• Transactions of the Korean Society of Mechanical Engineers B
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• v.39 no.4
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• pp.343-350
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• 2015

The natural convection heatsink is the most commonly used cooling device, especially for high-power LED lights, because of its reliability and low long-term cost. High power LED lights are generally used in an inclined configuration for street lamps and security lamps. However, it was difficult to estimate the thermal performance of an inclined heatsink, because the results from previous studies are not applicable to the inclined configuration. In this study, we measured the thermal performance of an inclined cylindrical heatsink with plate fins. Various fin numbers, fin heights, base temperatures, and inclination angles ($30^{\circ}$ and $60^{\circ}$) were examined. Based on the experimental results, the Nusselt number correlation is presented. This correlation is applicable when the Rayleigh number, ratio of the fin height to cylinder diameter, and fin number are in the ranges 100,000-600,000, 1/6-1/2, and 9-72, respectively.

• Korean Journal of Optics and Photonics
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• v.26 no.4
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• pp.226-232
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• 2015

A double-layer LED array together with an illumination optical system is proposed as a possible light source for LC projection display systems for large screens, up to $8m{\times}6m$ (400 inches diagonal). The heat dissipation problem of the LED array is solved by arranging the LEDs in double layers, and thermal analysis shows its effectiveness. The light from the LEDs in the back layer can be transmitted through the front layer without significant loss by arranging the LEDs in non-overlapping positions in the two layers and inserting suitable microlenses between the two layers and holes in the first layer. Together with the double-layer LEDs, an illumination optical system is designed to illuminate liquid crystal panels with good uniformity and appropriate matching with the projection optics.

• Transactions of Materials Processing
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• v.20 no.7
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• pp.473-478
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• 2011

In this study, the performance of a thermo siphon type radiator made of copper for LED lighting system was evaluated by using an inverse heat transfer method. Heating experiments and finite element heat transfer analysis were conducted for three different cases. The data obtained from experiments were compared with the analysis results. Based on the data obtained from experiments, the inverse heat transfer method was used in order to evaluate the heat transfer coefficient. First, the heat transfer analysis was conducted for non-vacuum state, without the refrigerant. The evaluated heat transfer coefficient on the radiator surface was 40W/$m^2^{\circ}C$. Second, the heat transfer analysis was conducted for non-vacuum state, with the refrigerant, resulting in the heat transfer coefficient of 95W/$m^2^{\circ}C$. Third, the heat transfer analysis was conducted for vacuum state, with refrigerant. For the third case, the evaluated heat transfer coefficients were 140W/$m^2^{\circ}C$. Third, the heat transfer analysis was conducted for vacuum state, with refrigerant. For the third case, the evaluated heat transfer coefficients were 140W/$m^2^{\circ}C$ for the radiator body, 5W/$m^2^{\circ}C$. Third, the heat transfer analysis was conducted for vacuum state, with refrigerant for the rising position of radiator pipe, 35W/$m^2^{\circ}C$. Third, the heat transfer analysis was conducted for vacuum state, with refrigerant. For the highest position of radiator pipe, and 120W/$m^2^{\circ}C$ for the downturn position of radiator pipe. As a result of inverse heat transfer analysis, it was confirmed that the thermal performance of the current radiator was best in the case of the vacuum state using the refrigerant.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.125-130
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• 2016

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.8
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• pp.994-1000
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• 2011

In this study, the piezoelectric fan cooling system is investigated. In order to find the proper geometry and configuration, the numerical model for the flow field and heat transfer investigation is used. A simplified nonlinear deformation model is employed for transient solutions of a piezoelectric fan with the dynamic mesh and user defined function capability. The results show that the cooling is most effective when the length of a piezoelectric fan is 5 cm and the cooling plate is 3 cm. The results can be used to develop a new design method of heat sink for piezoelectric fans.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.3
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• pp.427-431
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• 2020

In this Study, as the structure of IT module for smart phone display becomes thin to catch up with slim product trend, the reliability of display module is on the rise as a issue for product design. Especially, almost part of cellular phone should undergo thermal dissipation test. thus many manufacturers have considered design guide line using CAE and simulation for more effective usage of limited resources on the market. This test simulates the case when cellular phone slips through user's fingers while he is talking on the phone. This paper studies a thermal simulation of display module in smart phone. This design for reliability improvements are suggested on the basis of the results of FVM Analysis and display of IT module and smart phone design.

• Journal of the Korean institute of surface engineering
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• v.48 no.2
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• pp.33-37
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• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.2
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• Journal of the Korean institute of surface engineering
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• v.49 no.2
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• pp.218-224
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• 2016

Thermal radiation pastes were prepared by dispersing carbon materials as fillers with a content of 1 weight percent in an acrylic resin. The kind of fillers was as follows; $25{\mu}m$ graphite, $45{\mu}m$ graphite, $15{\mu}m$ carbon nanotube(CNT), a 1:1 mixture of $25{\mu}m$ graphite and $15{\mu}m$ CNT, and a 1:1 mixture of $45{\mu}m$ graphite and $15{\mu}m$ CNT. Thermal emissivity was measured as 0.890 for the samples with graphite only, 0.893 for that with CNT only, and 0.892 for those containing both. After coating prepared pastes on a side of 0.4 mm thick aluminium plate and placing the plate over an opening of a box maintained at $92^{\circ}C$ with the coated side out, the temperatures on the uncoated side of the plates were measured. The samples containing graphite and CNT showed the lowest temperatures. The paste with mixed fillers was coated on the back side of the PCB of an LED module and thermal analysis was carried out using Thermal Transient Tester (T3ster) in a still air box. The thermal resistance of the module with coated PCB was measured as 14.34 K/W whereas that with uncoated PCB was 15.02 K/W. The structure function analysis of T3ster data revealed that the difference between junction and ambient temperatures was $13.8^{\circ}C$ for the coated case and $18.0^{\circ}C$ for the uncoated. From the infrared images of heated LED modules, the hottest-spot temperature of the module with coated PCB was lower than that of the uncoated one for a given period of LED operation.

• Journal of the Korean institute of surface engineering
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• v.46 no.5
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• pp.208-215
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• 2013

The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux($W/m^2$) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.