• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 디스플레이 광소자분야
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• pp.169-172
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• 2003

기존의 Monitor 대응 LCD 에서 TV 대응 LCD로의 개발에 있어서 특성 개선은 다각도로 진행되고 있으나, 무엇보다도 휘도 특성의 개선이 요구된다. TV 대응 LCD Panel 은 Monitor 대응 제품에 비해서 일반적으로 해상도가 낮으므로, 투과율면에서 장점은 있으나, 현재의 B/L 구조로는 만족할만한 성능을 낼 수 없는 상황이다. 고휘도 BL(Back Lignt)를 위해서 EEFL(External Electrode Fluorescent Lamp) 혹은 CCFL 의 복수 사용을 전제로 한 직하방식에 대한 개발 검토가 활발히 이루어지고 있으나, 직하방식에 의한 고휘도화는 램프수의 증가에 따른 인버터의 기구적, 전기적 사양의 증가를 필요로 하며, LCD Module전체의 두께가 증가되는 문제를 가지고 있다. 본 연구에서는 L-Shaped 램프를 적용하여 기본의 기구적인 사양 및 전기적인 사양을 유사하게 유지함과 동시에, 고휘도화를 실현하여 TV 대응 수준을 확보하였으며, lamp를 floating구동하여 램프편측 전압 500V를 사용하면서 655 nit의 휘도를 달성하였다.

• Design & Manufacturing
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• 제16권1호
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• pp.27-35
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• 2022

Thermoforming is a plastic manufacturing process that applies a force to stretch a film of heated thermoplastic material over an engineered mold to create a 3-dimensional shape. After forming, the shaped part can then be trimmed and finished to specification to meet an end-user's requirements. The process and thermoplastic materials are extremely versatile and can be utilized to manufacture parts for a very wide range of applications. In this study, based on K-BKZ nonlinear viscoelastic model, thermoforming process analysis was performed for an interior room-lamp. The predicted thickness was minimum at the corner of a molded film, and maximum at the center of the bottom. By using the Taguchi method of design of experiments, the effects of process conditions on residual stresses were investigated. The dominant factors were the liner thickness and the film heating time. As the thickness of the liner increased, the residual stress decreased. And it was found that the residual stress decreased significantly when the film heating temperature was higher than the glass transition temperature. A thermoforming mold and a trimming mold were manufactured, and the spring back was investigated through experiments. The dominant factors were film heating time, liner thickness, and lower mold temperature. As the film heating time and liner thickness increased, the spring back decreased. In addition, it was found that the spring back decreased as the lower mold temperature increased.