• Title/Summary/Keyword: Lamination process

Search Result 168, Processing Time 0.025 seconds

Development of the Freeform Master I - a desktop RP machine based on a new sheet lamination process (정전기 방식을 이용한 박판 적층형 쾌속조형기술에 관한 연구)

  • 박정욱;이관행
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2000.05a
    • /
    • pp.767-770
    • /
    • 2000
  • A novel process is newly developed for building RP(Rapid Prototyping) parts using a sheet lamination technique. The build process of existing sheet lamination type RP machines consists of the following steps : feeding, lamination and cutting. In this process, the laminated part of an object is often scratched by a cutter or damaged by a laser beam due to the cutting operation preceded by lamination, In addition, decubing of the unused portion from the laminated block is difficult. In the new process, cutting operation is performed before lamination. The cutting operation takes place while a paper sheet is firmly attached on the plate using electrostatic force. Then liquid glue is applied to the calculated region of the given contour for lamination. The process aims to manufacture a $2k RP machine, what we call the Freeform Mater I, that can use A4 or latter-size used papers. A prototype machine that demonstrates the design concept is built and further research issues are discussed.

  • PDF

Finite element Analysis for the Lamination Process of a Motor Core using Progressive Dies (순차이송 금형을 사용한 모터코어 적층과정의 유한요소해석)

  • Park, K.;Lee, I.S.;Jang, K.J.;Choi, S.R.
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 2000.04a
    • /
    • pp.618-623
    • /
    • 2000
  • In order to increase the porductivity of electrical parts, manufacturing processes using progressive dies have been widely used in the industry. Motor cores have been fabricated using progressive stacking die with the lamination procedure for better electro-magnetic property. for the proper design of a process, a prediction of the process is required to obtain many design parameters. In this work, rigid-plastic finite element analysis is carried out in order to simulate the lamination this work, rigid-plastic finite element analysis is carried out in order to simulate the lamination process of the motor core. The effects of the embossing depth and the amount of deviation are investigated and compared with experiments. The forming process can then be predicted successfully from the results of analyses, which enables to design appropriately the die and the process.

  • PDF

Development of Algorithms for Accuracy Improvement in Transfer-Type Variable Lamination Manufacturing Process using Expandable Polystrene Foam (VLM-ST공정의 정밀도 향상을 위한 알고리즘 개발)

  • 최홍석;이상호;안동규;양동열;박두섭;채희창
    • Korean Journal of Computational Design and Engineering
    • /
    • v.8 no.4
    • /
    • pp.212-221
    • /
    • 2003
  • In order to reduce the lead-time and cost, the technology of rapid prototyping (RP) has been widely used. A new rapid prototyping process, transfer-type variable lamination manufacturing process by using expandable polystyrene foam (VLM-ST), has been developed to reduce building time, apparatus cost and additional post-processing. At the same time, VLM Slicer, the CAD/CAM software for VLM-ST has been developed. In this study, algorithms for accuracy improvement of VLM-ST, which include offset and overrun of a cutting path and generation of a reference shape are developed. Offset algorithm improves cutting accuracy, overrun algorithm enables the VLM-ST process to make a shape of sharp edge and reference shape generation algorithm adds additional shape which makes off-line lamination easier. In addition, proposed algorithms are applied to practical CAD models for verification.

A Study on Lamination Property of Superconducting Coated Conductor

  • Kim, T.H.;Oh, S.S.;Ha, D.W.;Kim, H.S.;Ko, R.K.;Song, K.J.;Ha, H.S.;Yang, J.S.;Park, Y.M.;Oh, J.K.;Jung, K.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2005.11a
    • /
    • pp.161-162
    • /
    • 2005
  • 2G HTS coated conductor wire consists of textured substrate, buffer layer, superconduct layer, Ag cap layer, stabilizer. For practical application filed, coated conductor have mechanical and electrical stability and environment protection properties. This property Cu and stainless steel strip is laminated to Ag cap layer as stabilizer materials. Lamination process join stabilizer material strip and Ag cap layer with soldering method. we have laminated HTS with continuous dipping soldering process different stabilizer Cu and stainless steel strip and changed lamination process condition. The effect of lamination stabilizer and process condition has been investigated mechanical and electrical properties.

  • PDF

Surface Hydrophilization of PVDF Membrane by Thermal Polymerization Lamination Process (열중합 Lamination 공정에 의한 PVDF 분리막의 표면 친수화)

  • Lee, Se-Min;Byun, Young-Jin;Kim, Jin-Ho;Kim, Sung Soo
    • Membrane Journal
    • /
    • v.23 no.3
    • /
    • pp.220-225
    • /
    • 2013
  • Hydrophilic monomers were polymerized for lamination on polyvinylidene fluoride (PVDF) membrane surface for hydrophilization of the membranes. Hydrophilization reduced the contact angle from $95^{\circ}$ to $55^{\circ}$ and enhanced the water flux by 10 times while it reduced the bovine serum albumin (BSA) adsorption amount to 1/4 level. Thermal polymerization process was optimized by examining several operation parameters. Dimethyl oxobuthyl acrylamide (DOAA) showed the best effect due to its better hydrophilicity than others. Increase of amount of monomer enhanced the performance until the optimum concentration of 30 wt%, beyond which excess amount of monomer resulted in homopolymerization to deteriorate the performance. Azobis (isobutyronitrile)(AIBN) initiator has greater activation temperature range than benzoyl peroxide (BPO) and it showed better hydrophilation performance. Two stage lamination process, application of initiator followed by monomer addition, was more effective than one stage process, addition of initiator and monomer at once, which still reduced the contact angle but also reduced the water flux by pore blocking phenomena.

Lamination of LTCC Sheet Using Binder Film (Binder Film을 이용한 LTCC Sheet 적층)

  • Shin, Hyo-Soon;Choi, Yong-Seok;Park, Eun-Tae
    • Journal of the Korean Ceramic Society
    • /
    • v.43 no.4 s.287
    • /
    • pp.253-258
    • /
    • 2006
  • In the lamination process of multi-layer ceramic modules, the occurrence of delamination comes into repeatedly. To completely improve the lamination process of LTCC sheets, a binder film was introduced between the layers. The binder film did not originate the delamination until the thickness under $40{\mu}m$. After lamination, the thickness of the binder film was determined by the infilteraion of binder by the pressure, and after the bake-out, was dependent on the decomposition of binder resin. Any detectable defect was not observed in the multilayer structure with Ag inner electrodes.

Influence of laminating and sintering condition on permittivity and shrinkage during LTCC process (LTCC 공정 중 적층 및 소결이 유전율과 회로 형상에 미치는 영향)

  • Jeong, M.S.;Hwang, S.H.;Chung, H.W.;Rhim, H.S.;Oh, S.I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2007.05a
    • /
    • pp.67-70
    • /
    • 2007
  • LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.

  • PDF

A Study on the Element Technology for PV Module Manufacturing (태양전지모듈 제조를 위한 요소기술연구)

  • Kang, Gi-Hwan;Yu, Gwon-Jong;Park, Kyung-Un;Ahn, Hyung-Keun;Han, Deuk-Young
    • Proceedings of the KIEE Conference
    • /
    • 2003.07b
    • /
    • pp.1365-1367
    • /
    • 2003
  • In this paper, element technologies such as soldering. arrangement and lamination processes for photovoltaic module manufacture were examined and described as main processes. Especially solder paste and temperature condition in soldering process, loss factor in arrangement process and process conditions in lamination process are investigated to minimize the electrical loss. As a results, temperature condition in soldering process was found to be critical to contact resistance of electrode and life-time. Productivity of the process decreases dramatically by physical damage during arrangement process. Pressure level and press condition of upper chamber in lamination process were important parameters for the reliability. According to the test result of photovoltaic module, electrical properties dropped about $5{\sim}25%$ after 5 years.

  • PDF

Enhanced Adhesion and Transmittance Uniformity in Laminated Polymer-Dispersed Liquid Crystal Films

  • Yoo, Seong-Hyeon;Park, Min-Kyu;Park, Ji-Sub;Kim, Hak-Rin
    • Journal of the Optical Society of Korea
    • /
    • v.18 no.6
    • /
    • pp.753-761
    • /
    • 2014
  • We propose a two-step UV irradiation procedure to fabricate polymer-dispersed liquid crystal (PDLC) films by lamination. During the first UV treatment, before lamination, the UV-curable monomers coated on one film substrate are solidified through photo-polymerization as the phase separation between the liquid crystals and the monomers. Introducing an adhesion-enhancement layer on the other plastic substrate and controlling the UV irradiation conditions ensure that UV-induced cross-linkable functional groups remain on the surfaces of the photo-polymerized layers. Thereby, the adhesion stability between the top and bottom films is much improved during a second (post-lamination) UV treatment by further UV-induced cross-linking at the interface. Because the adhesion-enhancement and PDLC layers prepared by the bar-coating process are solidified before lamination, the PDLC droplet distribution and the cell gap between the two plastic substrates remain uniform under the lamination pressure. This ensures that the voltage-controlled light transmittance is uniform across the entire sample.