• Journal of the Korean Ceramic Society
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• v.36 no.12
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• pp.1303-1309
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.72-72
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• 1998

• Journal of the Korean Ceramic Society
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• v.36 no.9
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• pp.901-908
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• 1999

Effects of LPMOCVD process parameters on the properties of TiO2 thin film were investigated. Depositions were made in the range of temperature 300-67$0^{\circ}C$ with various TTIP(Titanium Tetraisopropoxide) concentrations by contrlling bubbler temperature(40-8$0^{\circ}C$) and/or flow rate(30-90 sccm). Post annealing treatments were carried out at 500-80$0^{\circ}C$ range in the air. Films deposited at 40$0^{\circ}C$ have denser morphology than those of films deposited at 50$0^{\circ}C$ and $600^{\circ}C$ due to slower deposition rate. Bubbler temperature can affect on the deposition rate in mass transfer controlled regime such as 50$0^{\circ}C$ or higher but not below 50$0^{\circ}C$ where surface reaction rate becomes important. On the contrary for films deposited above 50$0^{\circ}C$ flow rate can raise deposition rate but eventually saturate it at the 50 sccm and above due to retarded adhesion of decomposed species. But for films deposited at 40$0^{\circ}C$ deposition rate increases stadily with flow rate. As the film becomes more porous A(200) texture can not be developed and AnataselongrightarrowRutile transition kinetics increases.

• Applied Chemistry for Engineering
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• v.10 no.2
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• pp.225-230
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• 1999

Low pressure metal organic chemical vapor deposition (LPMOCVD) of $Li_2O$ solid thin films from Li(DPM) in nitrogen-oxygen or argon-oxygen atmosphere was experimentally investigated by using a small hot wall tubular type reactor. XRD and ESCA analysis revealed that $Li_2CO_3$ film grew in nitrogen-oxygen atmosphere and $Li_2O$ grew in argon-oxygen atmosphere. The grown lithium oxide or carbonate reacted with silicon or silica base materials to produce silicates. The CVD model analysis by means of the well-known micro trench method and Monte Carlo simulation was not fully successful, but a set of data on gas phase reaction rate constant and surface reaction constant was obtained.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.06a
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• pp.81-81
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• 1996

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.11a
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• pp.89-89
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• 1993

• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.985-989
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• 1999

Silica($SiO_2$) thin film was synthesized by a low pressure metal organic chemical vapor deposition(LPMOCVD) using organic silane compound. Triethyl orthosilicate was used as a source material. Operation pressure was 1~100 torr at outlet of the reactor and deposition temperature was $600{\sim}900^{\circ}C$. The experimental results showed that the high reaction temperature and high source gas concentration led to higher growth rate of $SiO_2$. The step coverage of films on micro-scale trenches was fairly good, which resulted from the phenomena that the condensed oligomers flow into the trenches. We estimated a reaction path that the source gas polymerizes and produces oligomers (dimer, trimer, tetramer, etc.), which diffuse and condense on the solid surface. The chemical species in the gas phase at the outlet of reactor tube were analyzed by quadrapole mass spectrometer. The peaks, assigned to be monomer, dimer of source gas and geavier molecules, were observed at 650 or $700^{\circ}C$. At higher temperature($900^{\circ}C$), the peaks of the heavy molecules disappeared, because almost all the source gas and intermediate(polymerized oligomer) molecules were oxidized or condensed on colder tube wall.