• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.8-14
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• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• Asian Journal of Turfgrass Science
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• v.1 no.1
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• pp.30-36
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• 1987

In order to promote the germination of Korean lawn grass(Zoysia japonica Steud.) seeds a gravimetric seed selection with a mixed chemical solution and the germination promotion with KOH treatment were studied and following results were obtained. 1. When immersed into methanol(S.G., 0.7) 14 percent of immature seeds were precipitated. 2. With water (S.G., 1.0) 36.5 percent of mature seeds were submerged. 3. On a mixture of carbon tetrachloride (S.G., 1.6) and ethylether (S.G., 0.7) in a ratio of 4:6 the seed selection was most effective. 4. When treated with KOH solution the germination rate was 71.01 percent in contrast to 6.0 percent of germination without the treatment. 5. As for concentration of KQH solution, 15 percent depressed the germination (46.7 %) whereas above 20 % the germination rate was gradually increased (79.32 %) up to 40 percent of concentration where the concentration started to depress germination ratio (77.32 %). 6. Finally, in connection with the duration of KOH treatment, a time lapse of up to 20 minutes depressed the germinating ratio(70.02 %) and 30 minutes to 45 minutes increased this ratio to 94.52 percent. 60 minutes of treatment depressed the germination to 75.62 percent.

• Korean Journal of Metals and Materials
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• v.47 no.11
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• pp.748-753
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• 2009

The surface morphology and the surface roughness of n-type SiC induced by wet-treatment using 45% KOH and buffered oxide etchant (BOE-1HF : $6H_2O$) were investigated by atomic force microscopy (AFM). While Si-face of SiC could be etched by alkali solutions such as KOH, acidic solutions such as BOE were hardly able to etch SiC. When the rough SiC samples were used, the surface roughness of etched sample was decreased after wet-treatment regardless of etchant, due to the planarization the of surface by widening of scratches formed by mechanical polishing. It was observed that the initial etching was affected by the energetically unstable sites, such as dangling bond and steps. However, when a relatively smooth sample was used, the surface roughness was rapidly increased after treatment at $180^{\circ}C$ for 1 hr and at room temperature for 4 hr by using KOH solution, resulting from the nano-sized structures such as pores and bumps. This indicates that porous SiC surface can be achieved by using purely chemical treatment.

• Journal of Environmental Science International
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• v.12 no.12
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• pp.1321-1327
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• 2003

Two different kinds of cases, with and without addition of noncrystalline silica to the Hadong kaolin were studied to obtain useful information on the synthesis of zeolite. The research was carried out to investigate the formation area and the crystalized degree of zeolite according to a synthetic time, the water content of raw material mixture, KOH concentration, and stirring intensity. In the case of without addition of noncrystalline silica to the Hadong kaolin and the low concentration range of KOH, the structure of the kaolin was not changed. However, when the mole ratio of K2O/SiO$_2$ in natural kaolin was increased, Linde-L zeolite and unknown structure of kaolins, U-1 and U-2 were produced. While in the high concentration range of KOH, the unknown structure of kaolins, U-6 and U-2, were produced and the production rate of U-6 was increased with the increased of K2O/SiO$_2$ mole ratio. In the case of with addition of noncrystalline silica to the Hadong kaolin and treatment with KOH hydrothermal processing, ZSM-5, ZSM-35, and Linde-L zeolites and the mixture of unknown structure of zeolites, U-1, U-2, U-3, and U-4, were obtained. Both cases demonstrated that the synthesis of zeolite from the Hadong kaolin was highly influenced by KOH concentration of raw material mixture.

• Food Science and Preservation
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• v.5 no.3
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• pp.247-255
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• 1998

This study was carried out to investigate changes in the flesh firmness, evolution of ethylene, cell wall components, and degradation and solubilization of polyuronide(PU) and polysaccharide(PS) in green(GP) and mature persimmon(MP) fruits according to testing time of ethylene(50${\mu}\ell$ㆍL$^{-1}$ ). When ethylene was treated in GP and MP, flesh firmness rapidly decreased and it was decreased more GP than MP. When ethylene were treated for 12 hours in GP, production of ethylene began after 3 days. The amount of ethylene product was maximum 16,000 ${\mu}\ell$ㆍL$^{-1}$ at 24 hours of ethylene treatment. However, ethylene was not producted until 7 days after 24 hours ethylene treatment at MP. The content of pectic substances decreased in the distilled- water, 0.05M $Na_2$CO$_3$,4M and 8M KOH-soluble fractions during softening according to increasing time of ethylene treatment. Arabinose and galactose were the major non-cellulosic neutral sugars in the 0.05M CDTA and 0.05M $Na_2$CO$_3$-soluble pectic fractions. Glucose, galactose and xylose were the major non-cellulosic neutral sugars in the 4M KOH- soluble hemicellulosic fraction. High molecular of PU and PS were degraded and solubilized in the distilled-water, 0.05M CDTA 0.05M $Na_2$CO$_3$ and 4M KOH-soluble fractions during time of ethylene treatment.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.321-321
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• 2014

GaN는 LED, 태양전지, 그리고 전자소자 등에 쓰이는 물질로, 관련 연구가 활발히 진행되고 있으며, 이와 더불어 top-down방식을 활용한 소자제작 방법 또한 발달되고 있다. 하지만, top-down공정 시 발생 되는 건식 식각에 의한 소자의 손상이 발생되고, 이로 인하여 누설전류가 발생하는 등 여러 가지 문제점이 발생하고 있다. 특히, top-down에서 널리 사용하는 건식식각을 통한 GaN 식각의 경우, nonpolar 면이 아닌, semipolar 면이 드러나게 되며, 이 면은 건식 식각시 발생하는 손상을 포함하고 있다. 본 연구에서는 이러한 문제를 해결하기 위해서, 약 $2{\mu}m$ 크기의 diameter를 갖는 micro-sized column LED를 제작하고, 건식 식각 이후, KOH surface treatment를 통해 손상된 면을 제거함과 동시에 nonpolar면을 드러내는 실험을 실시하였으며, 더불어 column의 diameter를 줄이는 방법을 논하고자 한다.

• Carbon letters
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• v.19
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• pp.99-103
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• 2016

Porous carbons have attracted much attention for their novel application in gas storage. In this study, porous graphite nano-fiber (PGNFs)-based graphite nano fibers (GNFs) were prepared by KOH activation to act as adsorbents. The GNFs were activated with KOH by changing the GNF/KOH weight ratio from 0 through 5 at 900℃. The effects of the GNF/KOH weight ratios on the pore structures were also addressed with scanning electron microscope and N₂ adsorption/desorption measurements. We found that the activated GNFs exhibited a gradual increase of CO₂ adsorption capacity at CK-3 and then decreased to CK-5, as determined by CO₂ adsorption isotherms. CK-3 had the narrowest micropore size distribution (0.6–0.78 nm) among the treated GNFs. Therefore, KOH activation was not only a significant method for developing a suitable pore-size distribution for gas adsorption, but also increased CO₂ adsorption capacity as well. The study indicated that the sample prepared with a weight ratio of ‘3’ showed the best CO₂ adsorption capacity (70.8 mg/g) as determined by CO₂ adsorption isotherms at 298 K and 1 bar.

• Journal of the Korean institute of surface engineering
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• v.49 no.2
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• pp.119-124
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• 2016

Plasma electrolytic oxidation (PEO) is a promising coating process to produce ceramic oxide on valve metals such as Al, Mg and Ti. The PEO coating is carried out with a dilute alkaline electrolyte solution using a similar technique to conventional anodizing. The coating process involves multiple process parameters which can influence the surface properties of the resultant coating, including power mode, electrolyte solution, substrate, and process time. In this study, ceramic oxide coatings were prepared on commercial Al alloy in electrolytes with different KOH concentrations (0.5 ~ 4 g/L) by plasma electrolytic oxidation. Microstructural and electrochemical characterization were conducted to investigate the effects of electrolyte concentration on the microstructure and electrochemical characteristics of PEO coating. It was revealed that KOH concentration exert a great influence not only on voltage-time responses during PEO process but also on surface morphology of the coating. In the voltage-time response, the dielectric breakdown voltage tended to decrease with increasing KOH concentration, possibly due to difference in solution conductivity. The surface morphology was pancake-like with lower KOH concentration, while a mixed form of reticulate and pancake structures was observed for higher KOH concentration. The KOH concentration was found to have little effect on the electrochemical characteristics of coating, although PEO treatment improved the corrosion resistance of the substrate material significantly.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.75-81
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• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Bulletin of the Korean Chemical Society
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• v.28 no.2
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• pp.188-192
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• 2007

In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.