• Title/Summary/Keyword: Laser Bonding

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Experiments on Welding of Ceramics by Use of High Power Laser (고출력 레이저를 이용한 세라믹 재료의 용접 실험)

  • 변철웅
    • Journal of Welding and Joining
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    • v.12 no.2
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    • pp.39-48
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    • 1994
  • In comparison to the conventional brazing, laser welding of ceramics has advantages of direct bonding without filler material, which causes the thermal stress due to the differences of thermal expansion coefficients. In pulse-mode, laser welding of dispersion ceramic having high thermal resistance is possible at relatively low preheating temperature of $1300^{\circ}C$ In CW-mode, alumina can be welded at high preheating temperature $1500^{\circ}C$ under the condition of low feed rate of 500 mm/min, respectively. Further studies on developing mechanism of pores in the bead during laser welding of ceramics is required.

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The Study on Wafer Cleaning Using Excimer Laser (엑사이머 레이저를 이용한 웨이퍼 크리닝에 관한 고찰)

  • 윤경구;김재구;이성국;최두선;신보성;황경현;정재경
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.05a
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    • pp.743-746
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    • 2000
  • The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

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A Comparative Evaluation of Mechanical Properties of Orthodontic Wire Joints according to Soldering Methods (납착 방법에 따른 교정용 와이어의 기계적 특성 비교)

  • Lee, Hye-Jin;Hong, Min-Ho
    • Journal of Technologic Dentistry
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    • v.36 no.4
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    • pp.239-246
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    • 2014
  • Purpose: The purpose of this study was to compare the tensile strength and mechanical properties of orthodontic wire joints made by gas soldering and laser welding, with and without filling material, to identify the effectiveness and potential clinical application of laser welded orthodontic wires. Methods: Three joint configurations of orthodontic wire were used: diameter 0.9 to 0.9 mm wire, diameter 0.9 to 0.5 wire and diameter 0.9 mm wire to band. The joints were made using three different methods: gas soldering, laser welding with and without filling material. For each kind of joint configuration or connecting method 7 specimens were carefully produced. The tensile strengths were measured with a universal testing machine (Zwick/Roell, Instron, USA). The hardness measurements were carried out with a hardness tester(Future-Tech Co. Tokyo, Japan). Data were analyzed by AVOVA(p= .05) and Turkey HD test(p= .05). Results: In all cases, gas soldering joints were ruptured on a low level on tensile bonding strength. Significant differences between laser welding and gas soldering(p< .05) were found in each joint configuration. The highest tensile strength means were observed for laser welding, with filling material, of 0.9 to 0.9 mm wire joint. Conclusion: In conclusion, the elastic modulus and tensile strength means of laser soldering with filling material were the highest, and the tensile strength means of laser soldering were higher than those of gas soldering.

Modified laser etching technique of enamel for bracket bonding (브라켓 부착을 위한 변형된 레이저 부식법)

  • Yun, Min-Sung;Lee, Sang-Min;Yang, Byung-Ho
    • The korean journal of orthodontics
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    • v.40 no.2
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    • pp.87-94
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    • 2010
  • Objective: Many studies have carried out research on comparisons between laser etching and conventional etching systems to investigate methods of reinforcing shear bond strength. The purposes of this study were to assess the efficiency of bonding with erbium, chromium doped: yttrium-scandium-gallium-garnet (Er,Cr:YSGG) laser etching combined with the conventional etching technique. Methods: Sixty-four sound premolars, extracted for orthodontic purposes, were randomly divided into 4 groups and treated in the following manner. First group, conventional etching of 37% phosphoric acid for 15 seconds (control); second group, 1.5 W laser etching for 10 seconds followed by conventional etching; third group, conventional etching followed by 1.5 W laser etching; fourth group, 1.5 W laser etching for 15 seconds only. We assessed the shear bond strength, the surface characteristics, and the adhesive remnant index scores between all groups. Results: Experimental groups showed higher shear bond strength than the control group. But no statistically significant differences were found between the second and third groups. Adhesive remnant scores were compared with the Kruskal-Wallis test, and no statistically significant differences were found between all groups. Conclusions: To obtain maximum shear bonding strength, a combined technique of Er,Cr:YSGG and 37% phosphoric acid is useful even though it may be inconvenient.

DEVELOPMENT AND REPAIR OF LAMINATE TOOLS BY JOINING PROCESS

  • Yoon, Suk-Hwan;Na, Suck-Joo
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.402-407
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    • 2002
  • Laminate tooling process is a fast and simple method to make metal tools directly for various molding processes such as injection molding in rapid prototyping field. Metal sheets are usually cut, stacked, aligned and joined with brazing or soldering. Through the joining process, all of the metal sheet layers should be rigidly joined. When joining process parameters are not appropriate, there would be defects in the layers. Among various types of defects, non-bonded gaps of the tool surface are of great importance, because they directly affect the surface quality and dimensional accuracy of the final products. If a laminate tool with defects has to be abandoned, it could lead to great loss of time and cost. Therefore a repair method for non-bonded gaps of the surface is essential and has important meaning for rapid prototyping. In this study, a rapid laminate tooling system composed of a CO2 laser, a furnace, and a milling machine was developed. Metal sheets were joined by furnace brazing, dip soldering and adhesive bonding. Joined laminate tools were machined by a high-speed milling machine to improve surface quality. Also, repair brazing and soldering methods of the laminates using the $CO_2$ laser system have been investigated. ill laser repair process, the beam duration, beam power and beam profile were of great importance, and their effects were simulated by [mite element methods. The simulation results were compared with the experimental ones, and optimal parameters for laser repair process were investigated.

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