• 한국정보전자통신기술학회논문지
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• 제10권6호
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• pp.506-511
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• 2017

많은 기업들이 사업화를 추진하고 있는 LED 조명은 대표적인 녹색에너지 기술로 현재 우수한 제품들이 비교적 많이 공급되고 있다. 그러나 방송영상용 LED조명은 일반 가로등, 광고용 또는 운송기구용 LED조명 장치들에 비해 출력이 높으면서 휴대가 간편해야한다. 따라서 방송영상 촬영 시 크기가 크고 취급 또한 불편한 할로겐등과 형광등의 대체광원으로 LED를 사용한다면 장비의 경량화를 통하여 방송영상조명 장비산업의 활성화가 될 것으로 예측된다. LED 모듈 보드는 양산성과 칩 마운터의 SMT 생산 가능 사이즈를 고려한 후 모델별 제품의 전체적인 사이즈를 고려하여 보드 사이즈를 결정하였다. 본 논문에서는 80W 보드를 제작해기위해 20W LED보드 4장을 세로로 배치하였다. 즉 모델별 LED 모듈 보드 사이즈를 공용화하여 120W, 200W의 고출력 LED 조명장비를 보드 수의 증가로 선택할 수 있다.

• 한국생산제조학회지
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• 제26권4호
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• pp.371-377
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• 2017

In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

• 펄프종이기술
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• 제30권1호
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• pp.29-43
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• 1998

This study was to investigate the effect of .compressive load and cyclic humidity(2$0^{\circ}C$, 65% and 90% RH) on the physical and mechanical properties of corrugated board. Corrugated boards in the study were under compressive load and under cyclic humidity, and their properties were compared to those without load. Results were summarized as follows ; 1 Statistically significant correlation was shown between the ring crush of the boards and the compressive strength of cylinder specimen made from the boards. So we could study the compressive behavior of board with cylinder specimen. 2. The boards under the compressive load increased their moisture content and thickness much more than those without load both in constant and in cyclic RH. 3. The compressive and tensile strength of board samples were inversely and closely proportional to the sheet moisture content regardless of their load and humidity history. 4. The moisture content did not show any significant proportionality to the change of burst strength of boards within this experiment. 5. Board reconditioning in standard condition led to the recovery of the strength loss that had occurred under various load and humidity condition. 6. The handsheets prepared from the boards that had experienced compressive load and cyclic humidity, and those with no-load and 65% RH did not show any significant difference in strength properties. No physical damage or load-carrying properties of the wood fiber were observed by the compressive load and cyclic humidity history.

• 공업화학
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• 제30권3호
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• pp.371-378
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• 2019

그래핀나노플레이트렛(GnP)이 목재기반 복합보드의 열적 및 난연 특성에 미치는 영향을 조사하기 위하여, 5, 10, 및 20 wt% 등 여러 가지 GnP 함량으로 GnP/재활용 페놀폼(re-PF)/목재 복합보드를 제조하였다. 제조된 복합보드의 열적특성 및 난연성은 열중량분석(TGA) 및 한계산소지수(LOI) 시험을 통하여 각각 분석되었다. 복합보드의 열안정성은 GnP 첨가량에 따라 비례하게 증가하였고, 이 복합보드의 탄화수율(char yield)은 순수 목재보드 대비 최대 22%까지 증가하였다. 복합보드의 LOI 값은 순수 목재보드보다 약 4.8~7.8% 높았다. 또한, 재활용 페놀폼 및 GnP 첨가로 인하여 복합보드의 난연성이 크게 향상되었음을 확인하였다. 이는 열안정성이 높은 재활용 페놀폼과 GnP가 복합보드의 열분해 개시 온도를 지연시키고, 탄화층(char layer)을 보다 조밀하고 두껍게 형성하였기 때문에, 복합보드의 연소 지연효과를 이끌었다. 특히 탄소기반 재료로서 GnP는 탄화층의 형성을 용이하게 하고, 탄화수율을 현저히 증가시켜 재활용 페놀폼에 비하여 난연성에 높은 효과를 나타내었다.

• 전기학회논문지
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• 제65권11호
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• pp.1931-1936
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• 2016

In this paper, we analyzed causes of accidents that recently increased in the illegal and defective LED lamps. They were analyzed by the electrical characteristics calculation and reappearance experiments. The causes of the accidents were analyzed from the circuit affected by the variation of voltage, current and power by harmonics. We drew a conclusion for electrical safety in illegal or degraded LED lamps from the analysis result. The management factors for electrical safety in LED lamps were harmonics, reactive power and power factor. It is possible to secure the electrical safety through monitoring of power factor in failure products and available in smart meters or smart distribution boards.

• 한국정밀공학회지
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• 제27권7호
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• pp.63-70
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• 2010

We developed a new punching system that generates pinholes expressing texts or images on a plastic plate. The pin-holed plate is used as a new glamorous display board reflecting colorful lights from the light emitting diode (LED) installed on the edge side of the plate. The four degree-of-freedom punching system was designed to make same multiple holes on four plastic plates simultaneously. For this motion, we designed a structure for a simultaneous motion of the system. For even reflection of the lights from texts or images on the board and fast production of the pin-holed boards, fast motion including precise position control is very important. We also built a PC-based integrated control system including a GUI program to help users easily design luminous texts or images on the plastic plate. Also, we conducted a performance test of the system to verify the punching speed and position control of the pin holes on the plate.

• Wind and Structures
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• 제21권2호
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• pp.223-239
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• 2015

Open decks are a widely used deck configuration in long-span cable-stayed bridges; however, incorporating aerodynamic countermeasures are advisable to achieve better aerodynamic performance than a bluff body deck alone. A sectional model of an open deck cable-stayed bridge with a main span of 400 m was selected to conduct a series of wind tunnel tests. The influences of five practical aerodynamic countermeasures on flutter and vortex-induced vibration (VIV) performance were investigated and are presented in this paper. The results show that an aerodynamic shape selection procedure can be used to evaluate the flutter stability of decks with respect to different terrain types and structural parameters. In addition, the VIV performance of $\prod$-shaped girders for driving comfortableness and safety requirements were evaluated. Among these aerodynamic countermeasures, apron boards and wind fairings can improve the aerodynamic performance to some extent, while horizontal guide plates with 5% of the total deck width show a significant influence on the flutter stability and VIV. A wind fairing with an angle of $55^{\circ}C$ showed the best overall control effect but led to more lock-in regions of VIV. The combination of vertical stabilisers and airflow-depressing boards was found to be superior to other countermeasures and effectively boosted aerodynamic performance; specifically, vertical stabilisers significantly contribute to improving flutter stability and suppressing vertical VIV, while airflow-depressing boards are helpful in reducing torsional VIV.

• 대한전자공학회논문지SD
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• 제49권7호
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• pp.1-9
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• 2012

기존의 LED 패키지가 갖는 온도에 따른 광 특성 변화 문제를 해결하기 위하여 온도센서가 집적된 LED 패키지 시스템을 제안하였다. 패키지의 온도를 실시간으로 측정하기 위하여 정확도가 우수하며 온도에 따른 저항의 변화가 선형적인 특징을 갖는 온도센서(RTD 형)를 설계하였으며, 장기간의 안정성을 보장하기 위하여 안정된 박막의 증착조건을 결정하고 이를 바탕으로 $1.560{\Omega}/^{\circ}C$의 민감도를 갖는 온도센서를 패키지 내부에 제작하였다. 제작된 패키지를 이용하여 온도에 무관하게 일정한 광량을 나타내는 시스템의 구현을 위하여 변환 회로부와 제어 회로부를 제작하고 이들을 결합함으로써, 패키지의 온도 변화에 따라 PWM duty ratio의 변화를 통해 광 출력을 보상해 주는 시스템을 제안하고 제작하였다. LED의 동작온도인 $0^{\circ}C$에서 $140^{\circ}C$ 범위에서 PWM duty ratio를 관측한 결과 제안했던 일정한 광량을 위한 PWM duty ratio에 매우 근접한 출력 신호를 발생시키는 것을 확인할 수 있었다.

• Journal of Advanced Marine Engineering and Technology
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• 제34권5호
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• pp.711-717
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• 2010

본 논문에서는 플라스틱 평판에 핀 홀을 생성하여 문자나 이미지를 표현하는 디스플레이 보드를 자동으로 제작하는 펀칭시스템을 개발하였다. 핀 홀을 생성한 평판은 가장자리에 설치한 다양한 색상의 발광다이오드 빛을 반사하여 미려한 디스플레이 보드에 사용된다. 펀칭시스템은 정밀한 위치 및 깊이 생성을 위해 총 4개의 엑추에이터를 사용하였다. 디스플레이 보드 상의 글자나 이미지의 반사효과와 빠른 생산성을 위하여 정밀한 구동 기구부를 개발하고 PID 제어 알고리즘을 적용하였다. 그리고 사용자가 반사되는 글자의 모양이나 이미지를 구성하는데 도움을 줄 수 있는 GUI 프로그램과 PC기반의 제어시스템을 구성하였다. 또한 펀칭속도와 생성된 핀 홀의 깊이를 검사하여 본 시스템의 성능을 검증하였다.

• Korean Chemical Engineering Research
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• 제54권1호
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.