• Title/Summary/Keyword: Laser Micromachining

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Laser micromachining of micron-size aperture for electron beam microcolumn application using the piezo-switched Nd:YAG laser (Piezo Q-Switched Nd:YAG 레이저에 의한 초미니 전자빔 장치용 Micron-Size Aperture의 레이저 미세가공)

  • 안승준;김대욱;김호섭;최성수
    • Journal of the Korean Vacuum Society
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    • v.8 no.4A
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    • pp.456-460
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    • 1999
  • Experimental studies of laser micromachining on Mo diaphragm using piezo Q-switched Nd:YAZ laser have been performed. Application of miniaturized micorcolumn electron gun arrays as a potential electron beam lithography or portable mini-scanning electron microscope (SEM) application have recently extensively examined. The conventional microcolumn fabrication technique would give a limitation on the minimization of aberration, In this paper, we obtained 20~30 $\mu \textrm m$aperture of laser micromachining on Mo diaphragm using piezo Q-swithed Nd:YAG laser. The geometrical figures, such as the diameter and the preciseness of the drilled aperture are dependent upon the total energy of the laser pulse train, laser pulse width, and the diameter of laser spot in addition to the materials-dependent parameters.

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A Study on Application of Systems Approach for Laser Micro Machining Design Process (시스템적 접근을 통한 레이저 미세가공 설계 프로세스 개발에 관한 연구)

  • Moon, Seong-Wook;Park, Young-Won;Nam, Gi-Jung
    • Laser Solutions
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    • v.10 no.3
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    • pp.15-24
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    • 2007
  • In this paper laser micromachining system design process for commercialization is suggested. The constructed system design process is properly adjusted for laser micromachining area after tailoring engine process of system engineering process such as requirement analysis, functional analysis and allocation, system synthesis and system optimization process. In the current laser machining system design, system components and specifications are determined on the basis of experimental experience which a laser is being used in machining some materials as well as the current machining and research trend. In this paper, however, systematic process is suggested in addition to experimental experience, which the laser and system components and their specifications are decided in the process of definition of functional requirements and engine design variables of system to satisfy the customer's requirements.

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Simulation of Laser Micro Patterning Process Using FEM (유한요소법을 이용한 레이저 미세 패터닝 공정 해석)

  • Lee J. H.;Kim B. H.;Lee J. K.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.09a
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    • pp.54-58
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    • 2005
  • Femtosecond laser is the latest generation pulsed laser delivering shortest pulses. Any solid materials can be machined by it. Femtosecond laser micromachining allows highest precision and minimal heat influence within the workpiece. But due to the complex physical phenomena between the laser beam and the workpiece materials, it is very difficult to determine the optimal process conditions in the femtosecond laser micromachining. In this study, a method to simulate the femtosecond laser micromachining process was proposed. And femtosecond laser micro patterning processes of chromium thin film are simulated by the proposed method using a commercial FE code, LS-Dyna. Simulation results were compared with those of experiments.

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Micromachining of Fused Silica by KrF Excimer Laser Induced Wet Etching (KrF 엑시머 레이저를 이용한 용융실리카의 미세 습식 식각가공)

  • 백병선;이종길;전병희;김헌영
    • Transactions of Materials Processing
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    • v.11 no.7
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    • pp.601-607
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    • 2002
  • Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.

Optimization of Laser Photolithography Micromachining Technique based on Taguchi Method (다구찌 방법을 이용한 레이저 포토리소그라피 미세패턴가공 기술의 최적화)

  • Baek, Nam-Kook;Kim, Dae-Eun
    • Proceedings of the KSME Conference
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    • 2001.11a
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    • pp.871-875
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    • 2001
  • Laser photolithography technique is useful for fabricating micro-patterns of silicon wafers. In this work, the laser photolithography micromachining technique is optimized based on Taguchi method. Sensitivity analysis was performed using laser scanning speed and laser power level as the parameters. The results show that for the photoresist used in this work, a laser scan speed of $70{\mu}m/s$ at 50mW laser power gives the best result.

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High-Speed Femtosecond Laser Micromachining with a Scanner (스캐너를 이용한 고속 펨토초 레이저 가공 기술)

  • Sohn, Ik-Bu;Choi, Sung-Chul;Noh, Young-Chul;Ko, Do-Kyeong;Lee, Jong-Min
    • Laser Solutions
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    • v.9 no.2
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    • pp.11-15
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    • 2006
  • We report experimental results on the high-speed micromachining using a femtosecond laser (800 nm, 130 fs, 1kHz) and galvanometer scanner system (Raylase, Germany). Periodic hole drilling of silicon and glass with the scan speed of 1-20 mm/s is demonstrated. Finally, we demonstrate the utility of the femtosecond laser application to ITO patterning by using a high-speed femtosecond laser scanner system.

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Theoretical analysis on the maximum volume ablation rate for copper ablation with a 515nm picosecond laser (515nm 피코초 레이저를 이용한 구리 어블레이션 공정의 최대 가공율에 대한 이론적 분석)

  • Shin, Dongsig;Cho, Yongkwon;Sohn, Hyonkee;Suh, Jeong
    • Laser Solutions
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    • v.16 no.2
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    • pp.1-6
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    • 2013
  • Picosecond lasers are a very effective tool for micromachining metals, especially when high accuracy, high surface roughness and no heat affected zone are required. However, low productivity has been a limit to broadening the spectrum of their industrial applications. Recently it was reported that in the micromachining of copper with a 1064nm picosecond laser, there exist the optimal pulse energy and repetition rate to achieve the maximum volume ablation rate. In this paper, we used a 515nm picosecond laser, which is more efficient for micromachining copper in terms of laser energy absorption, to obtain its optimal pulse energy and repetition rate. Theoretical analysis based on the experimental data on copper ablation showed that using a 515nm picosecond laser instead of a 1064nm picosecond laser is more favorable in that the calculated threshold fluence is 75% lower and optical penetration depth is 50% deeper.

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Laser application in 3-D micromachining (레이져를 이용한 3차원 형상가공에 관한 연구)

  • 윤경구;이성국;황경현
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.75-78
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    • 1995
  • This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

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Rapid Manufacturing of 3D Micro-products using UV Laser Ablation and Phase-change Filling

  • Shin Bo-Sung;Kim Jae-Gu;Chang Won-Suk;Whang Kyung-Hyun
    • International Journal of Precision Engineering and Manufacturing
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    • v.7 no.3
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    • pp.56-59
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    • 2006
  • UV laser micromachining is generally used to create microstructures for micro-products through a sequence of lithography-based photo-patterning steps. However, the micromachining process is not suitable for rapid realization of complex 3D micro-products because it depends on worker experience. In addition, the cost and time required to make many masks are excessive. In this paper, a more effective and rapid micro-manufacturing process, which was developed based on laser micromachining, is proposed for fabricating micro-products directly using UV laser ablation and phase-change filling. The filling process is useful for holding the micro-products during the ablation step. The proposed rapid micro-manufacturing process was demonstrated experimentally by fabricating 3D micro-products from functional UV-sensitive polymers using 3D CAD data.

Rapid Manufacturing of 3D Micro Products by UV Laser Ablation and Phase Change Filling (UV 레이저 어블레이션과 상변화 충진을 이용한 3차원 마이크로 부품의 쾌속 제작)

  • 신보성;김재구;장원석;황경현
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.26-29
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    • 2003
  • UV laser micromachining are generally used to create microstructures for micro product through a sequence of lithography-based photopatterning steps. However, the micromachining process is not suitable for the rapid realization of complex microscale 3D product because it depends on worker experiences, excessive cost and time to make many masks. In this paper, the more effective micro rapid manufacturing process, which is developed upon the base of laser micromachining. is proposed to fabricate micro products directly using UV laser ablation and phase change filling. The filling process is useful to hold the micro product during the next ablation step. The proposed micro rapid manufacturing process is also proven experimentally that enables to fabricate the 3D microscale products of UV sensitive polymer from 3D CAD data to functional micro parts.

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