• Title/Summary/Keyword: Laser Bonding

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Evaluation of Weld Defects in Stainless Steel 316L Pipe Using Guided Wave (스테인레스 316L강의 배관용접결함에 대한 유도초음파 특성 평가)

  • Lee, Jin-Kyung;Lee, Joon-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.35 no.1
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    • pp.46-51
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    • 2015
  • Stainless steel is a popular structural materials for liquid-hydrogen storage containers and piping components for transporting high-temperature fluids because of its superior material properties such as high strength and high corrosion resistance at elevated temperatures. In general, tungsten inert gas (TIG) arc welding is used for bonding stainless steel. However, it is often reported that the thermal fatigue cracks or initial defects in stainless steel after welding decreases the reliability of the material. The objective of this paper is to clarify the characteristics of ultrasonic guided wave propagation in relation to a change in the initial crack length in the welding zone of stainless steel. For this purpose, three specimens with different artificial defects of 5 mm, 10 mm, and 20 mm in stainless steel welds were prepared. By considering the thickness of s stainless steel pipe, special attention was given to both the L(0,1) mode and L(0,2) mode in this study. It was clearly found that the L(0,2) mode was more sensitive to defects than the L(0,1) mode. Based on the results of the L(0,1) and L(0,2) mode analyses, the magnitude ratio of the two modes was more effective than studying each mode when evaluating defects near the welded zone of stainless steel because of its linear relationship with the length of the artificial defect.

Fabrication and loss measurement of $P_2O_5-SiO_2$ optical waveguides on Si (Si을 기판으로한 $P_2O_5-SiO_2$ 광도파로의 제작 및 손실측정)

  • 이형종;임기건;정창섭;정환재;김진승
    • Korean Journal of Optics and Photonics
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    • v.3 no.4
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    • pp.258-265
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    • 1992
  • A low loss optical waveguide of $P_{2}O_{5}-SiO_{2}$on Si substrate is produced by using the chemical vapour deposition method of $SiO_2$ thin films used in Si technology. Propagation loss of the waveguide layer was 1.65 dB/cm as produced and reduced down to 0.1 dB/cm after heat treatment at $1100^{\circ}C$. By using laser lithography and reactive ion etching method $P_{2}O_{5}-SiO_{2}$ waveguide was produced and subsequently annealed at $1100^{\circ}C$.As a result of this annealing the shape of the waveguide core was changed from rectangular to semi-circular form, and the propagation loss was reduced as down to 0.03 dB/cm at 0.6328$\mu$m and 0.04dB/cm at 1.53$\mu$m. We think that the mechanism of the reduction in propagation loss during the heat treatment is the following: 1) The hydrogen bonding in waveguide layer, which causes absorption loss, is dissociated and diffused out. 2) The roughness of the interface and the micro-structure of the waveguide layer is removed. 3) The irregularities in the cross-sectional shape of the waveguide which was induced during the lithographic process were disappeared by flowing of the waveguide core.

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SEM AND CONFOCAL LASER SCANNING MICROSCOPIC STUDY ON THE CORROSION OF DENTAL RESTORATIVE RESINS (주사전자현미경과 공촛점 레이저 주사현미경을 이용한 치과용 수복레진의 부식에 관한 연구)

  • Yang, Kuy-Ho;Park, Eun-Hae;Jeong, Byung-Cho
    • Journal of the korean academy of Pediatric Dentistry
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    • v.29 no.3
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    • pp.430-438
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    • 2002
  • The aim of this study was to evaluate the resistance to degradation of four commercial composite resins-Prodigy(Kerr, USA), Vitalescence(Ultradent, USA), Z 250(3M, USA), Filtek flow(3M, USA)- in an alkaline solution. Resistance to degradation was evaluated on the basis of following parameters: (a) mass loss(%), (b) Si loss(ppm), (c) degradation depth($\mu}m$). The results were as follows: 1. There was no significant difference between Prodigy and Vitalescence, also Z 250 and Filtek flow. But, there was significant difference between former group and latter group. 2. The sequence of the degree of degradation layer depth was in descending order by Z 250, Filtek flow, Prodigy, Vitalescence. There was significant difference among the materials. 3. The sequence of the Si loss was in descending order by Filtek flow, Z 250, Prodigy, Vitalescence. There was significant difference among the materials. 4. The correlation coefficient between mass loss and degradation layer depth(r=0.714, p<0.05), mass loss and Si loss(r=0.770, p<0.05), and degradation layer depth and Si loss(r=0.930, p<0.05) were relatively high. 5. When observed with SEM, destruction of bonding was observed between resin matrix and filler. 6. When observed with CLSM, degradation layer depth of composite resin surface was observed.

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A Comparison Analysis on the Efficiency of Solar Cells of Shingled Structure with Various ECA Materials (다양한 ECA 소재를 활용한 shingled 구조의 태양전지 효율 비교 분석)

  • Jang, Jae Joon;Park, Jeong Eun;Kim, Dong Sik;Choi, Won Seok;Lim, Donggun
    • Journal of the Korean Solar Energy Society
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    • v.39 no.4
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    • pp.1-9
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    • 2019
  • Modules using 6 inch cells have problems with loss due to empty space between cells. To solve this problem made by shingled structure which can generate more power by utilizing empty space by increasing the voltage level than modules made in 6inch cell. Thus, in this paper, the c-Si cutting cells were produced using nanosecond green laser, and then the ECA was sprayed and cured to perform cutting cell bonding. Three types of ECA materials (B1, B2, B3) with Ag as the main component were used, and experimental conditions varied from 5 to 120 seconds of curing time, 130 to $210^{\circ}C$ of curing temperature, and 1 to 3 of curing numbers. As a results of experiments varying curing time, B1 showed efficiency 19.88% in condition of 60 seconds, B2 showed efficiency 20.15% in 90 seconds, and B3 showed efficiency 20.27% in 60 seconds. In addition, experiments with varying curing temperature, It was confirmed highest efficiency that 20.04% in condition of $170^{\circ}C$ with B1, 20.15% in condition of $150^{\circ}C$ with B2, 20.27% in condition of $150^{\circ}C$ with B3. These are because the Ag particles are densely formed on the surface to make the conduction path. After optimizing the conditions of temperature and curing time, the secondary-tertiary curing experiments were carried out. as the structural analysis, conditions of secondary-tertiary curing showed cracks that due to damp heat aging. As a result, it was found that the ECA B3 had the highest efficiency of 20.27% in condition of 60 seconds of curing time, $150^{\circ}C$ of curing temperature, and single number of curing, and that it was suitable for the manufacture of Solar cell of shingled structure rather than ECA B1 and B2 materials.

Bonding efficacy of cured or uncured dentin adhesives in indirect resin (간접 레진수복시 상아질 접착제의 중합 여부에 따른 결합 효능)

  • Jang, Ji-Hyun;Lee, Bin-Na;Chang, Hoon-Sang;Hwang, Yun-Chan;Oh, Won-Mann;Hwang, In-Nam
    • Restorative Dentistry and Endodontics
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    • v.36 no.6
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    • pp.490-497
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    • 2011
  • Objectives: This study examined the effect of the uncured dentin adhesives on the bond interface between the resin inlay and dentin. Materials and Methods: Dentin surface was exposed in 24 extracted human molars and the teeth were assigned to indirect and direct resin restoration group. For indirect resin groups, exposed dentin surfaces were temporized with provisional resin. The provisional restoration was removed after 1 wk and the teeth were divided further into 4 groups which used dentin adhesives (OptiBond FL, Kerr; One-Step, Bisco) with or without light-curing, respectively (Group OB-C, OB-NC, OS-C and OS-NC). Pre-fabricated resin blocks were cemented on the entire surfaces with resin cement. For the direct resin restoration groups, the dentin surfaces were treated with dentin adhesives (Group OB-D and OS-D), followed by restoring composite resin. After 24 hr, the teeth were assigned to microtensile bond strength (${\mu}TBS$) and confocal laser scanning microscopy (CLSM), respectively. Results: The indirect resin restoration groups showed a lower ${\mu}TBS$ than the direct resin restoration groups. The ${\mu}TBS$ values of the light cured dentin adhesive groups were higher than those of the uncured dentin adhesive groups (p < 0.05). CLSM analysis of the light cured dentin adhesive groups revealed definite and homogenous hybrid layers. However, the uncured dentin adhesive groups showed uncertain or even no hybrid layer. Conclusions: Light-curing of the dentin adhesive prior to the application of the cementing material in luting a resin inlay to dentin resulted in definite, homogenous hybrid layer formation, which may improve the bond strength.