• 제목/요약/키워드: Laser fabrication

검색결과 865건 처리시간 0.027초

DED방식의 적층가공을 통한 금형으로의 응용사례 및 효과 (Effects and Application Cases of Injection Molds by using DED type Additive Manufacturing Process)

  • 김우성;홍명표;김양곤;서창희;이종원;이성희;성지현
    • Journal of Welding and Joining
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    • 제32권4호
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    • pp.10-14
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    • 2014
  • Laser aided Direct Metal Tooling(DMT) process is a kind of Additive Manufacturing processes (or 3D-Printing processes), which is developed for using various commercial steel powders such as P20, P21, SUS420, H13, D2 and other non-ferrous metal powders, aluminum alloys, titanium alloys, copper alloys and so on. The DMT process is a versatile process which can be applied to various fields like the mold industry, the medical industry, and the defense industry. Among of them, the application of DMT process to the mold industry is one of the most attractive and practical applications since the conformal cooling channel core of injection molds can be fabricated at the slightly expensive cost by using the hybrid fabrication method of DMT technology compared to the part fabricated with the machining technology. The main objectives of this study are to provide various characteristics of the parts made by DMT process compared to the same parts machined from bulk materials and prove the performance of the injection mold equipped with the conformal cooling channel core which is fabricated by the hybrid method of DMT process.

초소경 엔드밀링을 이용한 미세 가공특성 분석 및 응용가공 (Analysis of Micro Machining Characteristics using End-milling and Its Applications)

  • 최환진;박언석;전은채;제태진;최두선
    • 한국정밀공학회지
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    • 제29권12호
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    • pp.1279-1284
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    • 2012
  • Micro structures which are widely used at various fields are commonly fabricated by lithograph, etching and laser methods. Recently, with the emergence of micro tools and ultra-precision machine tools, fabrication of the micro structures obtained using end-milling are studied. However, there are some problems due to the diameter of the micro end-mill getting smaller below $100{\mu}m$. The micro run-out resulted from miniaturization of end-mills have influence seriously on accuracy of micro structures. The error of run-out with a tooling jig showed a decrease of about $9.3{\mu}m$. Furthermore, micro structures with width of $30{\mu}m$ could be applied through experiments of slot machining obtained using 30 and $50{\mu}m$ end-mill. Also, narrow angle structures with $30^{\circ}$ angle could be applied through analysis of machining acute angle structures. Based on basic experiments, micro fluidics channels and spiral patterns for air bearing were machined.

녹색 광 발진을 위한 주기적 분극 반전된 MgO : $LiNbO_3$ ridge waveguide 제작 (Fabrication of a periodically poled MgO : $LiNbO_3$ ridge waveguide for a green laser generation)

  • 양우석;권순우;송명근;이형만;김우경;구경환;윤대호;이한영
    • 한국결정성장학회지
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    • 제17권4호
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    • pp.151-155
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    • 2007
  • 녹색 광 발진을 위해 조화용융조성의 MgO가 첨가된 $LiNbO_3$ 결정을 이용하여 준위상정합 2차 조화파 도파로 소자를 제작하였다. 도메인 반전을 위해 +Z면에 주기적인 전극 패턴을 형성하였으며, 외부전계의 균일한 인가를 위해 LiCl 전해 용액을 사용하여 도메인을 반전 시켰다. 선택적 화학식각을 통해, 약 $6.8{\mu}m$의 분극 반전 주기를 확인 할 수 있었으며, $7{\mu}m$ ridge 높이와 $3{\mu}m$의 slap높이를 갖는 폭 $5{\mu}m$의 PPMgLN ridge-type 도파로 소자의 비선형 특성을 측정하였다.

Electrical Loss Reduction in Crystalline Silicon Photovoltaic Module Assembly: A Review

  • Chowdhury, Sanchari;Kumar, Mallem;Ju, Minkyu;Kim, Youngkuk;Han, Chang-Soon;Park, Jinshu;Kim, Jaimin;Cho, Young Hyun;Cho, Eun-Chel;Yi, Junsin
    • Current Photovoltaic Research
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    • 제7권4호
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    • pp.111-120
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    • 2019
  • The output power of a crystalline silicon (c-Si) photovoltaic (PV) module is not directly the sum of the powers of its unit cells. There are several losses and gain mechanisms that reduce the total output power when solar cells are encapsulated into solar modules. Theses factors are getting high attention as the high cell efficiency achievement become more complex and expensive. More research works are involved to minimize the "cell-to-module" (CTM) loss. Our paper is aimed to focus on electrical losses due to interconnection and mismatch loss at PV modules. Research study shows that among all reasons of PV module failure 40.7% fails at interconnection. The mismatch loss in modern PV modules is very low (nearly 0.1%) but still lacks in the approach that determines all the contributing factors in mismatch loss. This review paper is related to study of interconnection loss technologies and key factors contributing to mismatch loss during module fabrication. Also, the improved interconnection technologies, understanding the approaches to mitigate the mismatch loss factors are precisely described here. This research study will give the approach of mitigating the loss and enable improvement in reliability of PV modules.

금속분말 강화수지를 이용한 쾌속금형 제작 (Rapid Tooling by Using Metal Powder Reinforced Resin)

  • 김범수;정해도;배원병
    • 대한기계학회논문집A
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    • 제24권1호
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    • pp.1-6
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    • 2000
  • As dies and molds have become more and more complicated in the recent years, the demand for lower cost and shorter production time is also growing stronger. Rapid prototyping and Tooling technologies are expected to be used for more rapid and lower cost tool fabrication. However the rapid tooling methods have not yet reached the level of application to the manufacturing of metallic dies and molds which require high dimensional accuracy. As the rapid tooling technology, there are the slurry casting, the powder casting, the direct laser sintering, and so on. Generally, in the slurry casting, the alumina powder and the water soluble phenol were mainly used. However, the mechanical properties of the phenol were not good enough to apply to molds directly. In this study, pure epoxy and two types of aluminium powder reinforced resin are applied to the slurry casting. The mechanical and thermal properties are better than phenol because the epoxy is the thermosetting resin. And mechanical characteristics such as shrinkage rate, hardness, surface roughness are measured for the sake of comparison. Metal powder reinforced resin molds are better than the resin tool form the viewpoint of shrinkage rate and hardness. Finally, it has been shown that the application possibility of this process is high, because the manufacturing time and cost savings are significant.

Development and Verification of PZT Actuating Micro Tensile Tester for Optically Functional Materials

  • Kim Seung-Soo;Lee Hye-Jin;Lee Hyoung-Wook;Lee Nak-Kyu;Han Chang-Soo;Hwang Jai-Hyuk
    • International Journal of Control, Automation, and Systems
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    • 제3권3호
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    • pp.477-485
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    • 2005
  • This paper is concerned with the development of a micro tensile testing machine for optically functional materials such as single or poly crystalline silicon and nickel film. This micro tensile tester has been developed for testing various types of materials and dimensions. PZT type actuation is utilized for precise displacement control. The specifications of the PZT actuated micro tensile testers developed are as follows: the volumetric size of the tester is desktop type of 710mm' 200mm' 270mm; the maximum load capacity and the load resolution in this system are IKgf and 0.0152mgf respectively and; the full stroke and the stoke resolution of the PZT actuator are $1000{\mu}m$ and 10nm respectively. Special automatic specimen installing and setting equipment is applied in order to prevent unexpected deformation and misalignment of specimens during handling of specimens for testing. Nonlinearity of the PZT actuator is compensated to linear control input by an inverse compensation method that is proposed in this paper. The strain data is obtained by ISDG method that uses the laser interference phenomenon. To test the reliance of this micro tensile testing machine, a $200{\mu}m$ thickness nickel thin film and SCS (Single Crystalline Silicon) material that is made with the MEMS fabrication process are used.

10 Gb/s 급 광통신용 1.55$\mu$m SI-PBH DFB-LD의 제작 및 특성연구 (Fabrication and characterization of 1.55$\mu$m SI-PBH DFB-LD for 10 Gbps optical fiber communications)

  • 김형문;김정수;오대곤;주흥로;박성수;송민규;곽봉신;김홍만;편광의
    • 한국광학회지
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    • 제8권4호
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    • pp.327-332
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    • 1997
  • 2단계 메사 식각 공정과 유기 금속 화학 증착방법으로 높은 비저항을 갖는 Fe-도핑된 반절연 InP층의 전류 차단층을 갖는 10 Gb/s 광통신용 초고속 1.55.mu.m 궤환형 반도체 레이저 다이오드를 제작하였다. 제작된 DFB-LD의 특성은 발진 임계전류~15 mA, slope efficiency ~0.13 mW/mA, 동 저항 ~6.0.OMEGA.이었고, 발진 파장은 1.546 .mu.m이며, 6 Ith까지의 전류에도 인접 모우드 억압비, SMSR>40dB 이상 (CW상태)으로써 안정된 단일 모우드 동작을 보였다. DFB-LD의 소신호 주파수 특성으로 27 mA의 작은 구동전류에서 이미 -3dB 대역폭이 10 GHz에 도달하였음을 보여주었고, 또한 최대 -3dB 대역폭으로 구동전류 90 mA에서 ~18 GHz까지 얻는 우수한 소신호 주파수 특성을 보여주었다. 10 Gb/s DFB-LD 모듈 전송시험에 있어서, 1.55.mu.m 파장의 레이저 다이오드 모듈로 일반 단일모우드 광섬유와 분산천이 광섬유에 대해서 전송시험한 결과 에러평탄면(error floor)없이 각각 10 km, 80 km를 전송할 수 있었다.

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NTC 써미스터가 내장된 항온 제어용 소형 열전 냉각 모듈 제조 (Fabrication of NTC thermistor embedded Miniature Thermoelectric Cooling Module for Temperature Control)

  • 박종원;최정철;황창원;최승철
    • 마이크로전자및패키징학회지
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    • 제11권3호
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    • pp.83-89
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    • 2004
  • NTC 써미스터를 내장시킨 소형의 열전 냉각 모듈을 제작하고 LD와 같은 광통신부품에 적용하기 위한 온도제어 및 항온유지 특성을 분석하였다 BiTe계 열전반도체 21쌍으로 구성된 열전 모듈은 크기 $7.2 mm{\times}9 mm{\times}2.2 mm$이고, 내장된 써미스터의 빠른 응답속도로 인해 정밀온도제어가 가능하다. 열전 모듈은 성능 지수(Z) $2.5{\times}10^{-3}$/K, 300 K에서 최대 온도차(${\Delta}T_{max}$) 72 K, 최대 흡열량($Q_{max}$) 2.2W 값을 나타내었으며 온도 제어 정밀도는 대기 중에서 ${\pm}0.1^{\circ}C$내였다. 이는 광통신 부품의 작동 환경 안정성을 확보할 수 있는 항온제어용 소형 열전 모듈로서 적용이 가능하다.

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펄스레이저법으로 MgO 단결정 기판위에 YBCO/BaZrO$_3$ 박막의 증착 (Deposition of YBCO/BaZrO$_3$ films on MgO single crystal substrates by pulsed laser deposition)

  • 정준기;고락길;김호섭;하홍수;송규정;문승현;유상임;김철진;박찬
    • 한국초전도ㆍ저온공학회논문지
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    • 제6권3호
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    • pp.12-15
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    • 2004
  • There are two major approaches to obtain texture template for HTS coated conductor (CC) ---IBAD and RABiTS. CC's with IBAD template showed both longer and higher Ic results so far. IBAD for CC began with YSZ, the processing of which is very slow compared to other processings needed for the fabrication of CC. Because of this very slow processing speed, IBAD with other materials such as Gd$_2$Zr$_2$O$_{7}$(GZO) and MgO have been developed. The processings of IBAD-GZO and IBAD-MgO are known to be up to 3times and 100 times. respectively, as fast as the processing of IBAD-YSZ. IBAD-MgO is very attractive in that the processing is very fast. IBAD-MgO also needs additional buffer layer(s). Many materials are being investigated to be used as a buffer layer on top of the MgO. BaZrO$_3$ (BZO) is a good candidate as the buffer layer on top of the IBAD-MgO because it is chemically stable and does not react with YBCO at high temperatures. It also has good lattice match with MgO. The BZO film has been deposited on single crystal MgO, and YBCO film was deposited on BZO/MgO to investigate the possibility of using BZO as both the buffer and capping layer of the CC.C.

그래핀을 포함하는 폴리설폰 멤브레인의 구조 및 열 특성 (Structural and Thermal Properties of Polysulfone Membrane Including Graphene)

  • 최현명;최용진;성충현;오원태
    • 멤브레인
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    • 제28권1호
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    • pp.37-44
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    • 2018
  • Polysulfone 수지를 사용한 그래핀 복합조성물을 제조하고, 이것들의 멤브레인에 대한 잔류응력과 열전도 특성을 분석하였다. 그래핀을 포함하는 polysulfone 멤브레인의 잔류응력분석은 Si (100) 기판에 스핀코팅으로 $10{\mu}m$ 두께의 막을 도포하여 준비한 시료를 대상으로 하였으며, 잔류응력의 측정은 온도를 승온하고 냉각하는 완전한 1주기 동안 수행하였다. 그래핀을 포함하는 polysulfone 평막을 증류수를 사용한 상전이법으로 제조하여 두께방향과 면방향으로 열전도도를 구분하여 각각 측정하였으며 평막시료의 열전도 이방성을 분석하였다. 그래핀의 구조적 특징에 의해 이를 포함하는 polysulfone 막의 잔류응력은 그래핀 함량이 증가함에 따라 점차로 완화되는 경향을 나타내었고, 열전도특성은 평막형성의 구조적 특성과 그래핀의 고유특성에 의해 두께방향과 면방향의 차이를 확인할 수 있었다.