detaches the particles. In this work, a novel surface cleaning process using laser-induced breakdown of liquid is introduced and demonstrated. LIB of a micro liquid jet increases the shock wave intensity and thus removes smaller particle than the conventional LSC method. Experiments demonstrate that the cleaning force and cleaning efficiency are also increased significantly by this method.

• 한국군사과학기술학회지
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• 제14권6호
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• pp.1171-1177
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• 2011

A high power laser beam focused on a small area accelerates a thin material that flies and hits other target material in which a shock wave may be induced. This laser induced shock experimental method is more repeatable and cheaper but worse than other experimental method using gas gun or other apparatus. An optical system including a phase zone plate reduces the interference and also makes the focused-beam-intensity distribution uniform. We wrote a computer code that calculates light ray traces. Using the code we designed and fabricated an optical system including a phase zone plate and improved the laser-beam uniformity. We introduce preliminary experimental results of laser induced shock of the samples such as aluminum and other materials.

• 한국레이저가공학회지
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• 제5권2호
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• pp.9-15
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• 2002

Basic principles and unique characteristics of laser-induced shock cleaning have been described compared to a conventional laser cleaning method and the removal of small tungsten particles from silicon wafer surfaces was attempted using both methods. It was found that the conventional laser cleaning was not feasible to remove the tungsten particles whereas a successful removal of the particles was carried out by the laser-induced shock waves. From the quantitative analysis using a surface scanner, the average removal efficiency of the particles was more than 98% where smaller particles were slightly more difficult to remove probably due to the increased adhesion force with a decrease of the particle size. It was also seen that the gap distance between the laser focus and the wafer surface is an important processing parameter since the removal efficiency is strongly dependent on the gap distance.

• 한국레이저가공학회지
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• 제11권1호
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• pp.19-24
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• 2008

It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermo elastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.

• 한국레이저가공학회지
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• 제17권4호
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• pp.1-6
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• 2014

Femtosecond laser induced shock generation in water and vitreous humor of enucleated porcine eyeball was investigated. When focusing the femtosecond laser into the liquid mediums, the acoustic waves with a frequency of about 15.6kHz could be observed by using wide-band microphone. The amplitude of the acoustic signals from water has attained a maximum under a laser power of about 5mW. Further increment of the power results in a decrement of the acoustic signals due to nonlinear optical process including filamentation of laser beam. We have further investigated the effect of femtosecond laser induced acoustic waves by applying the laser pulse into enucleated porcine eyeball. The comparative studies on both healthy and diseased eyeballs led us propose that the femtosecond laser pulses could be utilized as a novel tools for treatment of partially detached retina layers from their choroid structures.

• 한국레이저가공학회지
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• 제7권1호
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• pp.29-36
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• 2004

The dynamics of laser-induced plasma/shock wave and the interaction with a surface in the laser shock cleaning process are analyzed by optical diagnostics. Shock wave is generated by a Q-switched Nd:YAG laser in air or with N$_2$, Ar, and He injection into the focal spot. The shock speed is measured by monitoring the photoacoustic probe-beam deflection signal under different conditions. In addition, nanosecond time-resolved images of shock wave propagation and interaction with the substrate are obtained by the laser-flash shadowgraphy. The results reveal the effect of various operation parameters of the laser shock cleaning process on shock wave intensity, energy-conversion efficiency, and flow characteristics. Discussions are made on the cleaning mechanisms based on the experimental observations.

• 한국추진공학회지
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• 제19권5호
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• pp.46-51
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• 2015

선형 화약 폭발의 전파 특성예측을 위해 다채널 동시 충격파 센싱 시스템을 개발하였다. 개발된 시스템은 펄스 레이저를 이용하여 초당 1000점에서 충격파 생성이 가능하며, 접촉식 센서를 이용하여 15개 채널에서 동시에 충격파 획득이 가능하다. 특히, 선형 화약의 폭파 시간에 상응한느 각 채널의 시간 지연을 사용자 요구에 따라 적절하게 적용할 수 있는 능력을 갖춤으로써 다양한 선형 화약의 폭발에 의한 충격파 전파를 예측할 수 있을 것으로 기대된다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2008년도 춘계학술발표대회 및 제14회 신소재 심포지엄
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• pp.30.1-30.1
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• 2008

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2002년도 춘계학술발표대회 논문개요집
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• pp.21-24
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• 2002

• 한국레이저가공학회지
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• 제6권3호
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• pp.29-35
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• 2003

In semiconductor processing, there are two types of particle contaminated onto the wafer, i.e. dry and wet state particles. In order to evaluate the cleaning performance of laser shock wave cleaning method, the removal of 1 m sized alumina particle at different particle conditions from silicon wafer has been carried out by laser-induced shock waves. It was found that the removal efficiency by laser shock cleaning was strongly dependent on the particle condition, i.e. the removal efficiency of dry alumina particle from silicon wafer was around 97％ while the efficiencies of wet alumina particle in DI water and IPA are 35％ and 55％ respectively. From the analysis of adhesion forces between the particle and the silicon substrate, the adhesion force of the wet particle where capillary force is dominant is much larger than that of the dry particle where Van der Waals force is dominant. As a result, it is seen that the particle in wet condition is much more difficult to remove from silicon wafer than the particle in dry condition by using physical cleaning method such as laser shock cleaning.